• 제목/요약/키워드: Silicon Nitride Ceramic

검색결과 205건 처리시간 0.021초

Fabrication of a Complex-Shaped Silicon Nitride Part with Aligned Whisker Seeds Using LOM Technique

  • Park, Dong-Soo;Cho, Byung-Wook
    • 한국세라믹학회지
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    • 제40권10호
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    • pp.931-935
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    • 2003
  • A complex-shaped part was successfully fabricated by Laminate Object Manufacturing (LOM) technique using silicon nitride tape with aligned silicon nitride whisker seeds. The ceramic tape was cut using a commercial cutting plotter according to the cross section drafts generated by slicing a 3-D model, and then the tapes were stacked sequentially. In order to improve adhesion between the tapes, stacking was performed under vacuum. After binder burnout, the part was encapsulated using latex emulsion and was cold isostaically pressed under 250 ㎫. It was sintered to 98.5% TD at 2148 K for 4 h under 2 ㎫ nitrogen pressure.

High Thermal Conductivity Silicon Nitride Ceramics

  • Hirao, Kiyoshi;Zhou, You;Hyuga, Hideki;Ohji, Tatsuki;Kusano, Dai
    • 한국세라믹학회지
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    • 제49권4호
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    • pp.380-384
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    • 2012
  • This paper deals with the recent developments of high thermal conductivity silicon nitride ceramics. First, the factors that reduce the thermal conductivity of silicon nitride are clarified and the potential approaches to realize high thermal conductivity are described. Then, the recent achievements on the silicon nitride fabricated through the reaction bonding and post sintering technique are presented. Because of a smaller amount of impurity oxygen, the obtained thermal conductivity is substantially higher, compared to that of the conventional gas-pressure sintered silicon nitride, while the microstructures and bending strengths are similar to each other between these two samples. Moreover, further improvement of the thermal conductivity is possible by increasing ${\beta}/{\alpha}$ phase ratio of the nitrided sample, resulting in a very high thermal conductivity of 177 W/($m{\cdot}K$) as well as a high fracture toughness of 11.2 $MPa{\cdot}m^{1/2}$.

$Si-Si_3N_4$ 성형체의 질화반응에 관한연구 (A Study on the Nitridation of $Si-Si_3N_4$ Compacts)

  • 이전국;김종희
    • 한국세라믹학회지
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    • 제22권1호
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    • pp.53-59
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    • 1985
  • Experiments related to nitriding silicon with addition of $Si_3N_4$ have provided information on the effects of such inclusion on the phase relationships of Reaction Bonded Silicon Nitride. In the current work specimens containing 0-25wt% Si3N4 which have 55.5wt% $\alpha$ 4.5wt% $eta$, 40wt% amorphous phase were nitrided for 7-20 hours at 1300-135$0^{\circ}C$ The evaluation of nitridation was per-formed by means of $\alpha$-and $\beta$-phase contents determination in nitrided specimens, In order to observe nitrided region between silicon and silicon nitride scanning electron microscopy was used to study reacted region between silicon and silicon nitride particle. For this purpose semiconductor-grade silicon wafer single crystal was used as a silicon source. The incorporation of small amount of $Si_3N_4$ powder is contributed to enhancing the rate of formation of $\alpha$-phase.

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반응결합 질화규소의 제조의 있어서 초기 질소분압의 영향 (The Effect of Initial Partial Pressure of Nitrogen on the Manufacturing of Reaction-Bonded Silicon Nitride)

  • 이근예;이준근;오재희
    • 한국세라믹학회지
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    • 제21권1호
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    • pp.51-59
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    • 1984
  • In this paper mechanical properties of reaction-bonded silicon nitride are studied with the variation of initial nitrogen partial pressure. At 1, 25$0^{\circ}C$ the amount of nitridation and the nucleation of nitride increase linearly with the nitrogen partial pressure increase. After the nitridation is completed the density of nitride and modulus of rupture at room temperature are increased with the amount of nitridation. When the partial pressure of nitrogen is 0.5 atm the specimen show the optimum properties that is the highest density of nitride and modulus of rupture. Also the microstructure of $\alpha$-matte is deveoped very well at that pressure of nitrogen which contributes to the strength development of specimen. It is shown that with proper control of initial partial pressure of nitrogen high strength silicon nitride body can be manufactured for dynamic applications.

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세라믹 마멸에 있어서의 새로운 파라메터 제안 (I) 질화규소와 지르코니아의 마찰$\cdot$마멸 특성 (A Propotition of a New Parameter in Ceramic Wear(I) Friction and Wear Characteristics of Silicon Nitride and Zirconia)

  • 김석삼;김상우
    • 대한기계학회논문집
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    • 제17권6호
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    • pp.1441-1455
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    • 1993
  • 본 연구에서는 최신기법에 의해서 제조된 HIP제 질화규소와 지르코니아를 실험재료로 하여 무윤활하에서의 미끄럼마찰·마멸실험을 수행하여 마찰·마멸특성을 규명하고, SEM을 이용한 마멸면의 미시적 관찰을 통해서 세라믹의 마멸기구를 조사하 여 세라믹마멸기구의 마멸모델을 제시하고자 한다. 제시된 마멸모델에서 파괴역학을 도입하여 이론해석과 고찰을 수행하여 보다 실용적인 세라믹의 마멸율울 평가할 수 있 는 새로운 무차원 파라메터를 제안하고자 한다.

SiAlON Bulk Glasses and Their Role in Silicon Nitride Grain Boundaries: Composition-Structure-Property Relationships

  • Hampshire, Stuart;Pomeroy, Michael J.
    • 한국세라믹학회지
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    • 제49권4호
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    • pp.301-307
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    • 2012
  • SiAlON glasses are silicates or alumino-silicates, containing Mg, Ca, Y or rare earth (RE) ions as modifiers, in which nitrogen atoms substitute for oxygen atoms in the glass network. These glasses are found as intergranular films and at triple point junctions in silicon nitride ceramics and these grain boundary phases affect their fracture behaviour. This paper provides an overview of the preparation of M-SiAlON glasses and outlines the effects of composition on properties. As nitrogen substitutes for oxygen in SiAlON glasses, increases are observed in glass transition temperatures, viscosities, elastic moduli and microhardness. These property changes are compared with known effects of grain boundary glass chemistry in silicon nitride ceramics. Oxide sintering additives provide conditions for liquid phase sintering, reacting with surface silica on the $Si_3N_4$ particles and some of the nitride to form SiAlON liquid phases which on cooling remain as intergranular glasses. Thermal expansion mismatch between the grain boundary glass and the silicon nitride causes residual stresses in the material which can be determined from bulk SiAlON glass properties. The tensile residual stresses in the glass phase increase with increasing Y:Al ratio and this correlates with increasing fracture toughness as a result of easier debonding at the glass/${\beta}-Si_3N_4$ interface.

질화규소의 소결 및 기계적 성질에 관한 연구 (A Study on Sintering and Mechanical Properties of $Si_3N_4$)

  • 이회동;이준근
    • 한국세라믹학회지
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    • 제21권4호
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    • pp.361-365
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    • 1984
  • This study has been carried out to sinter silicon nitride with additives and to show the effect of surface finishments on its strength and Weibull modulus which are two most important factors for its applications into structural ceramics. Silicon nitride was sintered with the additions of $Al_2O_3$ and $Y_2O_3$ under pressureless cond-ition. The optimum properties were obtained by sintering at 1, 75$0^{\circ}C$ for 3hrs under $N_2$ atmosphere and the strength showed 6, 500kg/$cm^2$ at room temperature and 3, 300kg/$cm^2$ at 120$0^{\circ}C$. The effects of surface treatment on the strength of sintered $Si_3N_4$ were studied and the results showed that fine surface treatment increased the strength by up to 50% The Weibull analysis showed that its modulus was increased with increasing fineness of surface finishments. It was concluded that the mechanical properties of sintered silicon nitride could be improved by fine surface grinding which implied the brittle-fracture nature of sintered silicon nitride.

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질화규소의 피로균열진전과 입자가교효과 (Bridging Effect and Fatigue Crack Growth of Silicon Nitride)

  • 유성근
    • 한국세라믹학회지
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    • 제33권11호
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    • pp.1203-1208
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    • 1996
  • 질화규소의 균열진전시험은 정적 및 반복사중하의 균열진전특성을 명확히 밝혔다. 일정 K값의 정적하중에서 균열진전속도는 균열진전증가와 더불어 감소하고 최종적으로는 정지하였다. 또 균열진전저항은 응력반복에 의해 크게 감소하였다. 특히 균열진전저항은 균열진전증가와 더불어 증가하였고, 증가속도는 정적하중보다 반복하중하에서 훨씬 작았다.

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커플링제로 처리된 질화규소 분말의 사출성형 (Injection Molding of Silicon Nitride Powders Treated with Coupling Agents)

  • 송휴섭
    • 한국세라믹학회지
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    • 제30권2호
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    • pp.131-138
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    • 1993
  • The effects of silane coupling agents on the injection molding process were investigated using silicone nitride mixtrues with a binder system containing polypropylene as a major binder (55vol% solid loading). The formation of bonding between silicon nitride powder and coupling agents was confirmed through the analyses of powder surface. The use of coupling agents improved mixing characteristics judged by the torque change during mixing process. the coupling agents also reduced molten viscosity of the mixture considerably, which is a main factor to determine the flow of the mixture. However, the bonding between coupling agents and polymers had a negative effect on the debinding process by retarding the thermal decomposition.

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RF 마그네트론 스퍼터링을 이용한 태양전지용 질화 실리콘 반사방지막 (Anti-reflection Coating of Silicon Nitride Film for Solar Cell by RF Magnetron Sputtering)

  • 최균;최의석;황진하;이수홍
    • 한국세라믹학회지
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    • 제44권10호
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    • pp.585-588
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    • 2007
  • Silicon nitride films for an anti-reflection coating were deposited on silicon via RF magnetron sputtering using a $Si_3N4$ target. The best result was obtained at the sputtering condition of 340 W RF power, 5 mtorr Ar atmosphere, $100^{\circ}C$ substrate temperature. The films showed 7.9% reflectance minimum with 2.35 refractive index. 0.21 absorption coefficient at 66.6 nm thickness. The surface morphology showed a smooth and dense film with good adhesion to silicon surface.