• Journal of Fisheries and Marine Sciences Education
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• v.27 no.4
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• pp.1084-1091
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• 2015

Aquaculture of olive flounder started in the middle of 1980's and now farming has been taken place in many places along the coastal line in Korea. The taste of olive flounder has a good chewy texture because of high collagen content, low fat content, so it is popular for sliced raw fish. Olive flounder is popular among Koreans but the consumption pattern is uniformly so as to be used as sliced raw fish but not other ways. So, now there needs to develop high valued-processed food using olive flounder. This study was set to investigate the processing of terrine by using olive flounder, in which terrine is French style meat loaf that is well favored around the world. In this study, terrine was prepared by chopping olive flounder meat with 39 g egg white and 10 mL fresh cream (per 50 g fillet) and then seasoned with 5 mL lemon juice, 5 mL brandy, 0.05 g salt and 0.05 g pepper. The 25 g of dough was placed on a vinyl wrap, put with 2 g cheese, and layered an another 25 g dough, and then rolled up and wrapped by aluminium foil. Two different cooking methods were used for terrine processing in this study. Terrine-1 was cooked by vacuum sealed in polyethylene film ($20{\times}30{\times}0.05mm$) after boiling for 5 min and stored at $-20^{\circ}C$ for 7 days. Terrine-2 was prepared by vacuum sealed in polyethylene film ($20{\times}30{\times}0.05mm$) and stored at $-20^{\circ}C$ for 7 days. After 7 days, Terrine-1 was thawed and then heated up in microwave for 2 min (Sample-1), while Terrine-2 was thawed and then boiled in water for 5 min (Sample-2). Viable bacterial count, chemical composition, pH, salinity, hardness, TBA, free amino acid content, and sensory evaluation were measured for both Sample-1 and Sample-2. Especially, the scores of sensory evaluation of Sample-2 is slightly higher than that of Sample-1. On the other hand, there were no significant differences on color, odor, taste, texture, and overall acceptance between Sample-1 and Sample-2.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.24 no.6
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• pp.229-236
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• 2014

A stoichiometric mixture of evaporating materials for $MnAl_2S_4$ single crystal thin films was prepared from horizontal electric furnace. To obtain the single crystal thin films, $MnAl_2S_4$ mixed crystal was deposited on thoroughly etched semi-insulating GaAs(100) substrate by the Hot Wall Epitaxy (HWE) system. The source and substrate temperatures were $630^{\circ}C$ and $410^{\circ}C$, respectively. The crystalline structure of the single crystal thin films was investigated by the photoluminescence and double crystal X-ray diffraction (DCXD). The temperature dependence of the energy band gap of the $MnAl_2S_4$ obtained from the absorption spectra was well described by the Varshni's relation, $E_g(T)=3.7920eV-5.2729{\times}10^{-4}eV/K)T^2/(T+786 K)$. In order to explore the applicability as a photoconductive cell, we measured the sensitivity (${\gamma}$), the ratio of photocurrent to dark current (pc/dc), maximum allowable power dissipation (MAPD) and response time. The results indicated that the photoconductive characteristic were the best for the samples annealed in S vapour compare with in Mn, Al, air and vacuum vapour. Then we obtained the sensitivity of 0.93, the value of pc/dc of $1.10{\times}10^7$, the MAPD of 316 mW, and the rise and decay time of 14.8 ms and 12.1 ms, respectively.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.287.1-287.1
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• 2016

Three-dimensional (3-D) semiconductor nanoarchitectures, including nano- and micro- rods, pyramids, and disks, are emerging as one of the most promising elements for future optoelectronic devices. Since these 3-D semiconductor nanoarchitectures have many interesting unconventional properties, including the use of large light-emitting surface area and semipolar/nonpolar nano- or micro-facets, numerous studies reported on novel device applications of these 3-D nanoarchitectures. In particular, 3-D nanoarchitecture devices can have noticeably different current spreading characteristics compared with conventional thin film devices, due to their elaborate 3-D geometry. Utilizing this feature in a highly controlled manner, color-tunable light-emitting diodes (LEDs) were demonstrated by controlling the spatial distribution of current density over the multifaceted GaN LEDs. Meanwhile, for the fabrication of high brightness, single color emitting LEDs or laser diodes, uniform and high density of electrical current must be injected into the entire active layers of the nanoarchitecture devices. Here, we report on a new device structure to inject uniform and high density of electrical current through the 3-D semiconductor nanoarchitecture LEDs using metal core inside microtube LEDs. In this work, we report the fabrications and characteristics of metal-cored coaxial $GaN/In_xGa_{1-x}N$ microtube LEDs. For the fabrication of metal-cored microtube LEDs, $GaN/In_xGa_{1-x}N/ZnO$ coaxial microtube LED arrays grown on an n-GaN/c-Al2O3 substrate were lifted-off from the substrate by wet chemical etching of sacrificial ZnO microtubes and $SiO_2$ layer. The chemically lifted-off layer of LEDs were then stamped upside down on another supporting substrates. Subsequently, Ti/Au and indium tin oxide were deposited on the inner shells of microtubes, forming n-type electrodes of the metal-cored LEDs. The device characteristics were investigated measuring electroluminescence and current-voltage characteristic curves and analyzed by computational modeling of current spreading characteristics.

• Journal of the Korean Vacuum Society
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• v.16 no.2
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• pp.134-140
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• 2007

Optical structure of $V_{2}O_{5}$ thin films were analyzed and confirmed, the films were deposited in oxygen partial pressure 0% and 10% by RF magnetron sputtering system. Measurements of the elliptic constants were made in the range of $0.75{\sim}4.0\;eV$ by using phase modulated spectroscopic ellipsometer. The elliptic constants of the thin films were analyze by Double Amorphous dispersion relation. The calculated n, k spectra of $V_{2}O_{5}$ layer were obtained over the range of $0.75{\sim}4.0\;eV$ photon energy. SEM and XRD measurements were also made to validate the ellipsometric analysis and they give good agreement with the structural properties of the films. It was found that optical structure of the $V_{2}O_{5}$ layer has a 3 phase(roughness/film/substrate) and optical absorption properties are greatly depend on the partial pressure of the oxygen.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.431-432
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• 2012

In the era of 20 nm scaled semiconductor volume manufacturing, Microelectronics Manufacturing Engineering Education is presented in this paper. The purpose of microelectronic engineering education is to educate engineers to work in the semiconductor industry; it is therefore should be considered even before than technology development. Three Microelectronics Manufacturing Engineering related courses are introduced, and how undergraduate students acquired hands-on experience on Microelectronics fabrication and manufacturing. Conventionally employed wire bonding was recognized as not only an additional parasitic source in high-frequency mobile applications due to the increased inductance caused from the wiring loop, but also a huddle for minimizing IC packaging footprint. To alleviate the concerns, chip bumping technologies such as flip chip bumping and pillar bumping have been suggested as promising chip assembly methods to provide high-density interconnects and lower signal propagation delay [1,2]. Aluminum as metal interconnecting material over the decades in integrated circuits (ICs) manufacturing has been rapidly replaced with copper in majority IC products. A single copper metal layer with various test patterns of lines and vias and $400{\mu}m$ by $400{\mu}m$ interconnected pads are formed. Mask M1 allows metal interconnection patterns on 4" wafers with AZ1512 positive tone photoresist, and Cu/TiN/Ti layers are wet etched in two steps. We employed WPR, a thick patternable negative photoresist, manufactured by JSR Corp., which is specifically developed as dielectric material for multi- chip packaging (MCP) and package-on-package (PoP). Spin-coating at 1,000 rpm, i-line UV exposure, and 1 hour curing at $110^{\circ}C$ allows about $25{\mu}m$ thick passivation layer before performing wafer level soldering. Conventional Si3N4 passivation between Cu and WPR layer using plasma CVD can be an optional. To practice the board level flip chip assembly, individual students draw their own fan-outs of 40 rectangle pads using Eagle CAD, a free PCB artwork EDA. Individuals then transfer the test circuitry on a blank CCFL board followed by Cu etching and solder mask processes. Negative dry film resist (DFR), Accimage$^{(R)}$, manufactured by Kolon Industries, Inc., was used for solder resist for ball grid array (BGA). We demonstrated how Microelectronics Manufacturing Engineering education has been performed by presenting brief intermediate by-product from undergraduate and graduate students. Microelectronics Manufacturing Engineering, once again, is to educating engineers to actively work in the area of semiconductor manufacturing. Through one semester senior level hands-on laboratory course, participating students will have clearer understanding on microelectronics manufacturing and realized the importance of manufacturing yield in practice.

• Korean Journal of Fisheries and Aquatic Sciences
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• v.49 no.6
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• pp.743-749
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• 2016

We compared two different processing methods for preparing high quality frozen in-shell baby clam products. In the first method, sand and mud were removed from the clams, then they were vacuum packed in polyethylene film, boiled at $97^{\circ}C$ for 6 min, and snap frozen in a cold air blast freezer (sample 1). The second processing method was similar, except the boiling process was excluded (sample 2). Both frozen products were boiled for 4 min, and then shucked and minced. Various quality metrics, such as the opening rates of shells, chemical composition, pH, volatile basic nitrogen (VBN), salinity, thiobarbituric acid (TBA), amino-N, total amino acids and free amino acids were measured, and sensory evaluation was conducted. The opening rates of shells of sample 1 and sample 2 were 98.3% and 4.67%, respectively. The proximate composition of sample 1 and sample 2 was 75.2% and 78.7% moisture, 19.7% and 16.2% crude protein, 2.45 and 2.2% crude lipid, 2.8% and 2.1% ash, and 2.1% and 1.9% salinity, respectively. The L, a, b and ${\Delta}E$ values were similar: 48.6 and 49.2, 3.9 and 3.9, 15.7 and 15.5, and 50.7 and 50.1 for sample 1 and sample 2, respectively. The sensory evaluation score of sample 1 was higher than that of sample 2. Sample 1 was deemed to be superior to sample 2; therefore, we determined that the boiling process is needed for manufacturing high-quality frozen clam products.

• Restorative Dentistry and Endodontics
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• v.23 no.1
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• pp.68-93
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• 1998

The physical properties of polymer are greatly influenced by the extent to which a resin cures. The presence of un reacted monomer can, have a plasticizing effect on the polymer, thereby altering the physical and mechanical properties of dentin bonding agent (DBA). If the DBA does not polymerize sufficiently, it will leave a weak bonding layer and lead to lower bond strength. The purpose of this study was to evaluate the shear bond strengths(SBS) and the degree of conversion (DC) of 4 commercialy avilable dentin bonding systems which are composed of 2 multi-bottle systems [Scotchbond Multi-Purpose (SMP), AeliteBond(AB)] and 2 onebottle systems [SingleBond(SB), One-Step(OS)]. For shear bond strength measurement, labial surfaces of freshly extracted bovine incisors were ground with # 600 grit SiC paper to expose dentin. Four different groups of samples were formed, with 10 samples. being made for each of the 4 commercial DBA in each group according to the curing sequences of DBA and overlayer thickness of composites: Group I (standard cure and 1mm thick composites) : The DBA was light cured and the composites of 1mm thickness was applied ; Group II (standard cure and 2mm thick composites) : The DBA was light cured and the composites of 2mm thickness was applied; Group III (simultaneous cure and 1mm thick composites) : The DBA was not light-cured and simultaneously cured with composites of 1mm thickness; Group N (simultaneous cure and 2mm thick composites) : The DBA was. not light-cured and simultaneously cured with composites of 2mm thickness. The SBS was measured immediately after the composites was bonded to the bovine dentin using an Instron machine. The DC of the DBA was examined in a thin film under simulated conditions of the experimental groups according to the curing sequences and overlayer thickness of composites in the SBS test. using a Fourier transform Infrared(FTIR) spectrometer. The following results were obtained from SBS tests and DC measurements 1. In SBS tests, the multi-bottle DBA(SMP, AB) had a generally higher bond strength values than the one bottle DBA(SB, OS). In DC measurements, the one bottle DBA(SB, OS) had a significantly higher DC than the multi-bottle DBA(SMP, AB). 2. In all DBAs except OS, there was no significant difference between the bond strength of group I (standard cure and 1mm thick composites) and that of group III (simultaneous cure and 1mm thick composites). SMP, SB in Group I had a significantly higher DC than those in group III, but AB, OS in group I had a significantly lower DC than those in group III 3. All DBAs in Goup II (standard cure and 2mm thick composites) had significantly higher bond strength and DC than those in Group N (simultaneous cure and 2mm thick composites). 4. In all DBAs, there was no significantly different SBS and DC between Group I and Group II, but all DBAs in Group III had significantly higher SBS and DC than those in Group IV.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.32 no.1
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• pp.7-11
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• 2022

Recently, Hanmi Gemological Institute & Laboratory (HGI) had an opportunity to examine 5 transparent synthetic moissanite. The round brilliants ranged from 0.93 to 0.96 ct and had a colorless, pink, yellow, blue, and red color. Advanced testing results, including Fourier-transform infrared (FTIR) and Raman spectroscopy, identified all the specimens as synthetic moissanite. Under the microscope, all samples except the colorless were confirmed to be a synthetic moissanite coated with a colored film. EDXRF chemical analysis detected very weak X-ray fluorescence peak characteristics of Ca, Ti, and Co in the colored samples. These features were not detected in the colorless sample. Raman spectroscopy investigation was unable to detect the 1332 cm^-1 (produced by sp³ bonding of carbon atoms) or the ~1550 cm^-1 (produced by graphite-related sp² bonding) peak in the colorless sample. The SEM image of the colorless sample showed no indication of a coating. The TEM image of the colorless sample revealed the presence of a 3~8 nm thick layer on the moissanite. Moreover, from the corresponding STEM Z-contrast image combined with the energy-dispersive X-ray spectroscopy (EDX) line profiles and EDX elemental maps, this layer was estimated to be carbon, silicon and oxygen.

• Journal of Korean Society of Environmental Engineers
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• v.28 no.4
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• pp.438-446
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• 2006

A lab-scale batch test was conducted to develop capping materials to reduce the sediment phosphorus in the stagnant water zone of Gyeongancheon in Paldang Lake. The mean grain size(Mz) of sediment in the investigated area was 7.7 ${\phi}$, which is very fine, and the contents of organic carbon($C_{org}$) was 2.4%, which is very high. For the phosphorous release experiment to select the optimal capping material, sand layer, powder-gypsum($CaSO_4{\cdot}2H_2O$), granule-gypsum, complex layer(gypsum+sand) and the control were compared and evaluated in the 150 L reactor for 45 days. In case of the capping with the sand, it was found that the phosphorous from the sediment could be reduced by around 50%. However, it was found that this caused the reduction of the dissolved oxygen in the water column(by less than 3 mg/L) due to the resuspension of sediment and the organic matter decomposition that comes from the generation of $CH_4$ gas in the 1 cm of the sand layer. Therefore, it is likely that the sand layer has to be thickener in case of the sand capping. Powder-gypsum and granule-Gypsum reduced phosphorous release by more than 80%. However, the concentration of ${SO_4}^{2-}$ in the water column increased, making it difficult to apply it to the drinking water protection zone. We developed Fe-Gypsum and $SiO_2$-gypsum materials to reduce the solubility of ${SO_4}^{2-}$. Powder-Gypsum creates the interception film that does not have any aperture on the sediment layer when it is combined with the water. However phosphorous release caused by the generation of $CH_4$ gas may happen at a time when the gypsum layer has the crack. Capping through the complex layer(granule-Gypsum+sand(1 cm)) found to be suitable for the drinking water protection zone because it was effective to prevent phosphorus release. Moreover, this leads to the lower solubility from the concentration of ${SO_4}^{2-}$ into the water column than the powder-Gypsum and granule-Gypsum. The addition of gypsum($CaSO_4{\cdot}2H_2O$) into the sediment can reduce the progress of methanogensis because fast early diagenesis and sufficient supply of ${SO_4}^{2-}$ to the sediment, stimulate the SRB(sulfate reducing bacteria) highly.