• Proceedings of the Korean Vacuum Society Conference
• /
• 2010.02a
• /
• pp.381-381
• /
• 2010

$(ZrO_2)_{0.66}(HfO_2)_{0.34}$ thin films as gate dielectrics have been proposed to overcome the problems of tunneling current and degradation mobility inachieving a thin equivalent oxide thickness. An extremely thin $SiO_2$ layer is used in order to separate the carrier in MOSFET channel from the dielectric field fluctuation caused by phonons in the dielectric which decreases the carrier mobility. The electronic and optical properties influenced the device performance to a great extent. $(ZrO_2)_{0.66}(HfO_2)_{0.34}$ dielectric films on p-Si (100) were grown by atomic layer deposition method, for which the conduction band offsets, valence band offsets and band gapswere obtained by using X-ray photoelectron spectroscopy and reflection electron energy loss spectroscopy. The band gap, valence and conduction band offset values for $(ZrO_2)_{0.66}(HfO_2)_{0.34}$ dielectric thin film, grown on Si substrate were about 5.34, 2.35 and 1.87 eV respectively. This band alignment was similar to that of $ZrO_2$. In addition, The dielectric function (k, $\omega$), index of refraction n and the extinction coefficient k for the $(ZrO_2)_{0.66}(HfO_2)_{0.34}$ thin films were obtained from a quantitative analysis of REELS data by comparison to detailed dielectric response model calculations using the QUEELS-$\varepsilon$(k, $\omega$)-REELS software package. These optical properties are similar with $ZrO_2$ dielectric thin films.

• Journal of the Korean Society of Radiology
• /
• v.3 no.2
• /
• pp.11-16
• /
• 2009

Mercury Iodide as good sensitivity at radiation and has an easy peculiarity that operates at low voltage for other photoconductors(a-Se, a-Si, Ge, etc) Based on this characteristic, we studied about an efficiency of the digital x-ray detector in acccordance with the thickness of photoconductor. To solve the problem that is difficult to make a large area film using PVD(Physical Vapor Deposition)method, we used a PIB(Particle In Binder)method. To make a binder paste, we used a PVB(Polyvinylbutyral) as a binder and a DGME(Diethylene Glycol Monobutyl Ether), DGMEA(Diethylene Glycol Monobutyl Ether Acetate) as a solvent. Using this binder paste, we made a polycrystal mercury iodide film that has an each thickness. To evaluate the electrical properties of this films, we measured a darkcurrent, sensitivity and SNR(Signal to Noise Ratio). Mercury iodide film of the 200um thickness has good electrical properties as a result of the measurement. From this result there is a good chance that replace the existing a-Se(Amnorphous seleinum; a-se) with the mercury iodide.

• Korean Journal of Materials Research
• /
• v.11 no.4
• /
• pp.290-293
• /
• 2001

The SrBi$_2$Nb$_2$O$_{9}$ (SBN) thin films were deposited on p-type(100) Si substrates by rf magnetron sputtering to confirm the Possibility of Pt/SBN/Si structure for the application of nondestructive read out ferroelectric random access memory (NDRO- FRAM). The SBN thin films were deposited by co-sputtering method with Sr$_2$Nb$_2$O$_{7}$ (SNO) and Bi$_2$O$_3$ ceramic targets. The SBN thin films deposited at room temperature were annealed at $700^{\circ}C$ for 1hr in $O_2$ ambient. The structural and electrical properties of SBN with different power ratios of targets were measured by x-ray diffraction(XRD), scanning electron microscopy(SEM), capacitance-voltage(C-V), and current-voltage(I-V). The C-V curves of the SBN films showed hysteresis curves of a clockwise rotation showing ferroelectricity. When the Power ratio of the SNO/Bi$_2$O$_3$ targets was 120 W/100 W, the SBN thin films had excellent electrical properties. The memory window of SBN thin film was 1.8 V-6.3 V at applied voltage of 3 V-9 V and the leakage current density was 1.5 $\times$ 10$^{-7}$ A/$\textrm{cm}^2$ at applied voltage of 5 V The composition of SBN thin films was analysed by electron probe X-ray micro analyzer(EPMA) and the atomic ratio of Sr:Bi:Nb with pawer ratio of 120 W/100 W was 1:3:2.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2012.08a
• /
• pp.307-307
• /
• 2012

In this study, we investigated that the resistance switching characteristics of Al-doped MgOx films with increasing Al doping concentration and increasing film thickness. The Al-doped MgOx based ReRAM devices with a TiN/Al-doped MgOx/Pt/Ti/SiO2 were fabricated on Si substrates. The 5 nm, 10 nm, and 15 nm thick Al-doped MgOx films were deposited by reactive dc magnetron co-sputtering at $300^{\circ}C$ and oxygen partial ratio of 60% (Ar: 16 sccm, O2: 24 sccm). Micro-structure of Al-doped MgOx films and atomic concentration were investigated by XRD and XPS, respectively. The Al-doped MgOx films showed set/reset resistance switching behavior at various Al doping concentrations. The process voltage of forming/set is decreased and whereas the initial current level is increased with decreasing thickness of Al-doped MgOx films. Besides, the initial current of Al-doped MgOx films is increased with increasing Al doping concentration in MgOx films. The change of resistance switching behavior depending on doping concentration was discussed in terms of concentration of non-lattice oxygen of Al-doped MgOx.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.15 no.6
• /
• pp.504-510
• /
• 2002

Recently, thin film capacitors of high dielectric constant and low leakage current are applied to integrated devices. In this study, (Ba, Sr)$TiO_3$ (BST) thin films for low cost were prepared by Sol-Gel method. BST solution was spin-coated on Pt/$SiO_2$/Si substrate at 4,000 rpm for 10 seconds. Coating process was repeated 3 times and then sintered at $700^{\circ}C$ for 30 minutes. Structural and electrical characteristics of each specimen were analyzed by TG-DTA, SEM, fractal phenomenon, voltage-current and dielectric factor. Thickness of BST ceramics thin films are about 2,600~2,800 ${\AA}$ at depositing 3 times. Dielectric constant of thin films was decreased in 1 kHz~1 MHz. Dielectric constant and loss to frequency were 250 and 0.02 in $(Ba_{0.7}Sr_{0.3})TiO_3$ (BST3). Leakage current of BST3 was $10^{-9}\sim10^{-11}$/ A under 3 V.

• Proceedings of the KIEE Conference
• /
• 1991.11a
• /
• pp.299-303
• /
• 1991

A lamp heated LPCVD equipment has been made. Wafer is heated by an array of fifteen tungsten halogen lamps above the front side of a wafer and pyrometer views the back side of the wafer through $CaF_2$ window. Reactor which consisits of a quartz window and a water cooled-stainless steel plate can be evacuated to $5{\times}10^{-3}$ torr with a rotary vane pump. By pyrolysis of $SiH_4$ at about $600^{\circ}C$, polysilicon has been formed on the silicon dioxide film. The measured results show that thickness nonuniformity is 15% and temperature nonuniformity is 1.1%. Because activation energy of pyrolysis of $SiH_4$ is very high, about 1.8eV, small temperature variation will induce large thickness nonuniformity. The main cause of temperature nonuniformity is unsymmetry of lamp power and an unbalanced cooling structure. Charls & Evans' SIMS result shows that the oxygen content in the deposited polysilicon is comparable to that of silicon substrate but carbon content is ten times higher.

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2011.10a
• /
• pp.37.1-37.1
• /
• 2011

1990년 나카무라 연구팀에서 청색이 개발된 이래로 LED는 눈부시게 발전해 왔으며, 청색 LED로 인하여 조명용 백색 LED가 급격히 발전하고 있다. 현재까지 개발되고 있는 조명용 백색 LED는 통상적으로 c축 방향의 사파이어 기판위에 GaN film을 성장하여 제작하지만 원천적으로 생기는 자발분극과 압전분극 영향 때문에 양자우물에서의 밴드를 기울게 만들고 이것은 캐리어 재결합율을 감소시켜 그 결과 양자 효율을 낮춘다. 이러한 근본적인 문제를 해결하기 방안은 사파이어 기판에서 c-plane이외의 결정면에서 무분극(혹은 반극성) GaN LED를 성장하여 양자효율을 극대화하여 고효율 LED를 구현할 수 있음. 본 연구에서는 Carbonization mask를 이용하여 r-plane sapphire기판상에 a-plane GaN의 ELOG성장 방법에 대하여 연구하였다. Carbonization mask를 이용하면 기존에 사용되던 SiOx 나 SiNx 막을 사용하지 않고 mask를 만들 수 있다는 장점을 가지고 있으며, 이러한 mask를 이용하여 r-plane sapphire위에 ELOG법을 이용한 a-plane GaN을 성장할 수 있음을 실험을 통해 보이려 한다. ELOG 성장이 이루어 지는지 확인을 위하여 SEM을 통하여 ELOG가 되는 과정을 분석하였으며, 표면의 거칠기를 알아보기 위하여 AFM측정을 시행하였다. 실험 결과 약 20 um 두께로 성장되면서 merge가 되는 것을 확인 하였다.

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2003.03a
• /
• pp.211-211
• /
• 2003

PbTiO$_3$ 씨앗층을 이용하여 완화형 강유전체 Pb(Mg$_{1}$3/Ta$_{2}$3/)O$_3$ (PMT) 박막의 페로브스카이트 상안정화와 열처리 조건에 따른 미세구조변화, 이에 따른 전기적 특성 변화에 관하여 조사하였다. PbTiO$_3$ 박막을 스핀코팅법으로 3000 rpm에서 20초간(111) 방향으로 배향된 Pt / Ti / SiO$_2$/ Si 기판에 증착하여 안정화된 페로브스카이트 박막을 얻었다. 이렇게 제조된 PbTiO$_3$를 Buffer 층으로 사용하고 그 위에 Pb(Mg$_{1}$3/Ta$_{2}$3/)O$_3$를 박막을 Spin coating방법으로 증착한 후, 급속열처리 방법(RTA)으로 550- $650^{\circ}C$ 사이에서 열처리하였다. 제조된 박막의 열처리 온도에 따른 미세구조 변화와 결정성을 XRD, SEM, TEM으로 분석하였고 박막의 저온 강유전 특성을 RT66A를 이용하여 평가하였다. Pb(Mg$_{1}$3/Ta$_{2}$3/)O$_3$ 박막의 경우 씨앗층이 없는 경우에는 pyrochlore상이 주상이었지만 씨앗층을 사용한 경우 페로브스카이트 상이 주상임을 확인하였고 열처리 온도가 증가할수록 페로브스카이트상의 상대적 양이 증가함을 확인하였다. 미세구조와 상의 변화에 따른 전기적 특성 변화에 관하여 자세하게 논의할 것이다.

• Journal of Sensor Science and Technology
• /
• v.23 no.5
• /
• pp.291-294
• /
• 2014

In this study, a chemiresistive sensor based on one-dimensional $WO_3$ nanostructures is presented for application in non-invasive medical diagnostics. $WO_3$ nanostructures were used as an active gas sensing layer and were deposited onto a $SiO_2/Si$substrate using Pt interdigitated electrodes (IDEs). The IDE spacing was $5{\mu}m$ and deposition was performed using RF sputter with glancing angle deposition mode. Pt IDEs fabricated by photolithography and dry etching. In comparison with thin film sensor, sensing performance of nanostructure sensor showed an enhanced response of more than 20 times when exposed to 50 ppm acetone at $400^{\circ}C$. Such a remarkable faster response can pave the way for a new generation of exhaled breath analyzers based on chemiresistive sensors which are less expensive, more reliable, and less complicated to be manufactured. Moreover, presented sensor technology has the potential of being used as a personalized medical diagnostics tool in the near future.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2001.07a
• /
• pp.1001-1004
• /
• 2001

The (Sr$_{l-x}$Ca$_{x}$)TiO$_3$(SCT) thin films are deposited on Pt-coated electrode(Pt/TiN/SiO$_2$/Si) using RF sputtering method with substitutional contents of Ca. The maximum grain of thin films is obtained by substitution of Ca at 15[mol%]. The dielectric constant was increased -with increasing the substitutional contents of Ca, while it was decreased if the substitutional contents of Ca exceeded over 15[mol%]. The dielectric constant changes almost linearly in temperature ranges of -80~+90[$^{\circ}C$]. The temperature properties of the dielectric loss have a stable value within 0.02 independent of the substitutional contents of Ca. The current-voltage characteristics of SCT15 thin films showed the increasing leakage current as the measuring temperature increases.ses.