• 한국세라믹학회지
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• 제49권4호
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• pp.342-346
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• 2012

This work deals with the preparation of dense SiC based ceramics with high electrical conductivity without oxide sintering additives. SiC samples with different content of conductive Ti-NbC phase were hot pressed at $1850^{\circ}C$ for 1 h in Ar atmosphere under mechanical pressure of 30 MPa. The conductive phase is a mixture of Ti-NbC in weight ratio of Ti/NbC 1:4. Composite with 50% of conductive Ti-NbC phase showed the highest electrical conductivity of $30.6{\times}10^3\;S{\cdot}m^{-1}$, while the good mechanical properties of SiC matrix were preserved (fracture toughness 4.5 $MPa{\cdot}m^{1/2}$ and Vickers hardness 18.7 GPa). The obtained results show that use of NbC and Ti as sintering and also electrically conductive additives is appropriate for the preparation of SiC-based composite with sufficient electrical conductivity for electric discharge machining.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2001년도 추계학술대회 논문집
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• pp.200-203
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• 2001

Micromolding methods such as micro-injection molding and micro-compression molding are most suitable for mass production of plastic micro-optics with low cost. In this study, plastic micro-optical components, such as refractive microlenses and diffractive optical elements(DOEs) with various grating patterns, were fabricated using micro-compression molding process. The mold inserts were made by ultrapricision mechanical machining and silicon etching. A micro compression molding system was designed and developed. Polymer powders were used as molded materials. Various defects found during molding were analyzed and the process was optimized experimentally by controlling the governing process parameters such as histories of mold temperature and compression pressure. Mim lenses of hemispherical shape with $250{\mu}m$ diameter were fabricated. The blazed and 4 stepped DOEs with $24{\mu}m$ pitch and $5{\mu}m$ depth were also fabricated. Optical and geometrical properties of plastic molded parts were tested by interferometric technique.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2003년도 추계학술대회논문집
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• pp.76-79
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• 2003

Glass molding is an advantageous method to manufacture glass micro optical components. However, it is difficult to make tungsten carbide core for glass molded micro optics way. We have developed novel method to fabricate tungsten carbide core for glass molding of glass micro optical components. Silicon masters were fabricated by micro machining. Tungsten Carbide cores were fabricated by forming, sintering and coating. Finally we fabricated glass molded V-groove with pitch of 192$\mu\textrm{m}$ and glass microlens way with lens diameter of 36∼225$\mu\textrm{m}$ by the present method.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2004년도 추계학술대회
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• pp.777-781
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• 2004

This paper presents a force/displacement sensing system to measure penetration depths and machining forces during pattering operation. This sensing system consists of a leaf spring mechanism and a capacitive sensor, which is mounted on a PZT driven in-feed motion stage with 1nm resolution. The sample is moved by a xy scanning motion stage with 5nm resolution. The constructed system was applied to nano indentation experiments, and the load-displacement curves of silicon(111) and aluminum were obtained. Then, the indentation samples were measured by AFM. Experimental results demonstrated that the developed system has the ability of preforming force/depth sensing indentations

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 춘계학술대회 논문집
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• pp.820-823
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• 2002

MEMS structures Generally have been fabricated using surface-machining, but the interface failure between silicon substrate and evaporated thin film frequently takes place due to difference of linear coefficient of thermal expansion. Therefore this paper studied the effect of the residual stress caused by variable external loads. This study did not analyzed accurate quantity of the residual stress but trend for the effect of residual stress. Several specimens were fabricated using other material(Al, Au and Cu) and thermal load was applied. The residual stress was measured by nano-indentation using AFM. The results showed the existence of the residual stress due to thermal load. The indentation area of the thermal loaded thin film reduced about 3.5% comparing with the virgin thin film caused by residual stress. The finite element analysis results are similar to indentation test.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 춘계학술대회 논문집
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• pp.20-23
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• 2002

In silicon wafer manufacturing process, the grinding process has been adopted to improve the quality of wafer such as flatness, roughness and so on. This paper describes the effect of grinding process on the surface quality of wafer. The experiments are carried out by high precision in fred grinder with air bearing spindle. The relationship between the inclination of chuck table and the flatness of wafer is investigated, and the effect of grinding conditions including wheel speed, table speed, and feed rate on damage depth and roughness of wafer is also investigated. The experimental results show that there is close relationship between the inclination of the chuck table and the flatness of wafer, and the grinding conditions within this paper little affect the flatness of wafer and relatively high affect the damage depth of wafer.

• 한국윤활학회:학술대회논문집
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• 한국윤활학회 2002년도 제35회 춘계학술대회
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• pp.40-44
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• 2002

The motivation of this work is to use SAM(Self-Assembled Monolayer) for developing a rapid and flexible non-photolithographic nano-structure fabrication technique which can be utilized in micro-machining of metals as well as silicon-based materials. The fabrication technique implemented in this work consists of a two-step process, namely, mechanical scribing followed by chemical etching. From the experimental results, it was found that thiol on copper surface could be removed even under a few nN normal load. The nano-tribological characteristics of thiol-SAM on various metals were largely dependent on the native oxide layer of metals. Based on these findings, nano-patterns with sub-micrometer width and depth on metal surfaces such as Cu, Au and Ag could be obtained using a diamond-coated tip.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회A
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• pp.1493-1498
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• 2007

Silicon Nitride ($Si_3N_4$), which is widely used in a variety of applications, is hard-to-machine due to its high hardness. At high temperature (e.g. above $1000^{\circ}C$), however, the machinability can be greatly improved. In this work, we used a $CO_2$ laser with a high absorptivity to $Si_3N_4$ of 0.9 to preheat the surface of a rothting $Si_3N_4$ rod. Preheating and turning of $Si_3N_4$ was executed at the same time. The result of machining was MRR of $8.0mm^3/s$ that is four times faster than normal grinding. Continuous chip formation was observed by a microscope.

• 한국세라믹학회지
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• 제48권1호
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• pp.52-56
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• 2011

Silicon carbide (SiC) is a candidate material for heat exchangers for VHTR (Very High Temperature Gas Cooled Reactor) due to its refractory nature and high thermal conductivity. This research has focused on demonstration of physical properties and mock-up fabrication for the future heat exchange applications. It was found that the SiC-based components can be applied for process heat exchanger (PHE) and intermediate heat exchanger (IHX), which are operated at $400{\sim}1000^{\circ}C$, based on our examination for the following aspects: optimum fabrication technologies (design, machining and bonding) for compact design, thermal conductivity, corrosion resistance in sulfuric acid environment at high temperature, and simulation results on heat transferring and thermal stress distribution of heat exchanger mock-up.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1993년도 정기총회 및 추계학술대회 논문집 학회본부
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• pp.207-209
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• 1993

In this paper, an electrostatic silicon micro actuator has been designed and fabricated using the micro machining technology. The actuator consists of two counter electrodes. One is an Al film deposited on a pyrex glass, and the other is a circular corrugated diaphragm with boron doped. The diaphragm is fabricated by boron etch stop technique using an anisotropic etchant, EPW.