• Proceedings of the KIEE Conference
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• 1989.07a
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• pp.291-294
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• 1989

The effect of isothermal aging on the crystallization of $Fe_{78}B_{13}Si_9$ metallic glass has been investigated by electrical resistivity, X-ray measurements, bending test, thermal analysis and transmission electron microscpy. Amouphous $Fe_{78}B_{13}Si_9$ alloy was annealed isothermally for 5 to 1200 min. between $300^{\circ}C$ and $540^{\circ}C$. It has been found that close relation between relative resistivity and X-ray diffraction pattern showed. The crystalline peaks of ${\alpha}$-(Fe, Si) and $Fe_2B$ are detected by X-ray experiment. The crystalline phases observed by TEH show ${\alpha}$-(Fe, Si) and $Fe_2B$ with dendritic and cylindrical morphology, respectively. It has been also found that the embrittleness of aged samples rapidly increased with the crystallization and was shown before the crystallization.

• Journal of Industrial Technology
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• v.26 no.B
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• pp.173-181
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• 2006

We analyzed systematically particle growth in the pulsed $SiH_4$ plasmas by a numerical method and investigated the effects of pulse modulations (pulse frequencies, duty ratios) on the particle growth. We considered effects of particle charging on the particle growth by coagulation during plasma-on. During plasma-on ($t_{on}$), the particle size distribution in plasma reactor becomes bimodal (small sized and large sized particles groups). During plasma-off ($t_{off}$), there is a single mode of large sized particles which is widely dispersed in the particle size distribution. During plasma on, the large sized particles grows more quickly by fast coagulation between small and large sized particles than during plasma-off. As the pulse frequency decreases, or as the duty ratio increases, $t_{on}$ increases and the large sized particles grow faster. On the basis of these results, the pulsed plasma process can be a good method to suppress efficiently the generation and growth of particles in $SiH_4$ PCVD process. This systematical analysis can be applied to design a pulsed plasma process for the preparation of high quality thin films.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11a
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• pp.17-20
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• 2001

Nonvolatile semiconductor memory devices with reoxidized nitrided oxide(RONO) gate dielectric were fabricated, and nitrogen distribution and bonding species which contributing memory characteristics were analyzed. Also, memory characteristics of devices according to anneal temperatures were investigated. The devices were fabricated by 0.35$\mu\textrm{m}$ retrograde twin well CMOS processes. The processes could be simple by in-situ process of nitridation anneal and reoxidation. The nitrogen distribution and bonding state of gate dielectric were investigated by Dynamic Secondary Ion Mass Spectrometry(D-SIMS), Time-of-Flight Secondary ton Mass Spectrometry(ToF-SIMS), and X-ray Photoelectron Spectroscopy(XPS). Nitrogen concentrations are proportional to nitridation anneal temperatures and the more time was required to form the same reoxidized layer thickness. ToF-SIMS results show that SiON species are detected at the initial oxide interface and Si$_2$NO species near the new Si-SiO$_2$ interface that formed after reoxidation. As the anneal temperatures increased, the device showed worse retention and degradation properties. These could be said that nitrogen concentration near initial interface is limited to a certain quantity, so excess nitrogen are redistributed near the Si-SiO$_2$ interface and contributed to electron trap generation.

• Resources Recycling
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• v.24 no.1
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• pp.35-42
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• 2015

To obtain the fundamental information on the dissolution of nickel into the slag in the pyrometallurgical processes for treatment of wasted PCB, the distribution ratios of nickel between CaO-$SiO_2-Al_2O_3$-MgO slag and copper-5 wt%Ni alloy were measured at 1623 K to 1823 K under a controlled $CO_2$-CO atmosphere. The distribution ratio of Ni increased linearly with increasing oxygen partial pressure. Therefore, the dissolution reaction of nickel into the slags could be described by the following equation; $$Ni(l)_{metal}+\frac{1}{2}O_2(g)NiO(l)_{slag}$$ The distribution ratio of Ni increased linearly with increasing content of basic oxides(CaO and MgO) in slag. However, the distribution ratio of Ni decreased linearly with increasing temperature. From these results, the empirical equation of distribution ratio of Ni was obtained by the following equation from the analysis of experimental conditions by multiple regression. $${\log}L_{Ni}=0.4000{\log}P_{O2}-5.1{\times}10^{-4}T+0.3375\(\frac{X_{CaO}+X_{MgO}}{X_{SiO2}}\)$$

• Transactions of the Korean Society of Mechanical Engineers A
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• v.39 no.9
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• pp.901-907
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• 2015

The Vickers hardness test is a common method used to characterize the hardness of ceramic materials. However, the hardness is not a deterministic value, but is a random variable. The objective of this paper is to investigate the statistical properties of the bending strength and a set of Vickers hardness values in single $ZrO_2$ and composite $ZrO_2/SiC$ with a SiC additive. In this work, we compare the characteristic value and variation with the results based on Weibull statistical analysis. The probability distributions of the bending strength and Vickers hardness agreed relatively well with the Weibull distribution. We evaluate the scale parameter and shape parameter in asreceived $ZrO_2$ and $ZrO_2/SiC$ composite ceramics, as well as in their heat treated ceramics.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.10
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• pp.826-832
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• 1998

In this study the thin films with the structure of Si+SiO$_2$+TiN are made by RF supttering method. TiN, which has small diffusion coefficient and low resistivity, is evaporated between SiO$_2$ and Al layers. It investigates the V-R characteristics depending on the thickness of SiO$_2$ which is used as insulation layer and researches its effects on voltage stability of thin film and varistor. These films show very small resistance valus in negative(-) voltage and large and large value in positive voltage band, and with the increase of voltage, resistance value is rapidly reduced and the satisfactory characteristic of varistor is shown at +1[V]. It is found that resistance value of TiN thin film is small and also TiN thin film has more current than the thin film which is not evaporated by TiN thin film. When Al electrode is evaporated of SiO$_2$ thin film, spiking occurs, but the spiking can be prevented with evaporation of TiN between SiO$_2$ and Al layers and this thin films in made easily because of its good attachment. With the increase of voltage, the resistance is changed into non-linear pattern and the bidirectional varistor characteristic is shown and then its theory can be verified by this experiment. Accordingly, when TiN is evaporated of Si Wafer(n-100), it obtains better voltage-resistance than thin film which is not evaporated and also when varistor character is used electrically to automatic control element such as elimination of flame, power distribution arrestor and constant voltage compensation, satisfactory reproducibilities are expected.

• Journal of Korean Physical Therapy Science
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• v.31 no.1
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• pp.46-52
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• 2024

Background: This study aims to investigate compensatory strategy in a dog with glenoid dysplasia using kinetic gait analysis before and after reconstruction of medial patellar luxation. Design: Case report Method: On the platform, gait analysis was evaluated for a dog with congenital luxation and bilateral medial patellar luxation (MPL). A dog was evaluated for maximal vertical force (MVF), body load distribution (BLD), and symmetry index (SI), including the left forelimb with congenital luxation before MPL surgery, 15 days of surgery, and 40 days of surgery. Result:: In the comparison between the preoperative and the 15 days of surgery, the MVF of the bilateral forelimbs, especially in the non-affected forelimbs, increased, and the SI also increased. For BLD, the maximum load distribution increased, but the total load distribution decreased. In the comparison of 15 days and 40 days of surgery, MVF and BLD increased, and SI decreased on 40days of surgery. Conclusions: In a dog, the shift in weight load to the non-affected side occurs all the limbs, affecting the peak vertical force, weight load distribution, and symmetry index.

• Journal of Surface Science and Engineering
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• v.36 no.2
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• pp.122-127
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• 2003

Ti - Si - N hard films were deposited on SKD11 steel substrates by a hybrid deposition system, where TiN was deposited by AIP method while Si was incorporated by sputtering one. The microstructure of Ti-Si-N films was revealed to be a composite of TiN crystallites and amorphous Si3N4 by instrumental analyses. The highest hardness value of about 45 Gpa was obtained at the Si content of around 7.7 at.%. With increase of Si content, the size of TiN crystallites was reduced and their distribution was changed from aligned to randomly orientated states. Surface roughness of Ti-Si-N film also decreased with increase of Si content.

• Journal of Korea Foundry Society
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• v.14 no.5
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• pp.429-437
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• 1994

Influence of interfacial structure between matrix and particle in A356/coated SiC composite fabricated by squeeze casting method was studied. Experimental variables are types of coated metallic film on SiC particles such as Cu, Ni-P, and applied pressure for squeeze casting. It was found that coating treatment on SiC particles improves the wetting of liquid A356 alloy on SiC particles. SiC particle distribution is very homogeneous in A356 matrix alloy which is fabricated by squeeze casting. Analysing the surface morphology of fractured A356/coated SiC, it was concluded that metallic thin film by coating treatment on SiC particle improves the interfacial bonding between particle and matrix, and so does on mechanical properties such as tensile strength. However, there was on significant difference in hardness between those composite made of as-received SiC particle and coated SiC particle.

• Applied Science and Convergence Technology
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• v.25 no.2
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• pp.28-31
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• 2016

The structural and the electronic properties of pentacene on modified Si (001) were investigated using scanning tunneling microscopy (STM), atomic force microscopy (AFM) and ultraviolet photoelectron spectroscopy (UPS). Dodecane was used to modify Si (001) substrates and then pentacene was deposited on dodecane/Si (001). Our STM results show a uniform distribution of aggregated dodecane molecules all over the clean Si (001). The surface structure of pentacene on dodecaene/Si (001) examined by AFM is analogous to that of pentacene on $SiO_2$. The UPS data showed that the work function of pentacene on clean Si (001) and pentacene on modified Si (001) with dodecane was 6.41 and 5.57 eV, respectively. Our results prove that dodecane results in the work function difference between pentacene on clean Si (001) and pentacene on dodecane/Si (001).