• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.300-300
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• 2010

후면 패시베이션, back contact의 가변, 후면 접촉면적의 가변 등으로 Laser Fired Contact 태양전지의 효율을 증가 시킬 수 있다. 이 중 spacing의 가변으로 후면 접촉 면적을 가변 할 수 있으며, 이로 인하여 LFC 태양 전지의 효율을 높일 수 있을 것으로 전망된다. 본 연구에서는 후면 접촉 면적을 가변하였으며 이에 따른 효과를 확인하였다. series resistance가 작고, open circuit voltage 가 높은 최적의 조건을 찾는 것에 그 목적을 두었다. 실험 순서는 texturing 후, 후면에 SiNx를 10nm 증착하였으며, drive-in 방법으로 $POCl_3$을 도핑하였다. ARC후, spacing 조건 가변으로 접촉 면적을 가변시키면서 소자의 특성 변화를 비교하였다. 접촉 면적 및 spacing 조건은 5개의 set에 대하여 reference, 50%의 접촉 면적을 가지는 $150{\mu}m$ line, 10%의 접촉 면적을 가지는 $700{\mu}m$ line, 1%의 접촉 면적을 가지는 $700{\mu}m$ dot, 그리고 0.2%의 접촉 면적을 가지는 $1500{\mu}m$ dot으로 하였다. 각각의 경우에 대한 short circuit current density, fill factor, seris resistance, sheet resistance, open circuit voltage를 측정하였으며, 특히 series resistance는 각각의 경우에 대하여 $6.1m{\Omega}$, $5.1m{\Omega}$, $7.8m{\Omega}$, $10.1m{\Omega}$, 그리고 $15.7m{\Omega}$으로 측정되었다. wafer의 외각 테두리를 접촉 면적이 증가함에 따라서 sheet resistance가 증가하는 것을 확인 할 수 있었다.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.9
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• pp.26-34
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• 1998

This paper presents a characterization method for faults of circuit patterns on MCM(Multichip Module) or PCB(Printed Circuit Board) substrates with electron beams of a SEM(Scanning Electron Microscope) by inducing voltage contrast on the signal line. The experimentation employes dual potential electron beams for the fault characterization of circuit patterns with a commercial SEM without modifying its structure. The testing procedure utilizes only one electron gun for the generation of dual potential electron beams by two different accelerating voltages, one for charging electron beam which introduces the yield of secondary electron $\delta$ < 1 and the other for reading beam which introduces $\delta$ > 1. Reading beam can read open's/short's of a specific net among many test nets, simultaneously discharging during the reading process for the next step, by removing its voltage contrast. The experimental results of testing the copper signal lines on glass-epoxy substrates showed that the state of open's/short's had generated the brightness contrast due to the voltage contrast on the surface of copper conductor line, when the net had charged with charging electron beams of 7KV accelerating voltages and then read with scanning reading electron beams of 2KV accelerating voltages in 10 seconds. The experimental results with Au pads of a IC die and Au plated Cu pads of BGA substrates provided the simple test method of circuit lines with 7KV charging electron beam and 2KV reading beam. Thus the characterization method showed that we can test open and short circuits of the net nondestructively by using dual potential electron beams with one SEM gun.

• Progress in Superconductivity and Cryogenics
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• v.20 no.4
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• pp.55-59
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• 2018

Currently, the development of industry makes needs larger electric supply. Providers must consider the efficiency about losses and reliability of the system. In this case, DC power system can save electrical energy; long-distance transmission line losses. Relevance to switch technology with a voltage-source converter (VSC) in AC-DC conversion system have been researched. But, protection device of DC-link against fault current is still needed to study much. VSC DC power system is vulnerable to DC-cable short-circuit and ground faults, because DC-link has a huge size of capacitor filter which releases extremely large current during DC faults. Furthermore, DC has a fatal flaw that current zero crossing is nonexistence. To interrupt the DC, several methods which make a zero crossing is used; parallel connecting self-excited series LC circuit with main switch, LC circuit with power electronic device called hybrid DC circuit breaker. Meanwhile, self-excited oscillator needs a huge size capacitor that produces big oscillation current which makes zero crossing. This capacitor has a quite effective on the price of DCCB. In this paper, hybrid self-excited type superconducting DCCB which are using AC circuit breaker system is studied by simulation tool PSCAD/EMTDC.

• Proceedings of the KIEE Conference
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• 2006.04b
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• pp.57-61
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• 2006

In the single-phase switched reluctance motor (SRM) drive, the required DC source is generally supplied by the circuit consisting of bridge rectifier and large filter capacitor connected with DC line terminal. Due to the large capacity of the capacitor, the charged time of capacitor is very short from the AC source. Lead to the bridge rectifiers draws pulsating current from the AC source side, which results in reduction of power factor and low system efficiency. Therefore a novel single-phase SRM drive system is presented in this paper, which includes drive circuit realizing reduction of torque ripple and improvement of power factor with a novel switching topology. The proposed drive circuit consists of one switching part and diode, which can separate the output of AC/DC rectifier from the large capacitor and supply power to SRM alternately, in order to realize the torque ripple reduction and power factor improvement through the switching scheme. In addition, the validity of the proposed method is tested by some simulations and experiments.

• Journal of electromagnetic engineering and science
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• v.4 no.3
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• pp.107-112
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• 2004

In this paper, the phase noise of 900 MHz VCO is improved using modified strip line square ring resonator. In order to demonstrate the phase noise improvement of the proposed VCO, the same circuit was manufactured using shorted-circuit resonator. In condition of the same bias current, the phase noise of the proposed VCO with modified square ring resonator is suppressed by 7 dB as - 103 dBc/Hz at 100 kHz offset compared to the conventional VCO with short-circuit resonator. From the proposed VCO, we achieved output power of - 4.8 dBm, harmonics suppression of 16 dB, and tuning bandwidth of 100 MHz. The proposed VCO consumed 5 mA at 3 V, and its size is 1.2 cm ${\times}$ 1.0 cm.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.59 no.2
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• pp.328-332
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• 2010

The SLF(Short Line Fault) breaking capability test for high voltage class $SF_6$ GCB(Gas Circuit Breaker) was conducted. Simplified LC resonant circuit test facility was used for SLF breaking test. During test, Test current was measured by Rogwski coil and arc voltage was measured by voltage divider. Arc conductance was calculated by using these test results before 200ns at current zero. Critical arc conductance value at rated voltage 145kV class is about 2.3mS regardless of breaking current magnitude and arc conductance value at rated voltage 170kV class is about 2.6mS.

• Journal of the Korean Society of Safety
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• v.32 no.3
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• pp.15-20
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• 2017

This study presented the strength of the materials and parts for smart distribution board fabrication, and developed a work operation process chart for smart distribution board fabrication. This work operation process chart for smart distribution board fabrication complied with SPS-KEMC regulations, and the applicable range and object are less than 1,000 V and 1,000 Hz for the AC distribution board and less than 1,500 V for the DC distribution board. The power supply is 3 phase 4 wires ($3{\Phi}$ 4W), divided into a single phase circuit and a 3 phase circuit. In addition, the circuit was configured so that the leakage current flowing through the distribution line of the load could be monitored in real time by using the sensor module installed at the rear end of the circuit breaker. Therefore, the administrator can easily find the risk factor of the load since engineer can check the leakage current of each distribution line. In addition, if a leakage current greater than standard value flows, it is possible to generate an alarm against a short circuit and cut off the leakage current. The work operation process chart for the smart distribution board fabrication consists of the following steps: raw and subsidiary materials, sheet metal work, tube making, welding, painting, busbar fabrication, assembly and wiring, product inspection, shipment, etc. Moreover, symbols, ${\Delta}$, ${\nabla}$, ${\bigcirc}$, ${\Rightarrow}$, etc. were used according to the type of work and work progress so that workers can easily understand the progress of the work.

• 한국태양에너지학회:학술대회논문집
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• 2011.04a
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• pp.293-298
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• 2011

The most widely used method to form an electrode in industrial solar cells are screen printing. Screen printing is characterized by a relatively simple and well-known production sequence with high throughput rates. However the method is difficult to implement a fine line width of high-efficiency solar cells can not be made. The open circuit voltage(Voc) and the short circuit current density(Jsc) and fill factor(FF) need to be further improved to increase the efficiency of silicon solar cells. In this study, gravure offset printing method using the multicrystalline-silicon solar cells were fabricated. Gravure off-set printing method which can print the fine line width of finger electrode can have the ability reduce the shaded area and increase the Jsc. Moreover it can make a high aspect ratio thereby series resistance is reduced and FF is increased. Approximately $50{\mu}m$ line width with $35{\mu}m$ height was achieved. The efficiency of gravure off set was 0.7% higher compare to that of scree printing method.

• Proceedings of the IEEK Conference
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• 2002.06d
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• pp.81-84
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• 2002

This paper presents the real-time PCB(Printed circuit board) inspection system that can detect thin open/short error using the line scan camera. After a overall introduction of our system, the outline of our inspection methods are described. The goal of our inspection system is the real time and detailed inspection using the line scan camera. To perform inspection processing in real-time, we utilize double buffering structure. In order to solve the problem of unexpectable pixels of PCB, we propose melting process which eliminates unexpectable pixels of PCB. The design and development of our prototype of PCB ins- pection system is discussed and test results are presented to show the effectiveness of the developed inspection algorithm.

• Proceedings of the KIEE Conference
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• 1995.07b
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• pp.616-619
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• 1995

This paper describes developement of on-line system for vibration signal analysis. In the power system, the main reason of transformer fault is due to a large amount of current by a short-circuit and a ground-fault. The electromagnetic force caused by fault-current deforms transformer windings and results in vibration pattern change. Therefore if the continuous on-line vibration monitoring on transformer is performed, an incipient failure can be detected. The developed system is composed of data acquisition devices, user interface program, signal processing program, diagnosis and trend analysis program, self diagnosis program and communication program.