• Transactions on Electrical and Electronic Materials
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• v.8 no.3
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• pp.110-114
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• 2007

Dependence of the thermal stability of nickel silicide on the film stress of inter layer dielectric (ILD) layer has been investigated in this study and silicon nitride $(Si_3N_4)$ layer is used as an ILD layer. Nickel silicide was formed with a one-step rapid thermal process at $500^{\circ}C$ for 30 sec. $2000{\AA}$ thick $Si_3N_4$ layer was deposited using plasma enhanced chemical vapor deposition after the formation of Ni silicide and its stress was split from compressive stress to tensile stress by controlling the power of power sources. Stress level of each stress type was also split for thorough analysis. It is found that the thermal stability of nickel silicide strongly depends on the stress type as well as the stress level induced by the $Si_3N_4$ layer. In the case of high compressive stress, silicide agglomeration and its phase transformation from the low-resistivity nickel mono-silicide to the high-resistivity nickel di-silicide are retarded, and hence the thermal stability is obviously improved a lot. However, in the case of high tensile stress, the thermal stability shows the worst case among the stressed cases.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.11a
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• pp.62-62
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• 2003

금속-실리콘간 화합물인 실리사이드 중에서, 코발트다이실리사이드(CoSi$_2$)는 비저항이 낮고 선폭이 좁아짐에 따라 면저항이 급격히 증가하는 선폭의존성이 없으며 화학적으로 안정한 재료로 현재 널리 이용되고 있는 재료이다. 또한, 실리콘 (100) 기판과 에피택셜하게 성장한 CoSi$_2$는 우수한 열안정성 과 낮은 juction leakage의 특성을 가지며, shallow junction 형성을 가능하게 하는 많은 장점을 가지고 있어 각광받고 있다. 그러나 순수한 Co의 증착 후속 열처리에 의해 형성된 CoSi$_2$는 (110), (111), (221)등의 다양한 결정방위를 가지게 되어 에피택셜 하게 형성되기 어렵다. 현재까지 Ti, Ta, Zr과 화학 산화막 등의 확산 방지막을 이용하여 에피 택셜하게 성장시키는 많은 방법들이 연구되어 왔으며, 최근에는 본 연구실에서 반응성화학기상증착법으로 Co-C 박막을 증착하여 in-Situ로 에피택셜 CoSi$_2$를 형성하는 새로운 방법을 보고하였다. 본 연구는 반응성 스퍼터링에 의해 증착된 Co-N 박박으로부터 후속 열처리를 통하여 에피택셜 CoSi$_2$를 성장시키는 새로운 방법을 제시하고자 한다. Co-N 박박은 Ar과 $N_2$의 혼합가스 분위기 속에서 Co를 스퍼터링하여 증착하였다. 증착시 혼합가스 내의 $N_2$함량의 변화에 따라 다양한 Co-N 박막이 형성됨을 확인하였다. 후속열처리시 Co-N 박막의 산화를 방지하기 위하여 Ti층을 마그네트론 스퍼터링으로 증착하였으며, Ar 분위기에서 온도에 따른 ex-situ RTA 열처리를 통하여 에피택셜 CoSi$_2$를 성장시킬 수 있었다. 이러한 에피택셜 CoSi$_2$는 특정 한 Ar/$N_2$ 비율 내에서 성장이 가능하였으며, 약 $600^{\circ}C$이상의 열처리 온도에서 관찰되었다.

• Journal of the Korean Solar Energy Society
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• v.29 no.6
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• pp.110-118
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• 2009

This research is an experimental study on BIPV Power performance of See-through a-si and Light-through applying external curtain wall. In case of See-through a-si Photovoltaic, appropriateness of facade applying standard($950\;{\times}\;980mm$) large($950\;{\times}\;1960mm$)area photovoltaic was examined. Transparent performance was also investigated through Power simulation according to angles and seasons of See-through a-si and Light-through Photovoltaic so that Power output was surveyed with using designed and manufactured Mock-up. When comparing See-through a-si to Light-through Photovoltaic for simulation Power output on angles based on full south aspect, which the result was that See-through a-si Power output according to Light-through Power output was the highest of 65.5% when applying a 90 degree angle. Monthly accumulated average Power output during winter seasons (December, January and February) applying a vertical plane on full south aspect was analyzed, which results in 66.37W/h of See-through a-si and 139.1 W/h of Light-through. See-through a-si Power output showed 47.7% in comparison with Light-through transparent. Also monthly, hourly average Power efficiency according to solar radiation during winter seasons (December, January and February) was that 4.7% of See-Through a-si and 9.8% of Light-through.

• Korean Journal of Materials Research
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• v.3 no.4
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• pp.403-409
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• 1993

In this paper, an $NH_3$, added during dry oxidation and annealing m Si( 111) is clarified effect ive to suppress or remove defects. Annealing effects in $N_2$ and $NH_3/N_2$ ambient are estimated with dry $O_2$ and $NH_4$ oxidation($NH_3$ added in dry $O_2$ oxidation) method. C;em'rated defects in dry $O_2$ oxidation are lengthened according to oxidation time. but any defects in $NH_3$ oxidation are not found. Dry oxidation, after $NH_3$ oxidation as an initial oxidation. lias the defect -removing effect at the interface of Si -$SiO_2$. After dry or $NH_3$. oxidation. the annealmg 7.5% $NH_3/N_2$ ambient brings out gettering effect of OSF. The annealing in 7.5% $NH_3/N_2$ ambient for NI L oxidation method decreaSE,s $NH_3$ length of OSF about 20 % compared with dry oxidation method. Tlw feature of OSF is pit type, the gettering is directed to (011) plane for (111) plane. and OSFs are etched following to 110) directIon.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.3
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• pp.1-6
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• 2017

Functional coatings, such as anti-reflection and self-cleaning, are frequently applied to cover glass for photovoltaic applications. Anti-reflection coatings made of mesoporous silica film have been shown to enhance the light transmittance. $TiO_2$ photocatalyst films are often applied as a self-cleaning coating. In this study, transparent hydrophobic anti-reflective and self-cleaning coatings made of $SiO_2/TiO_2$ thin layers were fabricated on a slide glass substrate by the sol-gel and dip-coating processes. The morphology of the functional coatings was characterized by field emission scanning electron microscopy (FE-SEM) and atomic force microscopy (AFM). The optical properties of the functional coatings were investigated using an UV-visible spectrophotometer. Contact angle measurements were performed to confirm the hydrophobicity of the surface. The results showed that the $TiO_2$ films exhibit a high transmittance comparable to that of the bare slide glass substrate. The $TiO_2$ nanoparticles make the film more reflective and lead to a lower transmittance. However, the transmittance of the $SiO_2/TiO_2$ thin layers is 93.5% at 550 nm with a contact angle of $110^{\circ}$, which is higher than that of the bare slide glass (2.0%).

• Journal of the Korean Vacuum Society
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• v.9 no.2
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• pp.136-143
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• 2000

$SrBi_2Ta_2O_9;(SBT)$ films were deposited on p-type Si(100) at room temperature by rf magnetron sputtering method to confirm the possibility of application of $Pt/SBT/Pt/Ti/SiO_2/Si$ structure (MFM) for destructive read out ferroelectric RAM (random access memory). Their structural characteristics with the various annealing times and Ar/$O_2$ gas flow ratios in sputtering were observed by XRD (X-ray diffractometer) and the surface morphologies were observed by FE-SEM (field emission scanning electron microscopy), and their electrical properties were observed by P-V (polarization-voltage measurement) and I-V (current-voltage measurement). The Ar/$O_2$ gas flow ratios of sputtering gas were changed from 1 : 4 to 4 : 1 and SBT thin films were deposited at room temperature. The films show (105), (110) peaks of SBT by XRD measurement. SBT thin films deposited at room temperature were crystallized by furnace annealing at 80$0^{\circ}C$ in oxygen atmosphere during either one hour or two hours. Among their electrical properties, P-V curves showed shaped hysteresis curves, but the SBT thin films showed the asymmetric ferroelectric properties in P-V curves. When Ar/$O_2$ gas flow ratios are 1 : 1, 2: 1, the leakage current density values of SBT thin films are good, those values of 3 V, 5 V, and 7 V are respectively $3.11\times10^{-8} \textrm{A/cm}^2$, $5\times10^{-8}\textrm{A/cm}^2$, $7\times10^{-8}\textrm{A/cm}^2$.After two hours of annealing time, their electrical properties and crystallization are improved.

• Applied Chemistry for Engineering
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• v.16 no.6
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• pp.737-741
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• 2005

In this study, the effect of copper content on the NO removal efficiency by Cu/MCM-41 has been investigated. MCM-41 was prepared by hydrothermal synthesis using a gel mixture of colloidal silica solution and cetyltrimethylammonium. Cu/MCM-41 was manufactured with copper content (5, 10, 20, and 40%) in Cu(II) acetylacetonate. The surface properties of MCM-41 were investigated by using pH, XRD, and FT-IR analyses. $N_2/77K$ adsorption isotherm characteristics, including the specific surface area and micropore volume were studied by BET's equation and Boer's t-plot methods. NO removal efficiency was confirmed by gas chromatography technique. From the experimental results, the MCM-41 was analyzed to have the surface functional groups of Si-OH and Si-O-Si and the characteristic diffraction lines (100), (110), (200), and (210) corresponding to a hexagonal arrangement structure. The copper content supported on MCM-41 appeared to increase the NO removal efficiency in spite of decreasing the specific surface areas or micropore volumes. Consequently, it was found that the copper content in Cu/MCM-41 played an important role in improving the NO removal efficiency, which was mainly attributed to the catalytic reactions.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.11a
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• pp.267-270
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• 2003

We have studied the interfacial diffusion phenomena and the role of ${\alpha}-Al_2O_3$ buffer layer as a diffusion barrier in the $Ba-ferrite/SiO_2$ magnetic thin films for high-density recording media. In the interface of amorphous Ba-ferrite ($1900-{\AA}-thick)/SiO_2$ thin film during annealing, the interfacial diffusion started to occur at ${\sim}700^{\circ}C$. As the annealing temperature increased up to $800^{\circ}C$, the interfacial diffusion abruptly proceeded resulting in the high interface roughness and the deterioration of the magnetic properties. In order to control the interfacial diffusion at the high temperature, we introduced ${\alpha}-Al_2O_3$ buffer layer ($110-{\AA}-thick$) in the interface of $Ba-ferrite/SiO_2$ thin film. During the annealing of $Ba-ferrite/{\alpha}-Al_2O_3/SiO_2$ thin film even at ${\sim}800^{\circ}C$, the interface was very smooth. The smooth interface of the film was also clearly shown by the cross-sectional FESEM. The magnetic properties, such as saturation magnetization 3nd intrinsic coercivity, were also enhanced, due to the inhibition of interfacial diffusion by the ${\alpha}-Al_2O_3$ buffer layer. Our study suggests that the ${\alpha}-Al_2O_3$ buffer layer act as a useful interfacial diffusion barrier in the $Ba-ferrite/SiO_2$ thin films.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2006.10a
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• pp.110-114
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• 2006

Dielectric properties of glass-ceramics with fresnoite(Ba2TiSi208) crystals have been investigated in xK20-(33.3-x)BaO-16.7TiO2-50SiO2 ($0{\leq}x{\leq}20mol%$) glasses. The glassy nature was analyzed by differential thermal analyses and glass-ceramics was variable and control table by the processing parameters like time and temperature. Dielectric constant was measured over a temperature from 125K to 425k at frequencies form 100Hz to 1MHz, and laid in the range 16-10. Piezoelectric constant d33 was measured using a YE2703A d33meter and changed from 5.9 to 4.8pCN-1 with x contents. The spontaneous polarization Ps estimated from the hysteresis at ${\pm}1.2kV$ was ${\sim}0.3\;{\mu}C/cm2$ at room temperature.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1999.10a
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• pp.179-184
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• 1999

When the steel containing Si is oxidated in hi temperature, Re2O3, Red scale is made on the metal side as the spike phase, and this scale invasion into matrix. Therefore, it affects the feature, after rolling. It is reported that the role of Si is FeO/Fe2SiO4 eutectic compound, but Si can not affect pure iron independently. There must be Ni, then the spike phase can exist. Prominence and depression made by Ni that is necessity at the process to work iron. Therefore, in this study after the change of the amount of Ni in pure iron and steel and oxidation, the structure of the oxide and the surface, and the distribution of the elements were considered. In conclusion, at 100$0^{\circ}C$, 110$0^{\circ}C$, 120$0^{\circ}C$ the curves of oxidation weight are all S curves. Especially, in the beginning of oxidation as the amount of Ni increase, the amount of oxidation also increase. Practical steel has less oxidation than pure steel added Ni. There is much FeO in Fe-Ni alloy, compare to practical steel which has much Fe3O4. Especially, we could know considerable Ni was concentrated on the metal side in Fe-Ni alloy, practical steel. and the surface of the scale.