• Title/Summary/Keyword: Si-C bond

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Manufacturing of Ni-Cr-B-Si + WC/12Co Composite Coating Layer Using Laser Cladding Process and its Mechanical Properties (레이저 클래딩 공정을 이용한 Ni-Cr-B-Si + WC/12Co 복합 코팅층의 제조 및 기계적 특성)

  • Ham, Gi-Su;Kim, Chul-O;Park, Soon-Hong;Lee, Kee-Ahn
    • Journal of Powder Materials
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    • v.24 no.5
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    • pp.370-376
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    • 2017
  • In this study we manufacture a Ni-Cr-B-Si +WC/12Co composite coating layer on a Cu base material using a laser cladding (LC) process, and investigate the microstructural and mechanical properties of the LC coating and Ni electroplating layers (reference material). The initial powder used for the LC coating layer is a powder feedstock with an average particle size of $125{\mu}m$. To identify the microstructural and mechanical properties, OM, SEM, XRD, room and high temperature hardness, and wear tests are implemented. Microstructural observation of the initial powder and LC coating layer confirm the layer is composed mainly of ${\gamma}-Ni$ phases and WC and $Cr_{23}C_6$ carbides. The measured hardness of the LC coating and Ni electroplating layers are 653 and 154 Hv, respectively. The hardness measurement from room up to high temperatures of $700^{\circ}C$ result in a hardness decrease as the temperature increases, but the hardness of the LC coating layer is higher for all temperature conditions. Room temperature wear results show that the wear loss of the LC coating layer is 1/12 of the wear level of the Ni electroplating layer. The measured bond strength is also greater in the LC coating than the Ni electroplating.

Effects of Interfacial Dielectric Layers on the Electrical Performance of Top-Gate In-Ga-Zn-Oxide Thin-Film Transistors

  • Cheong, Woo-Seok;Lee, Jeong-Min;Lee, Jong-Ho;KoPark, Sang-Hee;Yoon, Sung-Min;Byun, Chun-Won;Yang, Shin-Hyuk;Chung, Sung-Mook;Cho, Kyoung-Ik;Hwang, Chi-Sun
    • ETRI Journal
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    • v.31 no.6
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    • pp.660-666
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    • 2009
  • We investigate the effects of interfacial dielectric layers (IDLs) on the electrical properties of top-gate In-Ga-Zn-oxide (IGZO) thin film transistors (TFTs) fabricated at low temperatures below $200^{\circ}C$, using a target composition of In:Ga:Zn = 2:1:2 (atomic ratio). Using four types of TFT structures combined with such dielectric materials as $Si_3N_4$ and $Al_2O_3$, the electrical properties are analyzed. After post-annealing at $200^{\circ}C$ for 1 hour in an $O_2$ ambient, the sub-threshold swing is improved in all TFT types, which indicates a reduction of the interfacial trap sites. During negative-bias stress tests on TFTs with a $Si_3N_4$ IDL, the degradation sources are closely related to unstable bond states, such as Si-based broken bonds and hydrogen-based bonds. From constant-current stress tests of $I_d$ = 3 ${\mu}A$, an IGZO-TFT with heat-treated $Si_3N_4$ IDL shows a good stability performance, which is attributed to the compensation effect of the original charge-injection and electron-trapping behavior.

Characteristics of p-Xylene Adsorption using Functionalized Mesoporous Silica (관능기화 메조포러스 실리카를 이용한 파라자일렌 흡착 특성)

  • Kim, Sang-Hyoun;Park, Jonghoon;Kang, Seok-Tae;Chung, Jae-Woo;Kim, Soo-Hong;Cho, Yunchul;Lee, Chae-Young
    • Journal of the Korean GEO-environmental Society
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    • v.13 no.6
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    • pp.27-31
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    • 2012
  • This study was designed to examine the feasibility of functionalized mesoporous silica as the adsorbent for benzene, toluene, ethylbenzene, and xylene isomers (BTEX) in groundwater. p-Xylene was used as the model compound of BTEX. A series of functionalized mesoporous silica with MCM-41 type of structure was synthesized using a co-condensation method. Monoamine, triamine, nitrile, phenyl, and octyl groups were functionalized to the mesoporous silica structure. Adsorption sites for p-Xylene in a functionalized mesoporous silica were Si-O-Si covalent bond, the surfactant, and the functional group. Octyl-functionalized mesoporous silica with stearyltrimethylammonium chloride as a surfactant showed the highest adsorption ability. The maximum xylene adsorption capacity of the octyl-functionalized mesoporous silica with stearyltrimethylammonium chloride based on Langmuir model was 4.17 mmol/g on $20^{\circ}C$, which was 2.9 times higher than that of MCM-41.

Effect of the additional application of a resin layer on dentin bonding using single-step adhesives (중간층 레진 적용이 단일 접착과정 상아질 접착제의 접착에 미치는 영향)

  • Choi, Seung-Mo;Park, Sang-Hyuk;Choi, Kyung-Kyu;Park, Sang-Jin
    • Restorative Dentistry and Endodontics
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    • v.32 no.4
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    • pp.313-326
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    • 2007
  • The purpose of this study was to prove that an intermediate resin layer (IRL) oan increase the bond strength to dentin by reducing the permeability of single-step adhesives. Flat dentin surfaces were created on buccal and lingual side of freshly extracted third molar using a low-speed diamond saw under copious water flow. Approximately 2.0 mm thick axially sectioned dentin slice was abraded with wet #600 SiC paper. Three single-step self-etch adhesives; Adper Prompt L-Pop (3M ESPE, St Paul, MN, USA), One-Up Bond F (Tokuyama Corp, Tokyo, Japan) and Xeno III (Dentsply, Konstanz, Germany) were used in this study. Each adhesive groups were again subdivided into ten groups by; whether IRL was used or not; whether adhesives were cured with light before application or IRL or not; the mode of composite application. The results of this study were as follows; 1. Bond strength of single-step adhesives increased by an additional coating of intermediate resin layer, and this increasement was statistically signigicant when self-cured composite was used (p < 0.001). 2. When using IRL, there were no difference on bond strengths regardless the curing procedure of single-step adhesives. 3. There were no significant difference on bond strengths between usage of AB2 or SM as an IRL. 4. The thickness of Hybrid layer was correlated with the acidity of adhesive used, and the nanoleakage represented by silver deposits and grains was examined within hybrid and adhesive layer in most of single-step adhesives. 5. Neither thickness of hybrid layer nor nanoleakage were related to bond strength.

THE SHEAR BOND STRENGTH OF DENTAL ADHESIVES ON PRIMARY AND PERMANENT TEETH (유치와 영구치에서 치과용 접착제의 전단결합강도)

  • Choi, Jin-Young;Choi, Nam-Ki;Park, Yeong-Joon;Choi, Choong-Ho;Yang, Kyu-Ho
    • Journal of the korean academy of Pediatric Dentistry
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    • v.34 no.4
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    • pp.579-589
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    • 2007
  • The objective of this study was to compare the shear bond strengths of five adhesive systems to the enamel and dentin of primary and permanent teeth. Fifty noncarious primary and fifty permanent teeth were collected and stored in an 0.1% thymol solution at room temperature after extraction. The tested adhesives were: Adper Scotchbond Multi-purpose Plus Adhesive (SM) Adper Single bond 2 (SB), Clearfil SE Bond (SE), Adper Prompt L-Pop (PL), GBond (GB). For the shear bonding test, the labial and lingual surfaces of primary and permanent teeth were used. To obtain a flat surface, the labial and lingual surfaces of the teeth were sanded on $SiO_2$ with number 600 grit and then divided into 20 groups of 10 surfaces each. All samples were theromocycled in water $5^{\circ}C$ and $55^{\circ}C$ for 1000 cycles. The results were as follows: 1. For primary enamel, shear bond strengths of SM and SB were significantly higher than that of SE and also SM, SB, and PL were higher than GB(p<0.05). 2. For primary dentin, there were no significant differences among the shear bond strengths of any other bonding systems except difference between SE and GB. 3. For permanent enamel, SB showed significantly higher mean shear bond strength than those of any other bonding systems(p<0.05). 4. For permanent dentin, SM showed significantly higher mean shear bond strength than that of PL and GB(p<0.05). 5. Between the primary enamel and dentin, there were significant differences in SM, SB, and GB, whereas there was statistically significant difference in PL between the permanent enamel and dentin(p<0.05). 6. Between the primary and permanent teeth on enamel, there were no significant differences among all bonding systems, whereas there were statistically significant differences in SM and SB between the primary and permanent teeth on dentin(p<0.05).

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Characterization of Silica Sol Particle Prepared by Sol-Gel Reaction from Sodium Silicate Solution (소디움실리케이트 수용액(水溶液)으로부터 솔-젤 반응(反應)에 의해 제조(製造)된 실리카 솔 입자특성(粒子特性) 고찰(考察))

  • Kim, Chul-Joo;Kim, Sung-Don;Jang, Hee-Dong;Yoon, Ho-Sung
    • Resources Recycling
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    • v.18 no.6
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    • pp.30-37
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    • 2009
  • Silica sol was prepared from the mixture of sodium silicate solution and oxidized silicate solution in which sodium had been removed by sol-gel process. The properties of sodium silicate solution and silicate solution thus prepared were characterized by yellow silicomolydate method. Moreover, the formation and growth of silica sol from sodium silicate solution was investigated. Sodium silicate solution with 2% of $SiO_2$ contains 95% of reactive silicate, and 50% of reactive silicate participates sol-gel reaction. From the results of FT-IR analysis, it was found that the intensity of silanol bond decreased and the intensity of siloxane bond increased with increasing reaction temperature. Zeta potential of silica sol prepared at each condition was -40~-60 mV and it could be known that silica sol in this study was well dispersed. The silica sol with 5~10 nm size could be prepared by heating the mixed solution of sodium silicate and silicate solution. And the silica sol grew into about 20 nm as silicate solution was added to silica sol solution.

THE COMPARATIVE STUDY FOR THE SHEAR BOND STRENGTH OF DENTAL ADHESIVES CURED WITH VARIOUS LIGHT SOURCES (다양한 광원으로 중합한 치과용 접착제의 전단강도에 관한 비교 연구)

  • Choi, Nam-Ki;Cho, Seong-Hoon;Kim, Seon-Mi
    • Journal of the korean academy of Pediatric Dentistry
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    • v.38 no.1
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    • pp.33-41
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    • 2011
  • The objective of this study was to compare the shear bond strengths of five dentin adhesive systems cured with three different light curing sources. Seventy five noncarious permanent teeth were collected and stored in an 0.1% thymol solution at room temperature after extraction. The tested adhesives were: Adper Scotchbond Multi-purpose Plus Adhesive (SM) Adper Single bond 2 (SB), Clearfil SE Bond (SE), Adper Prompt L-Pop (PL), G-Bond (GB). And three light curing unit systems were used: Elipar Free light 2(LED), OptiLux 501 (Halogen), Flipo (PAC). For the shear bonding test, the labial and lingual surfaces of permanent teeth were used. To obtain a flat dentin surface, the labial and lingual surfaces of the teeth were sanded on SiO2 with number 600 grit and then divided into 15 groups of 10 surfaces each. All samples were theromocycled in water $5^{\circ}C$ and $55^{\circ}C$ for 1000 cycles. The results were as follows: 1. When cured with Freelight 2, the shear bond strength of SM was significantly higher than that of PL, GB (p<0.05), whereas no significant difference was found among those of any other bonding agents. 2. When cured with Optilux 501, the shear bond strength of SM was significantly higher than those of any other bonding agents (p<0.05), whereas no singnificant difference was found among those of andy other bonding agents. 3. When cured with Flipo, the shear bond strength of SM was significantly higher than those of SB, SE, GB (p<0.05), whereas no significant differences was found among those of any other bonding agents. 4. For comparison according to three different light cure unit system, except SB and GB, each three dentin bonding agents showed no significant difference. For SB, only Freelight 2 was significantly higher than the others, with no significant difference between Optilux 501 and Flip. For GB, Statistically significant difference was found only between Freelight and Flipo.

First-principles Study of the Structure and Growth Mechanism of Allyl Alcohol Lines on the H-terminated Si(001)

  • Choi, Yun-Ki;Choi, Jin-Ho;Cho, Jun-Hyung
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.08a
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    • pp.184-184
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    • 2011
  • Using first-principles density-functional calculations, we investigate the chain reaction mechanism of allyl alcohol (ALA) molecules on the H-terminated Si(001)-2${\times}$1 surface. Recently, it was reported [1] that allyl mercaptan (ALM) molecules show a self-directed line growth across the dimer rows through a chain reaction involving several reaction processes: (i) The created radical at the C atom is transferred to the S atom, (ii) the resulting S-centered radical easily abstracts an H atom from the neighboring dimer row, and (iii) the generated S-H group further reacts with the neighboring dimer row to produce the Si-S bond on the neighboring dimer row, accompanying the associative desorption of H2. This H2-desorption process creates a new DB on the neighboring dimer row, setting off the chain reaction across the dimer rows. In the present study, we find that although the structure of ALA with -OH functional is analogous to that of ALM with -SH functional, ALA and ALM lines show a difference in their growth direction. We predict that ALA undergoes the chain reaction to show a line growth along the dimer row, contrasting with the ALM line growth across the Si dimer rows. Our analysis shows that the different growth direction of ALA is due to the strong instability of oxygen radical intermediate, which prevents from growing across the dimer rows. Thus, we demonstrate that the stability of the radical intermediate plays a crucial role in determining the direction of molecular line growth.

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LC-MS Analysis According to the Combined Treatment of Paenibacillus yonginensis DCY84T and Silicon in Rice

  • Yo-Han Yoo;Mee Youn Lee;Yeon-Ju Kim;Eok-Keun Ahn;Ki-Hong Jung
    • Proceedings of the Korean Society of Crop Science Conference
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    • 2022.10a
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    • pp.232-232
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    • 2022
  • We reported in our recent studies that the combined treatment of Paenibacillus yonginensis DCY84T (DCY84T) and Silicon (Si) promotes initial plant growth and increases resistance to biotic and abiotic stress. To understand the molecular background of these phenotypes, Liquid Chromatography Mass Spectrometry (LC-MS) analysis was performed, and it was confirmed that unsaturated fatty acid metabolites such as oleic acid and linoleic acid decreased in response to the combined treatment of DCY84T and Si. The stearoyl-acyl carrier protein desaturase (SACPD) introduces the cis double bond into the acyl-ACPs at C9, resulting in the production of unsaturated fatty acid. We identified OsSSI2 encoding SACPD in rice and found that the expression of OsSSI2 was reduced under DCY84T and Si treatment. Furthermore, qRT-PCR analysis revealed that the expression of OsWRKY45, which is downstream of OsSSI2, was upregulated in response to DCY84T and Si treatment. These results enable the speculation that activation of the salicylic acid (SA)-responsive gene, OsWRKY45, may contribute to enhancing biological stress resistance. Based on this, we propose a probable model for the rice defense pathway following DCY84T and Si treatment. This model retains a WRKY45-dependent but NH1(NPR1)-independent SA signaling pathway.

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EFFECT OF THE APPLICATION TIME OF SELF-ETCHING PRIMERS ON THE BONDING OF ENAMEL (자가부식 프라이머의 적용시간이 법랑질 접착에 미치는 영향)

  • Jin, Cheol-Hee;Cho, Young-Gon;Kim, Soo-Mee;Lee, Myeong-Seon
    • Proceedings of the KACD Conference
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    • 2008.05a
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    • pp.224-234
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    • 2008
  • The purpose of this study was to compare the normal and two times of application time of six self-etching primers applied to enamel using microshear bond strength (uSBS) test and the finding of scanning electronic microscope (SEM). Crown of sixty human molars were bisected mesiodistally and buccal and lingual enamel of crowns were partially exposed and polished with 600 grit SiC papers. They were divided into one of two equal groups subdivided into one of six equal groups (n = 10) by self-etching primer adhesives. After the same manufacture's adhesive resin and composites were bonded on the enamel surface of each group, the bonded specimens were subjected to uSBS testing and also observed under SEM. In conclusion, generally two times of primer application time increased the enamel uSBS, especially with the statistical increase of bond strength in adhesives involving high-pH primers.

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