• 한국반도체및디스플레이장비학회:학술대회논문집
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• 한국반도체및디스플레이장비학회 2002년도 추계학술대회 발표 논문집
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• pp.18-19
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• 2002

Si 웨이퍼제조 시 나오는 페슬러지에서 SiC 연마재와 절삭유를 분리해내면 Si 분말을 얻을 수 있다. 본 연구에서의 SiC는 폐슬러지 Si 분말에 C 분말을 혼합하여 제조할 수 있다. Si-C-O 3성분계는 Si, $SiO_2$, SiC, C 4개의 응축상과 CO, SiO, $CO_2$, $O_2$ 4개의 기체상이 가능하고 생성물들 간의 평형관계를 깁스 자유에너지에 의해 평형 반응식이 계산되어질 수 있다. 계산된 평형 반응식은 2개의 SiO, CO 분압이 각각 X, Y 좌표평면에 나타나는 상안정도를 그려볼 수 있다. 상안정도에서 자유도가 2인 경우는, $SiO_2$가 불안정하므로 SiC와 C가 공존하는 영역에서 온도를 독립 변수로 놓으면 나머지 독립 변수는 SiO 나 CO 기체 분압 둘 중 하나가 되어 하나의 직선으로 나타낼 수 있다. 직선을 경계로 각 응축상들의 안정영역을 하나의 좌표평면에 나타낸 후 온도에 따른 SiC의 안정영역을 알아본다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 추계학술대회 논문집 광주전남지부
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• pp.87-90
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• 2006

Two SiC radiation detector samples were irradiated by Co-60 gamma rays. The irradiation was performed with dose rates of 5 kGy/hour and 15 kGy/hour for 8 hours, respectively. Metal/semiconductor contacts on the surface were fabricated by using a thermal evaporator in a high vacuum condition. The SiC detectors have metal contacts of Au(2000 ${\AA}$)/Ni(300 ${\AA}$) at Si-face and of Au(2000 ${\AA}$)/Ti(300 ${\AA}$) at C-face. I-V characteristics of the SiC semiconductor were measured by using the Keithley 4200-SCS parameter analyzer with voltage sources included. From the I-V curve, we analyzed the Schottky barrier heights(SBHs) on the basis of the thermionic emission theory. As a result, the 6H-SiC semiconductor showed- similar Schottky barrier heights independent to the dose rates of the irradiation with Co-60 gamma rays.

• 반도체디스플레이기술학회지
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• 제16권2호
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• pp.49-54
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• 2017

In this paper, recent researches on new and renewable energy have been conducted due to problems such as energy exhaustion and environmental pollution, and new researches on high efficiency and high speed switching are needed. Therefore, we compared the efficiency by using high speed switching devices instead of IGBT which can't be used in high speed switching. The experiment was performed theoretically by applying the same parameters of the high speed switching devices which are the Cool MOS of Infineon Co., SiC C3M of Cree, and GaN FET device of Transform, by implementing the DC-DC boost converter and measuring the actual efficiency for output power and frequency. As a result, the GaN FET showed good efficiency at all switching frequency and output power.

• 한국결정성장학회지
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• 제32권2호
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• pp.55-60
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• 2022

본 연구에서는 SiC 단결정의 TSSG 공정중 결정 품질을 저하시키지 않으면서도 의도하지 않은 질소 도핑(N-UID)을 쉽게 제어하기 위해 지금까지 Co 또는 Sc 전이금속을 첨가한 신규 용융조성을 제안한다. Co 또는 Sc의 특성을 파악하기 위해 Ar 분위기에서 1900℃ 온도에서 약 2시간 동안 열처리 실험을 수행했다. 용융조성은 Si-Ti 10 at% 또는 Si-Cr 30 at%를 비롯하여, 탄소 용해도에 효과적이라고 알려진 Co 또는 Sc을 각각 3 at% 첨가하였다. 열처리 후 도가니 단면을 가공하여 도가니-용융물 계면에서 발생한 Si-C 반응층을 관찰하고, 탄소황분석을 통해 조성에 따른 탄소 용해도를 간접적으로 분석하였다. 그 결과, Si-Sc 기반 용융조성이 TSSG 공정에 적합한 특성을 갖는 Si-C반응층을 형성하고 있었다. 또한 탄소황분석 결과에서도 Cr 다음으로 높은 탄소량이 갖는 것으로 분석되었다. Sc는 Cr에 비해 질소와의 반응성이 낮은 이점을 가지므로 TSSG 공정에 Si-Sc 용융조성을 적용하면, 본 연구에서 의도한 대로 SiC 단결정 성장속도와 질소 UID를 모두 제어할 수 있는 것으로 고려된다.

• 한국기계가공학회지
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• 제16권5호
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• pp.40-46
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• 2017

A plasma gas control apparatus for semiconductor plasma etching processes securely holds a cathode for forming a plasma, confines the plasma during the plasma etching process, and discharges gas after etching. It is a key part of the etching process. With the advancement of semiconductor technology, there is increasing interest in parts for semiconductor manufacturing that directly affect wafers. Accordingly, in order to replace the plasma gas control device with a CVD-SiC material superior in mechanical properties to existing SiCs (Sintered-SiC, RB-SiC), a study on the grinding characteristics of CVD-SiC was carried out. It is confirmed that the optimal grinding condition was obtained when the result table feed rate was 2 m/min and the infeed depth was $5{\mu}m$.

• 한국재료학회지
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• 제1권3호
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• pp.168-174
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• 1991

Ti-Silicides를 single-Si wafer와 그 위에 oxide를 성장시킨 기판위에 composite target($TiSi_{2.6}$)을 sputtering함으로써 증착시켰다. 증착된 비정질 상태의 Ti-silicide는 급속 열처리(RTA)방법으로 $600^{\circ}C$에서 $850^{\circ}C$가지 20초간 처리하였다. RTA온도가 $800^{\circ}C$가 되어서야 비로소 안정한 $TiSi_2$가 형성되었으며, 그 때의 비저항 값은 $27~29{\mu}\Omega-cm$로 Ti-metal reactive방법에 의한 $TiSi_2$보다 약간 높은 값으로 드러났다. X-ray로 상천이를 조사한 결과 역시 $750^{\circ}C$가지 C49 $TiSi_2$가 형성되고, $800^{\circ}C$가 되어서야 안정한 C54 $TiSi_2$로의 상천이가 일어남을 나타내고 있다. 또한 완전히 형성된 Ti-silicide의 조성비는 x-ray photoelectron spectroscopy(XPS)결과에서 Ti : Si이 1 : 2로 드러났으며, 그 동안 reactive 시켰을 때 $TiSi_2$의 단점으로 지적되어 왔던 형성 완료된 $TiSi_2$의 surface roughness는 $17{\pm}1mm$이내로 매우 우수한 값으로 판명되어, device에 대한 응용 가능성을 높이고 있다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
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• pp.353-356
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• 2004

This paper discribes the analysis of the I-V characteristics of 4H-SiC DiMOSFET with single epi-layer Silicon Carbide has been around for over a century. However, only in the past two to three decades has its semiconducting properties been sufficently studied and applied, especially for high-power and high frequency devices. We present a numerical simulation-based optimization of DiMOSFET using the general-purpose device simulator MINIMIS-NT. For simulation, a loin thick drift layer with doping concentration of $5{\times}10^{15}/cm^3$ was chosen for 1000V blocking voltage design. The simulation results were used to calculate Baliga's figure of Merit (BFOM) as the criterion structure optimization and comparison.

• 반도체디스플레이기술학회지
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• 제2권1호
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• pp.21-24
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• 2003

Sludged silicon powders that are generated during silicon ingot slicing process have potential usage as silicon source in fabricating silicon carbide powders by adding carbon. A thermodynamic calculation is performed to consider a plausible formation condition for the silicon carbide powders. A thin silicon oxide layer around silicon powder is sufficient to supply equilibrium oxygen partial pressure at the formation temperature($1400^{\circ}C$) of the silicon carbide in the Si-C-O ternary system. Formation of silicon carbide by using the sludged silicon powders is more efficient than by using silicon oxide powders.

• 한국전기전자재료학회논문지
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• 제37권1호
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• pp.101-105
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• 2024

4H-SiC power metal-oxide-semiconductor field effect transistors (MOSFETs) have been developed to achieve lower specific-on-resistance (R_on,sp), and the gate oxides have been thermally grown. The poor channel mobility resulting from the high interface trap density (D_it) at the SiO₂/4H-SiC interface significantly affects the higher switching loss of the power device. Therefore, the development of novel fabrication processes to enhance the quality of the SiO₂/4H-SiC interface is required. In this paper, NO post-oxidation annealing (POA) by using the conditions of N₂ diluted NO at a high temperature (1,300℃) is proposed to reduce the high interface trap density resulting from thermal oxidation. The NO POA is carried out in various NO ambient (0, 10, 50, and 100% NO mixed with 100, 90, 50, and 0% of high purity N₂ gas to achieve the optimized condition while maintaining a high temperature (1,300℃). To confirm the optimized condition of the NO POA, measuring capacitance-voltage (C-V) and current-voltage (I-V), and time-of-flight secondary-ion mass spectrometry (ToF-SIMS) are employed. It is confirmed that the POA condition of 50% NO at 1,300℃ facilitates the equilibrium state of both the oxidation and nitridation at the SiO₂/4H-SiC interface, thereby reducing the D_it.

• 한국반도체및디스플레이장비학회:학술대회논문집
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• 한국반도체및디스플레이장비학회 2007년도 춘계학술대회
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• pp.179-182
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• 2007

Polycrystaline (poly) 3C-SiC thin film on n-type and p-type Si were deposited by APCVD using HMDS, $H_2$, and Ar gas at $1180^{\circ}C$ for 3 hour. And then the schottky diode with Au/poly 3C-Sic/Si(n-type) structure was fabricated. Its threshold voltage ($V_d$), breakdown voltage, thickness of depletion layer, and doping concentration ($N_D$) value were measured as 0.84 V, over 140 V, 61nm, and $2.7{\times}10^{19}\;cm^3$, respectively. The p-n junction diode fabricated by poly 3C-SiC was obtained like characteristics of single 3C-SiC p-n junction diode. Therefore, its poly 3C-SiC thin films are suitable MEMS applications in conjuction with Si fabrication technology.