• Title/Summary/Keyword: Si(111)

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Structural, Optical properties of layer thickness dependence for silicon quantum dots in SiC matrix superlattice (실리콘 양자점 초격자 박막의 두께에 따른 구조적, 광학적 특성 분석)

  • Kim, Hyun-Jong;Moon, Ji-Hyun;Park, Sang-Hyun;Cho, Jun-Sik;Yoon, Kyung-Hoon;Song, Jin-Soo;O, Byung-Sung;Lee, Jeong-Chul
    • 한국신재생에너지학회:학술대회논문집
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    • 2009.11a
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    • pp.398-398
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    • 2009
  • 텐덤 구조의 양자점 태양전지에서 양자점의 크기에 따라 에너지 밴드갭이 달라 넓은 대역의 태양광을 이용할 수 있다. 이러한 양자점의 크기는 증착 두께의 제어로 조절이 가능하다. Si과 C target을 이용한 RF Co-sputtering 법으로 각각 증착시간을 다르게 하여, SiC/$Si_{1-x}C_x$(x~0.20)인 실리콘 양자점 초격자 박막을 제조하고, $1000^{\circ}C$에서 20분간 질소 분위기에서 열처리를 하였다. Grazing incident X-ray diffraction(GIXRD)를 통해서 Si(111)과 $\beta$-SiC (111)이 생성되었음을 확인하였고, High resolution transmission electron microscopy(HRTEM) 사진으로 양자점의 크기와 분포 밀도를 확인할 수 있었다. Photoluminescence(PL)에서 1.4, 1.5, 1.7, 1.9eV의 Peak이 확인되었다.

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Synthesis of nano-crystalline Si films on polymer and glass by ICP-assisted RF magnetron sputtering

  • Shin, Kyung-S.;Choi, Yoon-S.;Choi, In-S.;Han, Jeon-G.
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.08a
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    • pp.203-203
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    • 2010
  • Nano-crystalline Si thin films were deposited on polymer and glass by inductively coupled plasma (ICP) - assisted RF magnetron sputtering at low temperature in an argon and hydrogen atmosphere. Internal ICP coil was installed to increase hydrogen atoms dissociated by the induced magnetic field near the inlet of the working gases. The microstructure of deposited films was investigated with XRD, Raman spectroscopy and TEM. The crystalline volume fraction of the deposited films on polymer was about 70% at magnetron RF power of 600W and ICP RF power of 500W. Crystalline volume fraction was decreased slightly with increasing magnetron RF power due to thermal damage by ion bombardment. The diffraction peak consists of two peaks at $28.18^{\circ}$ and $47.10^{\circ}\;2{\theta}$ at magnetron RF power of 600W and ICP RF power of 500W, which correspond to the (111), (220) planes of crystalline Si, respectively. As magnetron power increase, (220) peak disappeared and a dominant diffraction plane was (111). In case of deposited films on glass, the diffraction peak consists of three peaks, which correspond to the (111), (220) and (311). As the substrate temperature increase, dominant diffraction plane was (220) and the thickness of incubation (amorphous) layer was decreased.

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Pt/Ti/Si 기판에서의 후속열처리에 따른 PZT 박막의 형성 및 특성

  • 백상훈;백수현;황유상;마재평;최진석;조현춘
    • Proceedings of the Materials Research Society of Korea Conference
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    • 1993.05a
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    • pp.64-65
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    • 1993
  • MPB 조성영역인 Zr/Ti=52/48의 composite ceramic target을 사용하여 RF magnetron sputtering 방법으로 기판온도 약 30$0^{\circ}C$에서 RZT 박막을 Pt/Ti/Si 기판위에 증착시켰다. 안정상인 perovskite 구조를 형성시키기 위하여 PbO분위기에서 furnace annealing 과 Repid thermal annealing을 실시하여 열처리 방법에 따른 상형성 및 계면반응과 그에 따른 전기적 특성을 고찰 하였다. Pt 의 두께가 250$\AA$인 경우 furnace annealing 시 $650^{\circ}C$에서 perouskite 상이 형성되었으나 Pt층이 산소의 확산을 방지하지 못하여 상부의 Ti 층이 TiOx로 변태하였으며 하부의 Ti는 Si 과 반응하여 Ti-silicide 롤 변태하였다. 또한 75$0^{\circ}C$,60sec 인 경우 Pt 층의 응집화가 관찰되어 하부전극으로서 적용이 적절하지 못하다. 급속열처리를 실시한 경우에도 마찬가지로 Ti 층이 TiOx 와 silicide 층으로 변태되었다. Pt의 두께가 1000$\AA$인 경우에도 250$\AA$와는 달리 RTA 시 (III)방향으로 Furace annealing 시(001)방향으로 우선 성장하였다. 이는 Ti(001), P(111),PZT(111)면의 lattic mismatch 가 매우 작은데다 RTA 시 계면반응이 거의발생하지 않아 PZT 박막이 (111) 방향으로 우선 성장한 것으로 보인다. Furnace annealing 경우는 심한 계면반응이 발생하여 Pt층에 어느 정도 영향을 주었기 때문에 우선성장 방향이 바뀌었다구 생각한다.

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Effect of SiO2 on Abnormal Grain Growth and Single Crystal Growth in BaTiO3 (BaTiO3에서 SiO2 첨가에 의한 비정상 입성장과 단결정 성장)

  • 김재석;허태무;이종봉;이호용
    • Journal of the Korean Ceramic Society
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    • v.41 no.3
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    • pp.266-271
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    • 2004
  • A very small amount of SiO$_2$ was locally added in sintered BaTiO$_3$ ceramics and then heat-treated at 135$0^{\circ}C$. In the region where SiO$_2$ was not added, grain growth occurred very slowly. In the region where a very small amount of SiO$_2$ was added, however, grain growth occurred very actively. After long time annealing at 135$0^{\circ}C$, abnormal grains appeared only in the part where SiO$_2$ was added and grew up to 2 cm in size. In the grown abnormal grains or single crystals, (111) double or single twins were not observed. The growth of abnormal grains or single crystals was explained by formation of liquid phase in the region where SiO$_2$ was added. These results showed that centimeter-sized BaTiO$_3$ single crystals without (111) double or single twins could be fabricated by using abnormal grain growth.

Ultralow Dielectric Properties of $SiO_2$ Aerogel Thin Films (실리카 에어로겔 박막의 극저 유전특성)

  • 현상훈;김중정;김동준;조문호;박형호
    • Journal of the Korean Ceramic Society
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    • v.34 no.3
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    • pp.314-322
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    • 1997
  • The thin film processing and the applicability as a IMD material of SiO2 aerogels providing ultralow dielec-tric properties were studied. The SiO2 aerogel films with 0.5g/㎤ density (78% porosity) and 4000~21000$\AA$ thickness could be prepared at 25$0^{\circ}C$ and 1160 psig by supercritical drying of wet-gel films, which were spin-coated at the spin rate of 1000~7000 rpm on p-Si(111) wafer under the isopropanol atmosphere. The optimum viscosity of polymeric SiO2 sols for spin coating was in the range of 10~14 cP. The main fac-tors being able to control the film thickness and microstructures were found to be sol concentration, spin rpm, and aging time of wet-gel films. The dielectric constant of the SiO2 aerogel thin film was around 2.0 low enough to be applied to the next generation semiconductor device beyond the giga level.

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The Effects of Ti Film Thicknesses and Si Substrate Orientations on Phase Transition of Tisi$_2$ ($TiSi_2$의 상전이에 미치는 박막의 두께 및 기판의 방위의 영향)

  • Yoon, Gang-Joong;Jeon, Hyeong-Tae
    • Korean Journal of Materials Research
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    • v.5 no.7
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    • pp.820-828
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    • 1995
  • Ti-sillcides are formed on an atomically clean Si substrate and its phase transition and surface and interface morphologies are examined depending on the Ti-film thicknesses, deposition temperatures and Si substrate orientations. Ti film thicknesses of 400$\AA$ and 200$\AA$ have been deposited at elevated temperatures from 50$0^{\circ}C$ to 90$0^{\circ}C$ with increments of 10$0^{\circ}C$ on Si(100) and Si(111) Ti-silicides are formed and analyzed with using XRD, SEM, and TEM to verify the phase transition and the surface and interface morphologies. The phase transition from C49 to C54 is observed to occur around $650^{\circ}C$ and examined to show some retardation depending on the substrate orientation and film thickness. This retardation of phase transition is explained by the consideration based on the surface and volume free energies. A rough surface of C49 TiSi$_2$is exhibited because of characteristics of nonuniform diffusion across the interface while the smooth surface and island formation of C54 TiSi$_2$is examined.

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The change of Sn, In/Si(111) Surface structure and Investigation of desorption energy (Sn, In/Si(III)표면에서의 구조변화 및 이탈에너지에 대한 연구)

  • Kwak, Ho-Weon;Kwak, Ji-Hoon
    • Journal of the Korean Society of Industry Convergence
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    • v.5 no.3
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    • pp.209-212
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    • 2002
  • The change of surface structures for the deposition of Sn, In on clean Si(111) surface is investigated as a function of surface coverage by RHEED system. For tin submonolayer films $7{\times}7$, ${\sqrt{3}}{\times}{\sqrt{3}}$ structures are observed depending on the coverage and substrate temperature. For indium submonolayer films $7{\times}7$, ${\sqrt{3}}{\times}{\sqrt{3}}$, ${\sqrt{31}}{\times}{\sqrt{31}}$, $1{\times}1$ structures are observed. We find that at substrate temperature of $500^{\circ}C$, ${\sqrt{3}}{\times}{\sqrt{3}}$ structure is formed at tin coverages of 0.2~0.4 ML and at indium coverages of 0.1~0.3 ML, respectively. From the desorption process, the desorption energies of Sn, In in ${\sqrt{3}}{\times}{\sqrt{3}}$ structure is observed to he 3.25 eV, 2.66eV, respectively.

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