• Journal of Mechanical Science and Technology
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• v.16 no.9
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• pp.1093-1101
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• 2002

Continuous fiber ceramic composites (CFCCs) have advantages over monolithic ceramics : Silicon Nitride composites are not well used for application because of their low fracture toughness and fracture strength, but CFCCs exhibit increased toughness for damage tolerance, and relatively high stiffness in spite of low specific weight. Thus it is important to characterize the fracture resistance and properties of new CFCCs materials. Tensile and flexural tests were carried out for mechanical properties and the fracture resistance behavior of a SCS6 fiber reinforced Si$_3$N$_4$ matrix CFCC was evaluated. The results indicated that CFCC composite exhibit a rising R curve behavior in flexural test. The fracture toughness was about 4.8 MPa$.$m$\^$1/2 , which resulted in a higher value of the fracture toughness because of fiber bridging. Mechanical properties as like the elastic modulus, proportional limit and the ultimate strength in a flexural test are greater than those in a tensile test. Also a numerical modeling of failure process was accomplished for a flexural test. This numerical results provided a good simulation of the cumulative fracture process of the fiber and matrix in CFCCs.

• Journal of the Korean Ceramic Society
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• v.53 no.6
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• pp.622-627
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• 2016

The effects of the debinding atmosphere on the properties of sintered reaction-bonded $Si_3N_4$ (SRBSN) ceramics prepared by tape casting method were investigated. Si green tape was produced from Si slurry of Si powder, using 11.5 wt% polyvinyl butyral as the organic binder and 35 wt% dioctyl phthalate as the plasticizer. The debinding process was conducted in air and $N_2$ atmospheres at $400^{\circ}C$ for 4 h. The nitridation process of the debinded Si specimens was performed at $1450^{\circ}C$, followed by sintering at $1850^{\circ}C$ and 20 MPa. The results revealed that the debinding atmosphere had a significant effect on $Si_3N_4$ densification and thermal conductivity. Owing to the higher sintered density and larger grain size, the thermal conductivity of $Si_3N_4$ specimens debinded in air was higher than that of the samples debinded in $N_2$. Thus, debinding in air could be suitable for the manufacture of high-performance SRBSN substrates by tape casting.

• Journal of the Korean Ceramic Society
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• v.20 no.1
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• pp.63-69
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• 1983

It is know that $Si_3-N_4$ bonded SiC has almost all the valuable properties needed for the high temperature material and thus has bery wide range of applicability. Si powder and two different sized SiC powder were used as the raw mateials. Specimens were prepared by heating the green compact mode of the raw materials with polyvinyl alcohol binder in the nitrogen atmosphere. The bond-ing of SiC particles is brought about with the formation of reaction bonded silicon nitride phase between the particles he influences of the variation of the relative amounts of the raw materials and the amount of the organic binder on the density and the bend strength of the specimens were investigated. It was shown that the calculation of the amount of the nitridation of Si is somewhat complicated matter since some portion of the organic binder reacts with the Si during the firing process. Fixing the Si amount to 20w/o the distributions of the size of the SiC particles that gives the maximum density and the maximum strnegth were obtained through experiments. It was observed that the two distributions were not equal to each other. As the amount of Si increased the amount of Si reacted with nitrogen and the strength increased. The fracture mode was intergranular for the most part and the transgranular fracture was scarcely observed.

• Korean Journal of Materials Research
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• v.5 no.6
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• pp.699-705
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• 1995

Effect of the grain boundary phases in Si$_3$N$_4$ ceramics on the fracture tonghness has been investigated. The Si$_3$N$_4$-Y$_2$O$_3$-SiO$_2$, (YS) and Si$_3$N$_4$-Y$_2$O$_3$-Al$_2$O$_3$(YA) systems were Can/HIP treated at 1750$^{\circ}C$ and then heat-treated at 1800∼2000$^{\circ}C$. The fracture toughness of the YA system, the grain boundary phase was only glass phase after heat-treatement, was increased. That of the YS system, however, the grain boundary phase was changed from crystalline and glass to glass phase after the heat -treatement above 1900$^{\circ}C$, was abruptly decreased. The reason of the sudden drop of the fracture toughness of the YS system was believed that the change of the grain boundary phases from crystalline and glass to glass phase effected un the fracture behavior.

• Journal of the Korea Institute of Military Science and Technology
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• v.21 no.6
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• pp.760-766
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• 2018

The present study investigates the effect of PMMA and BN content on microstructure, mechanical and dielectric properties of silicon nitride($Si_3N_4$) ceramics in $Y_2O_3-Al_2O_3$ additive system. The total additive content was fixed at 8 wt.% and the amount of PMMA varies from 0 to 40 wt.% and BN varies from 0 to 36 wt.%, respectively. The crystalline phases of the samples were determined by X-ray diffraction analysis. All the sintered sample shows complete transformation of ${\alpha}$ to ${\beta}-Si_3N_4$ during the sintering process indicated that the phase transformation was unaffected by the PMMA or BN content. However, the microstructure shows that the residual porosity increased with increasing PMMA and BN content. In addition, the flexural strength and the dielectric constant decrease with addition of PMMA and BN due to the residual porosity. This article provides empirical study of design parameters for $Si_3N_4$-based radome materials.

• Journal of the Korean Ceramic Society
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• v.51 no.5
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• pp.386-391
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• 2014

Silicon nitride ($Si_3N_4$) is regarded as one of the most promising materials for high temperature structural applications due to its excellent mechanical properties at both room and elevated temperatures. However, one high-temperature $Si_3N_4$ material intended for use in radomes has a relatively high dielectric constant of 7.9 - 8.2 at 8 - 10 GHz. In order to reduce the dielectric constant of the $Si_3N_4$, an in-situ reaction process was used to fabricate $Si_3N_4-SiO_2$-BN composites. In the present study, an in-situ reaction between $B_2O_3$ and $Si_3N_4$, with or without addition of BN in the starting powder mixture, was used to form the composite. The in-situ reaction process resulted in the uniform distribution of the constituents making up the composite ceramic, and resulted in good flexural strength and dielectric constant. The composite was produced by pressure-less sintering and hot-pressing at $1650^{\circ}C$ in a nitrogen atmosphere. Microstructure, flexural strength, and dielectric properties of the composites were evaluated with respect to their compositions and sintering processes. The highest flexural strength (193 MPa) and lowest dielectric constant (5.4) was obtained for the hot-pressed composites. The strength of these $Si_3N_4-SiO_2$-BN composites decreased with increasing BN content.

• The Korean Journal of Ceramics
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• v.5 no.4
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• pp.324-330
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• 1999

$Si_3N_4$-$TiB_2$ with 2 wt% $Al_2O_3$ and 4 wt% $Y_2O_3$ additives was hot pressed in a flowing $N_2$ environment with varying $TiB_2$ content from 10 to 50 vol%. Variations of mechanical (hardness, fracture toughness, and flexual strength), and tribological properties as a function of $TiB_2$ content were investigated. As the content of $TiB_2$ increased, relative density decreased due to the chemical reaction of $TiB_2$in $N_2$ environment. The reduction of density causes mechanical properties to be degraded with an increase of $TiB_2$ in $Si_3N_4$. Tribological properties were dependent of microstructure as well as mechanical properties, however, they were degraded strongly by the chemical reaction of $Si_3N_4$-$TiB_2$ during hot pressing in $N_2$ environment. SEM and TEM observations, and X-ray diffraction analysis that the chemical reaction products at the interface are TiCN, Si, and $SiO_2$. Also, the comparison of XRD patterns of the $Si_3N_4$-40 vol% $TiB_2$ composites hot pressed at $1,750^{\circ}C$ for 1 hour between in $N_2$ and in Ar gas was made. The XRD peaks of Si and $SiO_2$ were not found in Ar, but still a weak peak of TiCN was presented.

• Korean Journal of Materials Research
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• v.9 no.12
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• pp.1170-1175
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• 1999

The microstructures and mechanical properties of $Si_3N_4$ ceramics produced by nitridation and post-sintering using semiconductor-waste-Si sludge were investigated. Lots of microcracks were observed in the waste-Si powders which contained some amounts of amorphous $SiO_2$. The nitridation rate of waste-Si compacts showed lower value than that of commercial Si powder compacts. The nitridation rate was increased with increasing nitridation temperature and then the percent of nitridation at 1470$^{\circ}C$ showed 98%. The phases of $Si_3N_4$ in the reaction-bonded bodies were mixed with ${\alpha}$ and ${\beta}$-type, and small amounts of $Si_2N_2O$ phase while those after post-sintering were ${\beta}$-$Si_3N_4$ and ${\alpha}$-Sialon. The sample post-sintered at 1950$^{\circ}C$ showed the fracture toughness of 5.6 $^MPa{\cdot}m^{1/2}$ and the fracture strength of 497 MPa which were lower than those of sintered body using commercial Si powder possibly due to the formation of ${\alpha}$-Sialon phase.

• Journal of the Korean Ceramic Society
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• v.39 no.10
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• pp.955-962
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• 2002

The microstructure change of brazed $Si_3N_4$/Stainless steel 316 joint with Cu buffer layer were examined to clarify the effects of brazing process conditions such as brazing time and temperature on the mechanical properties and reliability of brazed joints. For the brazed joint above 900${\circ}C$, the Cu buffer layer was completely dissolved into brazing alloy and the thickness of reaction product formed at $Si_3N_4$/brazing alloy joint interface was abruptly increased, which could increase the amounts of residual stress developed in the joint. The fracture strength of brazed $Si_3N_4$/Stainless steel 316 joint with Cu buffer layer at 950${\circ}C$ was much reduced comparing to those of joints brazed at the lower temperature. But, it was found that the effects of brazing time was not critical on the mechanical properties as well as the reliability of $Si_3N_4$/Stainless steel 316 joint with Cu buffer layer brazed at the temperature below 900${\circ}C$.