• Animal cells and systems
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• v.3 no.2
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• pp.229-236
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• 1999

The recA gene plays a central role in genetic recombination and SOS DNA repair in Escherichia coli (E. coli). We have previously identified a 42 kDa RecA-like protein inducible by a variety of DNA damages from a fluorescent Pseudomonas strain sp. and characterized its inducible kinetics. In the present study, we cloned and characterized the gene encoding the RecA-like protein by immunological screening of Pseudomonas genomic expression library using polyclonal E. coli anti-RecA antibodies as a probe. From 10$^{5}$ plaques screened, five putative clones were finally isolated. Southern blot analysis indicated that four clones had the same DNA inserts and the recA-like gene was located within the 3.2 kb EcoRI fragment of Pseudomonas chromosomal DNA. In addition, the cloned recA-like gene was transcribed into an RNA transcript approximately 1.1 kb in size, as judged by Northern blot analysis. The cellular level of RNA transcript of the cloned recA-like gene was increased to an average of 5.15- fold upon treatment with DNA damaging agents such as ultraviolet (UV)- light, nalidixic acid (NA), methyl methanesulfonate (MMS), and mitomycin-C (MMC). These results suggest that the cloned gene is inducible by DNA damage similarly to the recA gene in E. coli. However, the cloned gene did not restore the DNA damage sensitivity of the E. coli recA-mutant.

• Journal of the Korean Magnetics Society
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• v.9 no.4
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• pp.196-202
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• 1999

The magnetic properties and the microstructures of the Mn-Ir/Ni-Fe multilayers with various stacking structures and buffer layer materials have been investigated. The (111) texture of Mn-Ir/Ni-Fe was observed in the top structures with Ta, Zr, or Ti buffer materials. However, all Mn-Ir/Ni-Fe multilayers with top structures exhibit high $H_{ex}$, regardless of the (111) preferred orientation of Mn-Ir film. The samples whose high $H_{ex}$ observed grain-to-grain epitaxial tendency and the large grain of Mn-Ir film at the interface. It can be explained that the $H_{ex}$ does not depend on the (111) texture of the Mn-Ir film and the interface roughness, but depends on the grain size of the Mn-Ir film and the morphology of the interface between the Mn-Ir and the Ni-Fe grains, and the $H_c$ depends on the interface roughness between the Mn-Ir and the Ni-Fe films.

• Journal of Ecology and Environment
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• v.32 no.2
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• pp.87-96
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• 2009

Pinus thunbergii plantations in Pohang-si, Gyeongsangbuk-do, Korea, are of low ecological quality, with arrested succession and a high proportion of ruderal species. To improve the quality of the habitat, we created canopy gaps ($\sim42\;m^2$) and monitored changes in abiotic (light availability, canopy openness) and biotic (survival and growth of seedlings and understory communities) variables in 2007 and 2008 in plots that had received one of five types of treatment: cutting of canopy trees and removal of the understory (CU), cutting of canopy trees only (C), girdling of canopy trees and removal of the understory (GU), girdling of canopy trees (G) or control. Each treatment was applied to three replicate plots. Abiotic variables did not significantly differ among treatments. Survival rates of target species were slightly lower in the CU, G and control conditions. Based on logistic regression analysis, the only significant growth factor affecting survival was height growth. Positive effects of seedling height and leaf area growth on survival were also detected, but did not reach statistical significance. In treatment G, gradual improvement of overstory conditions and mitigation of competition by limitation of disturbance to the understory community were likely to have promoted seedling growth. There were no significant effects of gap treatments on changes in species abundance (cover and richness) and composition of understory between the study years. This result implies that the small gaps created in our study may be below the threshold size to affect understory growth. However, the results of this study are based on a short-term investigation of only two years. Long-term research is strongly recommended to clarify the effects of gap treatment on plant communities in afforested areas.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.10a
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• pp.301-301
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• 2003

In current study, Nanocomposites are reinforced with carbon nanofiber, carbon nanotube and SiC, etc. Since the nano reinforcements have the excellent mechanical, thermal and electrical properties compared with that of existing composites, it has lately attracted considerable attention in the various areas. Cu have been widely used as signal transmission materials for electrical electronic components owing to its high electrical conductivity. However, it's size have been limited to small ones due to its poor mechanical properties. Until now, strengthening of the copper alloy was obtained either by the solid solution and precipitation hardening by adding alloy elements or the work hardening by deformation process. Adding the alloy elements lead to reduction of electrical conductivity. In this aspect, if carbon nanofiber is used as reinforcement which have outstanding mechanical strength and electric conductivity, it is possible to develope Cu matrix nanocomposite having almost no loss of electric conductivity. It is expected to be innovative in electric conducting material market. The unidirectional alignment of carbon nanofiber is the most challenging task developing the cooer matrix composites of high strength and electric conductivity. In this study, the unidirectional alignment of carbon nanofibers which is used reinforced material are controlled by drawing process and align mechanism as well as optimized drawing process parameter are verified via numerical analysis. The materials used in this study were pure copper and the nanofibers of 150nm in diameter and of 10∼20$\mu\textrm{m}$ in length. The materials have been tested and the tensile strength was 75MPa with the elongation of 44% for the copper. it is assumed that carbon nanofiber behave like porous elasto-plastic materials. Compaction test was conducted to obtain constitutive properties of carbon nanofiber Optimal parameter for drawing process was obtained by analytical and numerical analysis considering the various drawing angles, reduction areas, friction coefficient, etc. The lower drawing angles and lower reduction areas provides the less rupture of co tube is noticed during the drawing process and the better alignment of carbon nanofiber is obtained.

• Journal of Powder Materials
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• v.16 no.5
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• pp.326-335
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• 2009

Fe based (Fe$_{68.2}$C$_{5.9}$Si$_{3.5}$B$_{6.7}$P$_{9.6}$Cr$_{2.1}$Mo$_{2.0}$Al$_{2.0}$) amorphous powder, which is a composition of iron blast cast slag, were produced by a gas atomization process, and sequently mixed with ductile Cu powder by a mechanical ball milling process. The Fe-based amorphous powders and the Fe-Cu composite powders were compacted by a spark plasma sintering (SPS) process. Densification of the Fe amorphous-Cu composited powders by spark plasma sintering of was occurred through a plastic deformation of the each amorphous powder and Cu phase. The SPS samples milled by AGO-2 under 500 rpm had the best homogeneity of Cu phase and showed the smallest Cu pool size. Micro-Vickers hardness of the as-SPSed specimens was changed with the milling processes.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.212-212
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• 2009

Thermoelectric devices were used to wide range of application. At present, increasing the efficiency of these devices, in particular, through the preparation of materials showing a high thermoelectric figure of merit, Z, $Bi_2Te_3$ and $Sb_2Te_3$ thin films on Si substrates are deposited by flash evaporation method for thermopile sensor applications. In order to enhance the thermoelectric properties of the thin film, annealing in high vacuum is carried out in the temperature range from 200 to $350^{\circ}C$. The microstructure of the film is investigated by XRD and SEM. The resistivity and Seebeck coefficient of the films are measured by Van der Pauw method and hot probe method respectively. At elevating annealing temperature, the crystallinity and thermoelectrical properties of films are improved by increasing the size of grains. At excessive high annealing temperatures, it is shown that Seebeck coefficient of films is decreased because of Te evaporation. By optimizing the annealing conditions, it is possible to obtain a high performance thin film with a thermoelectric properties.

• Journal of Microbiology and Biotechnology
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• v.14 no.5
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• pp.1057-1062
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• 2004

The entomopathogenic bacterium Bacillus thuringiensis is the most widely used biopesticide. Insecticidal proteins, coded by genes located in plasmids, form typical parasporal, crystalline inclusions during sporulation. We isolated a Bacillus thuringiensis strain having insecticidal activity against larvae of the house fly (M. domestica) from the soils at a pig farm in Korea, and named it Bacillus thuringiensis SM. The culture filtrate from Bacillus thuringiensis SM showed strong lethality (83.3%) against M. domestica larvae. The parasporal crystal is enclosed within the spores' outermost envelope, as determined by transmission electron microscopy, and exhibited a bipyramidal form. The crystal proteins of strain SM consisted of five proteins with molecular weights of approximately ~130, ~80, ~68, ~42, and ~27 kDa on a 10% SDS-PAGE (major band, a size characteristic of Cry protein). Examination of antibiotic resistance revealed that the strain SM showed multiple resistant. The strain SM had at least three different plasmids with sizes of 6.6, 9.3, and 54 kb. Polymerase chain reactions (PCRs) revealed the presence of cry1, cry4A2, and cry11A1 genes in the strain SM. The cry1 gene profile of the strain SM appeared in the three respective products of 487 bp [cry1A(c)], 414 bp [cry1D], and 238 bp [cry1A(b)]. However, the strain SM has not shown the cry4A2 md cry11A1 genes. In in vivo toxicity assays, the strain SM showed high toxicity on fly larvae (M. domestic) [with $LC_{50}$ of 4.2 mg/ml, $LC_{90}$ of 8.2 mg/ml].

• Journal of Powder Materials
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• v.22 no.3
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• pp.197-202
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• 2015

In this study, porous stainless steel (STS316L) sintered body was fabricated by powder metallurgy method and its properties such as porosity, compressive yield strength, hardness, and permeability were evaluated. 67.5Fe-17Cr- 13Ni-2.5Mo (wt%) powder was produced by a water atomization. The atomized powder was classified into size with under $45{\mu}m$ and over $180{\mu}m$, and then they were compacted with various pressures and sintered at $1210^{\circ}C$ for 1 h in a vacuum atmosphere. The porosities of sintered bodies could be obtained in range of 20~53% by controlling the compaction pressure. Compressive yield strength and hardness were achieved up to 268 MPa and 94 Shore D, respectively. Air permeability was obtained up to $79l/min{\cdot}cm^2$. As a result, mechanical properties and air permeability of the optimized porous body having a porosity of 25~40% were very superior to that of Al alloy.

• Journal of the Korean Vacuum Society
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• v.21 no.5
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• pp.225-232
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• 2012

It is described that the proton beam induceds micro-size defects and electronic deep levels in n or p type single crystal silicon. Positron lifetime and Coincidence Doppler Broadening Positron Annihilation Spectroscopy were applied to study of characteristics of p type and n type silicon samples. In this investigation the numerical analysis of the Doppler spectra was employed to the determination of the shape parameter, S, defined as the ratio between the amount of counts in a central portion of the spectrum and the total counts of whole spectrum. The samples were exposed by 3.98 MeV proton beams ranging between 0 to ${\sim}10^{14}$ particles. The S-parameter values strongly depend on the irradiated proton beam, that indicated the defects generate more. Positron lifetime shows that positrons trapped in vacancies and lifetime ${\tau}_2$ increased according to proton irradiation.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.1 s.34
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• pp.9-16
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• 2005

This paper presents the development of new anisotropic conductive adhesives with enhanced thermal conductivity for the wide use of adhesive flip chip technology with improved reliability under high current density condition. The continuing downscaling of structural profiles and increase in inter-connection density in flip chip packaging using ACAs has given rise to reliability problem under high current density. In detail, as the bump size is reduced, the current density through bump is also increased. This increased current density also causes new failure mechanism such as interface degradation due to inter-metallic compound formation and adhesive swelling due to high current stressing, especially in high current density interconnection, in which high junction temperature enhances such failure mechanism. Therefore, it is necessary for the ACA to become thermal transfer medium to improve the lifetime of ACA flip chip joint under high current stressing condition. We developed thermally conductive ACA of 0.63 W/m$\cdot$K thermal conductivity using the formulation incorporating $5 {\mu}m$ Ni and $0.2{\mu}m$ SiC-filled epoxy-bated binder system to achieve acceptable viscosity, curing property, and other thermo-mechanical properties such as low CTE and high modulus. The current carrying capability of ACA flip chip joints was improved up to 6.7 A by use of thermally conductive ACA compared to conventional ACA. Electrical reliability of thermally conductive ACA flip chip joint under current stressing condition was also improved showing stable electrical conductivity of flip chip joints. The high current carrying capability and improved electrical reliability of thermally conductive ACA flip chip joint under current stressing test is mainly due to the effective heat dissipation by thermally conductive adhesive around Au stud bumps/ACA/PCB pads structure.