• Korean Chemical Engineering Research
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• v.62 no.1
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• pp.19-26
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• 2024

In this study, the electrochemical properties of SiOx@C composite materials were prepared to alleviate volume expansion and cycle stability of silicon and to increase the capacity of anode material for LIBs. SiO₂ particles of 100, 200, and 500 nm were synthesized by the Stӧber method, and reduced to SiOx (0≤x≤2) through the magnesiothermic reduction method. Then, SiOx@C anode materials were synthesized by carbonization of PVC on SiOx. The physical properties of prepared SiOx and SiOx@C anode materials were analyzed by XRD, SEM, TGA, Raman spectroscopy, XPS and BET. The electrochemical properties were investigated by cycling performance, rate performance, CV and EIS test. As a result, the SiOx@C-7030 manufactured by coating carbon at SiOx : C = 70 : 30 on a 100 nm SiOx with the smallest particle size showed the best electrochemical properties with a discharge capacity of 1055 mAh/g and a capacity retention rate of 81.9% at 100 cycles. It was confirmed that cycle stability was impoved by reducing particle size and carbon coating.

• Journal of the Korean Society of Propulsion Engineers
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• v.22 no.6
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• pp.94-103
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• 2018

The purpose of designing composite lattice structure which applied to launching vehicle and tactical missile body is to minimize the thickness and weight for applied load. It is usually made of carbon fiber; fabricating with filament winding process over silicon mold, and provided with a window opening for inspection purpose if necessary. In this paper compression test is conducted without window opening in lattice structure and preliminary FEA is carried out to confirm its accuracy. And then FEA is performed for the case of window opening to evaluate the soundness and the safety factor of the structure. We have calculated for two kinds of window shape; rectangular one and hexagonal one. And we have calculated safety factors of the lattice structure with window opening in every case based on failure strength of rib and knot with varying the thickness and location of the window for hexagonal shape. Through our investigation, we have found out the followings; (1) the hexagonal shaped window is shown higher safety factor than rectangular one, (2) a window in a certain location is shown higher safety factor than others, (3) although the soundness of window structure is improved as increasing its thickness, a window of a certain thickness is shown higher safety factor than others because of stress concentration.

• Korean Journal of Materials Research
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• v.16 no.3
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• pp.188-192
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• 2006

The microstructures and mechanical properties of continuously porous $SiC-Si_3N_4$composites fabricated by multi-pass extrusion were investigated at different Si levels added. Si-powder with different weight percentages (0%, 5%, 10%, 15%, 20%) was added to the SiC powder to make the raw mixture powders, with $6wt%Y_2O_3-2wt%Al_2O_3$ as sintering additives, carbon ($10-15{\mu}m$) as a pore-forming agent, ethylene vinyl acetate as a binder and stearic acid ($CH_3(CH_2)_{16}COOH$) as a lubricant. In the continuously porous $SiC-Si_3N_4$ composites, $Si_3N_4$ whiskers like the hairs of nostrils were frequently observed on the wall of the pores. In this study, the morphology of the $Si_3N_4$ whiskers was investigated with the silicon addition content. In the composites containing of 10 wt% Si, a large number of $Si_3N_4$ whiskers was found at the continuous pore regions. In the sample to which 15 wt% Si powder was added, maximum values of about 101 MPa bending strength and 57.5% relative density were obtained.

• Electronics and Telecommunications Trends
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• v.38 no.6
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• pp.41-51
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• 2023

Heat dissipation technology for semiconductors and electronic packaging has a substantial impact on performance and lifespan, but efficient heat dissipation is currently facing limited improvement. Owing to the high integration density in electronic packaging, heat dissipation components must become thinner and increase their performance. Therefore, heat dissipation materials are being devised considering conductive heat transfer, carbon-based directional thermal conductivity improvements, functional heat dissipation composite materials with added fillers, and liquid-metal thermal interface materials. Additionally, in heat dissipation structure design, 3D printing-based complex heat dissipation fins, packages that expand the heat dissipation area, chip embedded structures that minimize contact thermal resistance, differential scanning calorimetry structures, and through-silicon-via technologies and their replacement technologies are being actively developed. Regarding dry cooling using single-phase and phase-change heat transfer, technologies for improving the vapor chamber performance and structural diversification are being investigated along with the miniaturization of heat pipes and high-performance capillary wicks. Meanwhile, in wet cooling with high heat flux, technologies for designing and manufacturing miniaturized flow paths, heat dissipating materials within flow paths, increasing heat dissipation area, and reducing pressure drops are being developed. We also analyze the development of direct cooling and immersion cooling technologies, which are gradually expanding to achieve near-junction cooling.

• Composites Research
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• v.30 no.2
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• pp.116-125
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• 2017

The purpose of this study is to develop silicon carbide fiber showing an excellent mechanical properties under highly oxidative conditions at high temperature. Polycarbosilane(PCS) as a preceramic precursor was used for making the SiC fiber. PCS fiber was taken by melt spinning method followed by melting the PCS at $300{\sim}350^{\circ}C$ in N2 gas. The Curing of PCS fiber was carried out in air oxygen chamber, prior to high temperature pyrolysis. Degree of cure was calculated by characteristic peak's ratio of Si-H to $Si-CH_3$ in FT-IR spectra before and after curing of PCS fiber. The properties of SiC fiber was affected greatly by the degree of cure. The SiC fiber produced by controlling fiber tension during heat treatment showed good properties. The SiC fiber exposed to $1000^{\circ}C$ at air from 1 min. up to maximum 50 hrs showed around 60% reduction in tensile strength. We found that large amount of carbon content on the fiber surface after long-term exposure has resulted in lower tensile strength.