• Title/Summary/Keyword: SiC slurry

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The Frequency Characteristics of Elastic Wave by Crack Propagation of SiC/SiC Composites

  • Kim, J.W.;Nam, K.W.
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • 2012.10a
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    • pp.110-114
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    • 2012
  • We studied on the nondestructive evaluation of the elastic wave signal of SiC ceramics and SiC/SiC composite ceramics under monotonic tensile loading. The elastic wave signal of cross and unidirectional SiC/SiC composite ceramics were obtained by pencil lead method and bending test. It was applied for the time-frequency method which used by the discrete wavelet analysis algorithm. The time-frequency analysis provides time variation of each frequency component involved in a waveform, which makes it possible to evaluate the contribution of SiC fiber frequency. The results were compared with the characteristic of frequency group from SiC slurry and fiber. Based on the results, if it is possible to shift up and design as a higher frequency group, we will can make the superior material better than those of exiting SiC/SiC composites.

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Material Removal Rate Modeling of SiO2/TiO2 Mixed-Abrasive Slurry CMP for SiC (SiO2/TiO2 혼합입자 슬러리 SiC CMP의 재료제거율 모델링)

  • Hyunseop Lee
    • Tribology and Lubricants
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    • v.39 no.2
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    • pp.72-75
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    • 2023
  • Silicon carbide (SiC) is used as a substrate material for power semiconductors; however, SiC chemical mechanical polishing (CMP) requires considerable time owing to its chemical stability and high hardness. Therefore, researchers are attempting to increase the material removal rate (MRR) of SiC CMP using various methods. Mixed-abrasive CMP (MAS CMP) is one method of increasing the material removal efficiency of CMP by mixing two or more particles. The aim of this research is to study the mathematical modeling of the MRR of MAS CMP of SiC with SiO2 and TiO2 particles. With a total particle concentration of 32 wt, using 80-nm SiO2 particles and 25-nm TiO2 particles maximizes the MRR at 8 wt of the TiO2 particle concentration. In the case of 5 nm TiO2 particles, the MRR tends to increase with an increase in TiO2 concentration. In the case of particle size 10-25 nm TiO2, as the particle concentration increases, the MRR increases to a certain level and then decreases again. TiO2 particles of 25 nm or more continuously decreased MRR as the particle concentration increased. In the model proposed in this study, the MRR of MAS CMP of SiC increases linearly with changes in pressure and relative speed, which shows the same result as the Preston's equation. These results can contribute to the future design of MAS; however, the model needs to be verified and improved in future experiments.

Fabrication of Silica Nanoparticles by Recycling EMC Waste from Semiconductor Molding Process and Its Application to CMP Slurry (반도체 몰딩 공정에서 발생하는 EMC 폐기물의 재활용을 통한 실리카 나노입자의 제조 및 반도체용 CMP 슬러리로의 응용)

  • Ha-Yeong Kim;Yeon-Ryong Chu;Gyu-Sik Park;Jisu Lim;Chang-Min Yoon
    • Journal of the Korea Organic Resources Recycling Association
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    • v.32 no.1
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    • pp.21-29
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    • 2024
  • In this study, EMC(Epoxy molding compound) waste from the semiconductor molding process is recycled and synthesized into silica nanoparticles, which are then applied as abrasive materials contains CMP(Chemical mechanical polishing) slurry. Specifically, silanol precursor is extracted from EMC waste according to the ultra-sonication method, which provides heat and energy, using ammonia solution as an etchant. By employing as-extracted silanol via a facile sol-gel process, uniform silica nanoparticles(e-SiO2, experimentally synthesized SiO2) with a size of ca. 100nm are successfully synthesized. Through physical and chemical analysis, it was confirmed that e-SiO2 has similar properties compared to commercially available SiO2(c-SiO2, commercially SiO2). For practical CMP applications, CMP slurry is prepared using e-SiO2 as an abrasive and tested by polishing a semiconductor chip. As a result, the scratches that are roughly on the surface of the chip are successfully removed and turned into a smooth surface. Hence, the results present a recycling method of EMC waste into silica nanoparticles and the application to high-quality CMP slurry for the polishing process in semiconductor packaging.

Chemical Mechanical Polishing Characteristics with Different Slurry and Pad (슬러리 및 패드 변화에 따른 기계화학적인 연마 특성)

  • 서용진;정소영;김상용
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.52 no.10
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    • pp.441-446
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    • 2003
  • The chemical mechanical polishing (CMP) process is now widely employed in the ultra large scale integrated (ULSI) semiconductor fabrication. Especially, shallow trench isolation (STI) has become a key isolation scheme for sub-0.13/0.10${\mu}{\textrm}{m}$ CMOS technology. The most important issues of STI-CMP is to decrease the various defects such as nitride residue, dishing, and tom oxide. To solve these problems, in this paper, we studied the planarization characteristics using slurry additive with the high selectivity between $SiO_2$ and $Si_3$$N_4$ films for the purpose of process simplification and in-situ end point detection. As our experimental results, it was possible to achieve a global planarization and STI-CMP process could be dramatically simplified. Also, we estimated the reliability through the repeated tests with the optimized process conditions in order to identify the reproducibility of STI-CMP process.

Study on Surface Analysis of TEOS Film by Change of Slurry Temperature in CMP Process (CMP 공정중 TEOS 막의 슬러리 온도 변화에 따른 표면 분석 연구)

  • Ko, Pil-Ju;Kim, Nam-Hoon;Seo, Yong-Jin;Lee, Woo-Sun
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2005.07a
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    • pp.645-646
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    • 2005
  • The increasing hydroxyl ($OH^-$) groups diffused into the TEOS and then weakened reactants such as H-C-O-Si bonds on the surface of TEOS film were actively generated with the increase of slurry temperature. These soft reactants on the surface of TEOS film could be removed easily by mechanical parts of CMP.

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A Study on the Preparation of SiC Nano powder from the Si Waste of Solar Cell Industry (태양전지 산업(産業)에서 배출(排出)되는 Si waste로부터 SiC 분말 제조에 관한 연구(硏究))

  • Jang, Eun-Jin;Kim, Young-Hee;Lee, Yoon-Joo;Kim, Soo-Ryong;Kwon, Woo-Teck
    • Resources Recycling
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    • v.19 no.5
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    • pp.44-49
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    • 2010
  • SiC powders have been recovered from silicon-containing waste slurry by carbothermal reduction method with carbon black. Large amount of silicon-containing waste slurry is generated from Solar Cell industry. In an environmental and economic point of view, retrieve of the valuable natural resource from the silicon waste is important. In this study, SiC powder recovered by the reaction ball-milled silicon powder from waste and carbon black at $1350^{\circ}C$ for 3h under vacuum condition. Physical properties of samples have been characterized using SEM, XRD, Particle size analyzer and FT-IR spectroscopy.

SiC Synthesis by Using Sludged Si Power (폐슬러지 Si 분말을 이용한 SiC 제조)

  • 최미령;김영철;장영철
    • Journal of the Microelectronics and Packaging Society
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    • v.10 no.3
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    • pp.67-71
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    • 2003
  • Sawing silicon ingot with abrasive slurry generates sludge that includes abrasive powders, cutting oil, and silicon powders. The abrasive powders and cutting oil are being separated and reused. Mixing the remained stodged silicon powders with carbon powders and subsequent heat-treatment are conducted to produce silicon carbide. The size of SiC whiskers and powders was smaller than the conventionally grown silicon carbide whiskers that were synthesized by adding micron-size metal impurities. Impurity related mechanism is attributed to the formation of the silicon carbide whiskers, as metal impurities are contained in the stodged silicon powders.

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High Temeprature Strength Property of Continuous SiC Fiber Reinforced SiC Matrix Composites (SiC 장섬유 강화 SiC 기지 복합재료의 고온강도 특성)

  • Shin, Yun-Seok;Lee, Sang-Pil;Lee, Jin-Kyung;Lee, Joon-Hyun
    • Proceedings of the Korean Society For Composite Materials Conference
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    • 2005.04a
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    • pp.102-105
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    • 2005
  • The mechanical properties of $SiC_f/SiC$ composites reinforced with continuous SiC fiber have been investigated in conjunction with the detailed analysis of their microstructures. Especially, the effect of test temperature on the characterization of $SiC_f/SiC$ composites was examined. In this composite system, a braiding Hi-Nicalon SiC fibric was selected as a reinforcement. $SiC_f/SiC$ composites have been fabricated by the reaction sintering process, using the complex matrix slurry with a constant composition ratio of SiC and C particles. The characterization of $RS-SiC_f/SiC$ composites was investigated by means of SEM, EDS and three point bending test. Based on the mechanical property-microstructure correlation, the high temperature applicability of $RS-SiC_f/SiC$ composites was discussed.

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Characteristics of Meta-aramid Fabrics Coated with Slurry of Nanoscale SiC Particles (나노 탄화규소(SiC) 슬러리로 코팅된 메타-아라미드 직물의 특성)

  • Park, Jong Hyeon;Lee, Sun Young;Won, Jong Sung;Lee, Eung Bo;Kim, Eui Hwa;Lee, Seung Goo
    • Textile Coloration and Finishing
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    • v.29 no.3
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    • pp.131-138
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    • 2017
  • Most of high performance fabrics for the car racing protective clothing have been developed to have thermal resistance, flame retardant property, impact resistance and anti-frictional properties to protect the racer from the crucial accident. In this study, the meta-aramid fabric, which has inherent flame retardant, was coated with nanoparticles of SiC to enhance the impact resistance and anti-friction properties. Uniform coating of the nanoparticles onto the fabrics was obtained by using tape casting method. As the experimental parameters, size and content of the SiC nanoparticle were varied with the coating conditions of the fabric surface. The effects of the nanoparticle coating on the properties of meta-aramid fabric were examined with various instrumental analyses such as SEM, tensile strength and abrasion test.

Characterization of SiC-SiC Whisker Matrix Retaining Electrolyte in Phosphoric Acid Fuel Cell (인산형 연료전지용 SiC-SiC Whisker 전해질 매트릭스의 특성)

  • 윤기현;이현임;이근행;김창수
    • Journal of the Korean Ceramic Society
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    • v.29 no.8
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    • pp.587-592
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    • 1992
  • Sheets of SiC-SiC whisker maxed matrix were prepared from the mixed slurry of SiC whisker and SiC matrix by the rolling method. With the increase of SiC whisker, the pore size, the porosity and the phosphoric acid absorbency of the matrix were increased, while the bubble pressure was decreased. The activation energy for the transfer of H+ ion was decreased with the increase of mixing ratio of SiC whisker to the SiC matrix from the measurement of hydrogen ion conductivity. The activation energy was evaluated as 0.25 eV when the mixing ratio of SiC whisker to the SiC matrix was 1 : 2 and the activation energy was 0.16 eV for the 2 : 1 matrix. It means that SiC whisker matrix contributes to attain a better microstructure for the diffusion of hydrogen ion. From the measurement of single cell performance of matrix with various mixing ratio, it is concluded that if SiC-SiC whisker maxed matrix has a sufficient bubble pressure to prevent the crossover of H2 gas, the current density of a fuel cell is increased with the increase of acid absorbency of the matrix. Current density was improved from 140 mA/$\textrm{cm}^2$ for 0.25 mm thickness of matrix to 170 mA/$\textrm{cm}^2$ for the 0.20 mm one at 700 mV.

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