• 제목/요약/키워드: Sidewall

검색결과 348건 처리시간 0.028초

간헐 열전달을 이용한 밀폐용기내의 물질전달 향상 (Enhancement of Mass Transfer of an Enclosed Fluid by Time-periodic Thermal Forcing)

  • 곽호상
    • 한국전산유체공학회지
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    • 제7권1호
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    • pp.36-43
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    • 2002
  • A numerical investigation is made of unsteady double-diffusive convection of a Boussinesq fluid in a rectangular cavity subject to time-periodic thermal excitations. The fluid is initially stratified between the top endwall of low solute concentration and the bottom endwall of high solute concentration. A time-dependent heat flux varying in a square wave fashion, is applied on one sidewall to induce buoyant convection. The influences of the imposed periodicity on double-diffusive convection are examined. A special concern is on the occurrence of resonance that the fluctuations of flow and attendant heat and mass transfers are mostly amplified at certain eigenmodes of the fluid system. Numerical solutions illustrate that resonant convection results in a conspicuous enhancement of time-mean mass transfer rate.

축열식 가열기형 풍동을 이용한 스크램제트 엔진 흡입구 실험연구 (Experimental Study of a Scramjet Engine Intake in a Storage Heater Type Hypersonic Wind Tunnel)

  • 강상훈;이양지;양수석
    • 한국추진공학회:학술대회논문집
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    • 한국추진공학회 2010년도 제35회 추계학술대회논문집
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    • pp.463-466
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    • 2010
  • 축열식 가열기 형태의 초음속 풍동을 이용하여 스크램제트 엔진 흡입구의 성능 연구를 수행하였다. 본 시험모델은 측벽배치변화가 성능에 큰 영향을 미치지 않는 것으로 나타났다. 격리부 성능연구에서는 Oblique shock train과 Normal shock train의 압력분포를 확인할 수 있었으며, 격리부의 불시동 한계성능을 분석하였다.

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Slit-Coater내의 Photo Resist의 코팅 특성 (Coating Characteristics of Photo Resist in a Slit-Coater)

  • 김장우;정진도;김성근
    • 반도체디스플레이기술학회지
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    • 제3권3호
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    • pp.41-44
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    • 2004
  • The aim of this study is the confirmation of the coating uniformity affected by the surface tension and wall attachment angle in a slit-coater model. In this work, we use the commercial code (Fluent) to solve the two-phase flow formed with air and photo resist numerically. The results show that the surface tension is the most important factor to determine the coating efficiency in the view of coating uniformity, and the coating uniformity is 2% for our slit-coater model and conditions. To improve the coating uniformity, it is in need of minimization of the sidewall effect of slit-coater.

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반도체 장비 부품의 Ti/TiN 흡착물 세정 공정 연구

  • 유정주;배규식
    • 한국반도체및디스플레이장비학회:학술대회논문집
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    • 한국반도체및디스플레이장비학회 2004년도 춘계학술대회 발표 논문집
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    • pp.92-96
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    • 2004
  • Scales, accumulated on semiconductor equipment parts during device fabrication processes, often lower equipment lifetime and production yields. Thus, many equipments parts have be cleaned regularly. In this study, an attempt to establish an effective process for the removal of scales on the sidewall of collimators in the chamber of sputter is made. The EDX analysis revealed that the scales are composed of Ti and TiN with the colummar structure. It was found that the heat-treatment at 700 for 1 min. after the oxide removal in the HF solution, and then etching in the HNO3 : H2SO4 : H2O =4:2:4 solution for 5.5 hrs at 67 was the most effective process for the scale removal.

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신발 러핑 경로 측정기 개발 (Development of the Roughing Path Measurement System for Footwear)

  • 강동배;김화영;손성민;안중환
    • 한국정밀공학회지
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    • 제20권10호
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    • pp.120-129
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    • 2003
  • For successful establishment of the roughing CAM system based on reverse engineering, it is necessary to develop the measurement method for generation of roughing path from a physical footwear model. In this study, the development of the roughing path measurement system is presented. It consists of 3 CCD cameras, image acquisition board and the roughing path measurement algorithm. The 3 CCD cameras capture images of the sidewall and the bottom of the footwear and, from two images, the outer and inner lines are extracted using image-processing algorithm. The roughing path measurement algorithm generates the roughing path which is reflected on the change of resolution according to the distance between the CCD camera and the measured point. The experimental results show that the developed system can measure the roughing path within the allowable roughing error range.

실리콘 직접접합 기술을 이용한 횡방향 구조 트랜지스터 (Lateral Structure Transistor by Silicon Direct Bonding Technology)

  • 이정환;서희돈
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2000년도 하계학술대회 논문집
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    • pp.759-762
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    • 2000
  • Present transistors which have vertical structure show increased parasitic capacitance characteristics in accordance with the increase of non-active base area and collector area, consequently have disadvantage for high speed switching performance. In this paper, a horizontal structure transistor which has minimized parasitic capacitance in virtue of SDB(Silicon Direct Bonding) wafer and oxide sidewall isolation utilizing silicon trench technology is presented. Its structural characteristics were designed by ATHENA(SUPREM4), the process simulator from SILVACO International, and its performance was proven by ATLAS, the device simulator from SILVACO International. The performance of the proposed horizontal structure transistor was certified through the VCE-lC characteristics curve, $h_{FE}$ -IC characteristics, and GP-plot.

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자기정렬된 낮은 농도의 소오스를 갖는 트렌치 바디 구조의 IGBT (A Self-Aligned Trench Body IGBT Structure with Low Concentrated Source)

  • 윤종만;김두영;한민구;최연익
    • 대한전기학회논문지
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    • 제45권2호
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    • pp.249-255
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    • 1996
  • A self-aligned latch-up suppressed IGBT has been proposed and the process method and the device characteristics of the IGBT have been verified by numerical simulation. As the source is laterally diffused through the sidewall of the trench in the middle of the body, the size of the source is small and the doping concentration of the source is lower than that of the p++ body and the emitter efficiency of the parasitic npn transistor is low so that latch-up may be suppressed. No additional mask steps for p++ region, source, and source contact are required so that small sized body can be obtained Latch-u current density higher than 10000 A/cm$^{2}$ have been achieved by adjusting the process conditions.

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An Experimental Study on the Mechanical Properties and Rebound Ratios of SFRS with Silica Fume

  • Son, Young-Hyun;Chai, Won-Kyu
    • International Journal of Safety
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    • 제8권2호
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    • pp.20-25
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    • 2009
  • In this study, an experiment in the field was performed to analyze the mechanical properties and the influence of steel fiber and silica fume on the rebound ratios of shotcrete. The experimental parameters which are the reinforcing methods (steel fiber, wire mesh), steel fiber contents (0.0%, 0.5%, 0.75%, 1.0%), silica fume contents (0.0%, 10.0%), layer thickness (60 mm, 80 mm, 100 mm), and the placing parts (sidewall, shoulder, crown) were chosen. From the mechanical test, it was found that the flexural strength and toughness is significantly improved by the steel fiber and/or silica fume. According to the results for the side wall in this test, the larger the fiber contents are in case of steel fiber reinforced shotcrete, the less the rebound ratios are within the range of 20-35%, compared to the wire mesh reinforced shotcrte. And also, the reduced rebound ratios were very larger in using steel fiber reinforced shotcrete with silica fume content of 10%, and these results are true of the shoulder and the crown. respectively.

에치홀의 위치와 희생층의 잔류물이 전송선 필터 응답에 미치는 영향 (Effect of Etch Hole Position and Sacrificial Layer Residue on a Novel Half-Coaxial Transmission Line Filter)

  • 김용성;백창욱;김용권
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2007년도 제38회 하계학술대회
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    • pp.284-285
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    • 2007
  • In this paper, we present the effect on a novel transmission line filter response by the etch hole position on the suspended ground and the residue on the resonator under ground plane. We defined the etch hole offset as the distance from the sidewall of the suspended ground to the nearest side of the etch holes. We simulated new filter responses to reflect the real value of the changed etch hole offset caused by characteristics of negative photoresist. Return loss is distorted by the residue on the center conductor remained after sacrificial layer removing. By comparison of simulation and measurements, we concluded the residue on the resonator distorted the RF response worse than etch hole offset variation did.

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CMOS 공정에 의한 2차원 SSIMT의 제작 및 특성 (Fabrication and characteristics of 2-Dimensional SSIMT using a CMOS Process)

  • 송윤귀;이지현;최영식;김남호;류지구
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2003년도 추계학술대회 논문집 Vol.16
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    • pp.443-446
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    • 2003
  • A 2-Dimensional SSIMT(Suppressed Sidewall Injection Magnetotransistor) sensor with high linearity is presented in this paper. The prototype is fabricated by using the Hynix $0.6{\mu}m$ CMOS Process. The fabricated SSIMT shows that the variation of each collectors current are extremely linear by varing the magnetic induction from -200mT to 200mT at $I_B\;:\;1000{\mu}A,\;V_{CE}\;=\;5V\;and\;V_{SUB}\;=\;5V$. The relative sensitivity is up to 13%/T. At B = 0, magnetic offset is about 40mT, there relative sensitivity is 4.72%/T. The nonlinearity of the fabricated 2-D SSIMT is measured about 1.2%.

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