• Title/Summary/Keyword: Silicon nitride ceramics

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A Study on Laser Assisted Machining for Silicon Nitride Ceramics (II) - Surface Characteristics of LAM Machined SSN and HIPSN - (질화규소 세라믹의 레이저 예열선삭에 관한 연구 (II) - 예열선삭된 SSN 및 HIPSN 질화규소 세라믹의 표면특성 -)

  • Kim, Jong-Do;Lee, Su-Jin;Kang, Tae-Young;Suh, Jeong;Lee, Jae-Hoon
    • Journal of Welding and Joining
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    • v.28 no.5
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    • pp.80-85
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    • 2010
  • This study focused on laser assisted machining (LAM) of silicon nitride ceramic that efficiently removes the material through machining of the softened zone by local heating. The effects of laser-assisted machining parameters were studied for cost reduction, and active application in processing of silicon nitride ceramics in this study. Laser assisted machining of silicon nitride allows effective cutting using CBN tool by local heating of the cutting part to the softening temperature of YSiAlON using by the laser beam. When silicon nitride is sufficiently preheated, the surface is oxidized and decomposed and then forms bloating, micro crack and silicate layer, thereby making the cutting process more advantageous. HIPSN and SSN specimens were used to study the machining characteristics. Higher laser power makes severer oxidation and decomposition of both materials. Therefore, HIPSN and SSN specimens were machined more effectively at higher power.

Synthesis and Properties of CuNx Thin Film for Cu/Ceramics Bonding

  • Chwa, Sang-Ok;Kim, Keun-Soo;Kim, Kwang-Ho
    • The Korean Journal of Ceramics
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    • v.4 no.3
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    • pp.222-226
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    • 1998
  • $Cu_3N$ film deposited on silicon oxide substrate by r.f. reactive sputtering technique. Synthesis and properties of copper nitride film were investigated for its possible application to Cu metallization as adhesive interlayer between copper and $SiO_2. Cu_3N$ film was synthesized at the substrate temperature ranging from $100^{\circ}C$ to $200^{\circ}C$ and at nitrogen gas ratio above $X_{N2}=0.4. Cu_3N, CuN_x$, and FGM-structured $Cu/CuN_x$ films prepared in this work passed Scotch-tape test and showed improved adhesion property to silicon oxide substrate compared with Cu film. Electrical resistivity of copper nitride film had a dependency on its lattice constant and was ranged from 10-7 to 10-1 $\Omega$cm. Copper nitride film was, however, unstable when it was annealed at the temperature above $400^{\circ}C$.

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Wear behavior of $Si_3N_4$-SiC nanocomposite in water

  • Kim, S. H.;Lee, S. W.
    • Proceedings of the Korea Association of Crystal Growth Conference
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    • 1997.10a
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    • pp.187-187
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    • 1997
  • Silicon nitride is the most excellent materials among structural ceramics. It has been reported that fracture toughness was improved with adding second phase particles, whisker, fiber etc. However, containing of second phase particles enhanced fracture toughness, however flexural strength was degraded. As adding nanosize SiC particles into silicon nitride, the physical properties of fluxural strength, fracture toughness, the modulus of elasticity. In this study, 2wt% $Al_2$O$_3$ and 4 wt% $Y_2$O$_3$ were added into UBE E-10 and 0, 10, 20, 30, 40, 50 vol% nano-SiC powder (Sumitomo T1 powder) were added, respectively. It is hot pressed at 185$0^{\circ}C$ for 1 hour. Most of structural ceramics for engineering application are wear resistance. In this study, wear behaviors (in water) of silicon nitride with varying the amount of nano-size silicon carbide were investigated, and was compared to physical properties. Simultaneously wear mechanism will be found out.

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Evaluation for the Strength and Erosion Rate on the Silicon Nitride Ceramics (질화규소 세라믹스의 강도와 침식도 평가에 관한 연구)

  • 김부안
    • Journal of Advanced Marine Engineering and Technology
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    • v.27 no.6
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    • pp.783-789
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    • 2003
  • An experimental method to investigate the fracture strength and fracture toughness for the silicon nitrides sintered at various sintering temperature is established. The erosion rate for these materials in the various concentration of NaOH solution is also investigated. In result, the fracture strength of Si3N4 is decreased with the increase of sintering temperature. On the other hand, the fracture toughness KIC is increased with the increase of sintering temperature. The erosion rate of silicon nitride in the NaOH solution depend largely on the grain size and the concentration of NaOH solution. The erosion rate of silicon nitride sintered at $1800^{\circ}C$ was much higher than that at $1950^{\circ}C$. These results are due to the unique columnar structure of silicon nitride.

Effects of Fabrication Variables and Microstructures on the Compressive Strength of Open Cell Ceramics (개방셀 세라믹스의 압축강도에 대한 제조공정변수 및 미세구조의 영향)

  • 정한남;현상훈
    • Journal of the Korean Ceramic Society
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    • v.36 no.9
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    • pp.954-964
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    • 1999
  • The effect of fabrication variables and microstructures on the compressive strength of open cell alumina zirconia and silicon nitride ceramics fabricated by polymeric sponge method was investigated. Bulk density and compressive strength of open cell ceramics were mainly affected by coating characteristics of ceramic slurry on polymeric sponge that controlled a shape thickness and defect of the struts. Sintering temperature was optimized for enhancement of strut strength and compressive strength of open cell ceramics. Relative density and compressive strength behaviors were relatively well matched with the predicted values. Open cell ceramics of lower relative density below 0.1 prepared by first relatively well matched with the predicted values. Open cell ceramics of lower relative density below 0.1 prepared by first coating of ceramic slurry had thin triangular prismatic struts that were often broken or longitudinally cracked. With an application of second coating of slurry shape of struts was transformed into thickner cylindrical one and defects in struts were healed but the relative density increased over 0.2 Open cell zirconia had both the highest bulk density and compressive strength and alumina had the lowest compressive strength while silicon nitrides showed relatively high compressive strength and the lowest density. Based upon the analysis open cell silicon nitride was expected to be one of potential structural ceramics with light weight.

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A Study on Silicon Nitride Based Ceramic Cutting Tool Materials

  • Park, Dong-Soo
    • Tribology and Lubricants
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    • v.11 no.5
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    • pp.78-86
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    • 1995
  • The silicon nitride based ceramic cutting tool materials have been fabricated by gas pressure sintering (GPS) or hot pressing (HP). Their mechanical properties were measured and the effect of the fabrication variables on the properties were examined. Also, effect of adding TiN or TiC particulates on the mechanical properties of the silicon nitride ceramics were investigated. Ceramic cutting tools (ISO 120408) were made of the sintered bodies. Cutting performance test were performed on either conventional or NC lathe. The workpieces were grey cast iron, hardened alloy steel (AISI 4140, HRc>60) and Ni-based superalloy (Inconel 718). The results showed that fabrication variables, namely, sintering temperature and time, exerted a strong influence on the microstincture and mechanical properties of the sintered body, which, however, did not make much difference in wear resistance of the tools. High hardness of the tool containing TiC particulates exhibited good cutting performance. Extensive crater wear was observed on both monolithic and TiN-containing silicon nitride tools after cutting the hardened alloy steel. Inconel 718 was extremely difficult to cut by the current cutting tools.

Directional Effect of Applied Pressure during the Sintering on the Microstructures and Fracture Toughness of Heat-treated Silicon Nitride Ceramics (소결시의 가압방식이 열처리 후 질화규소의 미세조직과 파괴인성에 미치는 영향)

  • 이상훈;박희동;이재도
    • Journal of the Korean Ceramic Society
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    • v.32 no.6
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    • pp.653-658
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    • 1995
  • Directional effect of applied pressure during sintering on the microstructure and fracture toughness of the heat-treated silicon nitride ceramics has been investigated. The specimens with a composition of 92Si3N4-8Y2O3(in wt%) were sintered at 172$0^{\circ}C$ by a hot press (HP ) and a hot isostatic press (HIP) and heat-treated for grain growth at 1800~20$0^{\circ}C$. The fracture toughness of the HP samples increased with the grain size while the fracture toughness of the HIP treated samples remained the same even though the grain growth occurred. This discrepancy was explained by a bimodal grain size distribution and large aspect ratio of the HPed samples and a monomodal grain size distributjion and samll aspect ratio of the HIP treated samples.

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Hertzian Crack Suppression and Damage Tolerance of Silicon Nitride Bilayer

  • Lee, Kee-Sung;Kim, Do-Kyung;Lee, Seung-Kun;Lawn, Brian R.
    • The Korean Journal of Ceramics
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    • v.4 no.4
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    • pp.356-362
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    • 1998
  • Hertzian crack suppression phenomena and relatively high damage tolerance were investigated in hard/soft silicon nitride ($Si_3N_4$) bilayers. Coarse $\alpha}-Si_3N_4$ powder was wsed for the hard coating layer and fine $\alpha}-Si_3N_4$ powder was used for the soft substrate layer. The two layers were designed with a strong interface. Hertzian indentation was used to investigate contact fracture and damage tolerance property. Hertzian crack suppression has occurred with increasing applied load and decreasing coating thickness. The crack suppression contributed strength improvement, especially in the bilayers with thinner coatings. Ultimately, the combination of hard coating with soft but tough underlayer improved the damage tolerance of brittle $Si_3N_4$ ceramics.

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Effect of the Heating Rate on the Microstructure and Fracture Toughness of Silicon Nitride Ceramics (소결시의 승온속도가 질화규소 요업체의 미세조직과 파괴인성에 미치는 영향)

  • 이상훈;이재도;김도연
    • Journal of the Korean Ceramic Society
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    • v.32 no.11
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    • pp.1227-1232
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    • 1995
  • Effect of heating rate on the microstructure of the silicon nitride ceramics has been investigated. The specimens with composition of 92Si3N4-6Y2O3-2Al2O3 (in wt%) were sintered at 176$0^{\circ}C$ under 127 kPa for 3h in N2 atmosphere at various heating rates from 1 to 10$0^{\circ}C$/min. The grain size of larger than 2${\mu}{\textrm}{m}$ and less than 1${\mu}{\textrm}{m}$ were measured and compared for the specimens. Regardless of heating rate, grain size of all the specimens showed bimodal distributions and the fracture toughness remained in the range of 5.53~5.72 MPa.m1/2. However, the aspect ratio of the grains of diameter above 2${\mu}{\textrm}{m}$ increased with the heating rate while their grain size and volume fraction decreased.

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Fabrication of Silicon Nitride Ceramics by Gel-Casting and Microwave Gas Phase Reaction Sintering(I) : Silicon Gel-Casting (Gel-Casting 및 마이크로파 기상반응소결에 의한 질화규소 세라믹 제조에 대한 연구(I) : Gel-Casting에 의한 실리콘 성형체의 제조)

  • Bai, Kang;Woo, Sang-Kuk;Han, In-Sub;Seo, Doo-Won
    • Journal of the Korean Ceramic Society
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    • v.48 no.5
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    • pp.348-353
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    • 2011
  • By gel-casting, the silicon-polymer green bodies were prepared for silicon nitride ceramics, sintered by microwave gas phase reaction. Considering the viscosity and the idle time of slurries, we decided the operational conditions of related processes, and the optimum concentrations of raw materials powders, organic monomers, cross-linker, dispersant, initiator, and catalyst. So we could get the machinable green bodies, having about 50 MPa of bending strength without cracks by selecting drying conditions carefully.