• Fire Science and Engineering
• /
• v.33 no.6
• /
• pp.186-189
• /
• 2019

NFSC 202 stipulates that if a loudspeaker or wiring on one floor of a building is shorted because of fire, it should not interfere with the fire notification on the other floors. To address this problem, this study proposes an ultrasonic transmitter/receiver consisting of an ADC, HPF, and LPF in an emergency broadcasting system that can operate regardless of the volume level of the amplifier output loudspeaker capacity. After transmitting the transmission frequency at -12 dB (110 kHz), it is received at -18 dB by transmitting -12 dB in case of short circuit depending on the frequency characteristics. Typically, depending on the loudspeaker capacity, it is received from -24 dB to -66 dB. In case of disconnection, it exceeds -66 dB and no data are received. It is also possible to check the track status during fire or general broadcasting. Thus, it was confirmed that the system is suitable for NFSC 202 regulations. Furthermore, as the current system is replaced, the inspection or test criteria should be amended or revised.

• Applied Chemistry for Engineering
• /
• v.9 no.6
• /
• pp.811-816
• /
• 1998

Rebar corrosion in cement mortar containing chloride ions was investigated by electrochemical AC impedance spectroscopy. Corrosion of mild steel bar was accelerated by an acceleration test equipment in short period. Impedance values obtained from AC-impedance method could be adapted to the proposed electrochemical equivalent circuit model and they were consistent with calculated values obtained by CNLS fitting method. The weight loss of rebar could be calculated by charge transfer resistance($R_2$) with time and it was close to real value.

• Journal of Advanced Marine Engineering and Technology
• /
• v.35 no.6
• /
• pp.842-848
• /
• 2011

A fabricated hybrid control board using multi-communication is designed with a low power 8-bit microcontroller, ATxmega128A1. The microcontroller consists of 8 UART (Universal asynchronous receiver/transmitter) ports, 2 kbytes EEPROM, 128 kbytes flash memory, 8 kbytes SRAM. The 8 URAT ports are used for a multi-communication modem, a GPS module, etc. The EEPROM is used for saving a configuration for running programs, and the flash memory of 128 kbytes is used for storing a F/W (Firm Ware), and the 8 kbytes SRAM is used for stack and for storing memory of global variables while running programs. If we use the multi-communication of CDMA, TRS and RF to remotely control Aid to Navigation, it is able to remove the communication shadow area. Even though there is a shadow area for an individual communication method, we can select an optimal communication method. The compatibility of data has been enhanced as using of same data frame per communication device. For the test, 8640 of data have been collected from each buoy during 30 days in every 5 minutes and the receiving rate of the data has shown more than 85 %.

• Progress in Superconductivity and Cryogenics
• /
• v.13 no.1
• /
• pp.31-35
• /
• 2011

A Hybrid Fault Current Limiter(FCL) which has more advantages in fast response and thermal characteristics than a simple resistive FCL had been proposed by our group. The Hybrid FCL consists of a resistive FCL for the magnitude of the first peak of fault current, and a fast switch for detecting fault current and generating the repulsive force within a cycle in fault situation. In ideal case, the impedance of the fast switch wound with two other kinds of HTS tape is negligibly zero in normal operation. But, during the fault situation, each HTS tape has different quench characteristics because of asymmetric current distribution. And this phenomenon causes effective flux and this flux opens the switch through the repulsive force applied to a metal plate of the fast switch. The magnitude of the repulsive force affects the switching characteristics of the fast switch. It should be large enough to raise the metal plate up. Otherwise the arc re-out break which are caused by not enough repulsive force to raise the metal plate up can cause unintended operation of the fast switch. In this paper, the numerical calculation of the repulsive force applied to the metal plate of the fast switch in various combinations of HTS tapes was performed by using the short-circuit test and finite element method.

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2003.03a
• /
• pp.68-68
• /
• 2003

최근의 전자부품은 고밀도 고집적화 됨에 따라 여러 가지 문제점들이 발생되고 있다. 그 중 부품이 실장되는 부분에 사용되는 솔더나 전기적 회로를 구성하는 패턴간에 금속 이온 마이그레이션(Metallic Ion Migration)이 발생하여 전기적 단락(Short)를 유발함으로써 전자제품의 치명적 고장을 유발한다. 본 연구는 이온 마이그레이션 현상을 물방울시험(Water Drop Test)을 통하여 재현함으로써 발생 메카니즘을 확인하여 발생원인을 직접적으로 관찰하고, 각 종 패턴의 거리 및 전압에 따른 발생속도의 차이를 조사하기 위하여 수행되었다. 이러한 실험을 위하여 콤 패턴(Comb Pattern)의 FR-4 재질 인쇄회로기판(PCB : Printed Circuit Board)을 사용하였으며, 사용된 전극재질로는 Cu, SnPb, Au를 사용하였고, 패턴간 거리는 0.5, 1.0, 2.0mm의 3가지 종류로 구분하였다. 또한 패턴간에 인간 된 전압은 6.5V, 15V를 인가한 후 마이그레이션이 발생되는 시간을 측정하였다. 이러한 실험으로부터 다음과 같은 결론을 얻었다. (1) 6.5V의 인가전압에서는 Cu 패턴이 대체적으로 가장 빠르게 마이그레이션이 발생하였으며, 다음으로 Au가 발생하였고, Cu와 SnPb의 발생시간은 대체적으로 근사한 값을 나타내었다. 이것은 비슷한 평형전위를 갖는 재료는 마이그레이션 발생시간이 유사하게 나타나며, 높은 (+)전위를 갖을수록 발생시간이 지연됨을 알 수 있다. (2) 15V를 인가하였을 때 패턴간격이 0.5mm인 경우 Cu, Au, SnPb의 순으로 나타났으며, 1.0mm는 SnPb, Cu, Au, 2.0mm인 경우는 SnPb, Au, Cu의 순으로 마이그레이션이 발생하였다. 인가전압이 높은 경우 초기 발생에는 큰 차이가 없지만 수지상이 발생 후 성장하는데 많은 영향을 미치는 것으로 보인다. 이것은 초기 수지상의 형성에 큰 영향을 미치는 것은 재료의 평형전위에 의한 값이 좌우하지만, 수지상이 일정길이 이상 형성된 이후에는 성장속도가 평형전위에 따른 값과는 다소 다르게 나타남을 알 수 있다.

• Journal of the Institute of Electronics Engineers of Korea SD
• /
• v.45 no.6
• /
• pp.111-118
• /
• 2008

In this paper, novel latch-up prevention method that employs power-up sequential switches has been proposed to relieve latch-up problem in liquid crystal display (LCD) driver ICs. These sequential switches are inserted in the 2'nd and 3'rd boosting stages, and are used to short the emitter-base terminals of parasitic p-n-p-n circuit before relevant boosting stages are activated during power-up sequence. To verily the performance of the proposed method, test chips were designed and fabricated in a 0.13-um CMOS process technology. The measurement results indicated that, while the conventional LCD driver If entered latch-up mode at $50^{\circ}C$ accompanying a significant amount of excess current, the driver IC adopting the proposed method showed no latch-up phenomenon up to $100^{\circ}C$ and maintained normal current level of 0.9mA.

• Journal of the Semiconductor & Display Technology
• /
• v.15 no.4
• /
• pp.10-15
• /
• 2016

In this paper, novel ball grid array (BGA) interconnection process using solderable anisotropic conductive adhesives (SACAs) with low-melting-point alloy (LMPA) fillers have been developed to enhance the processability in the conventional capillary underfill technique and to overcome the limitations in the no-flow underfill technique. To confirm the feasibility of the proposed technique, BGA interconnection test was performed using two types of SACA with different LMPA concentration (0 and 4 vol%). After the interconnection process, the interconnection characteristics such as morphology of conduction path and electrical properties of BGA assemblies were inspected and compared. The results indicated that BGA assemblies using SACA without LMPA fillers showed weak conduction path formation such as solder bump loss or short circuit formation because of the expansion of air bubbles within the interconnection area due to the relatively high reflow peak temperature. Meanwhile, assemblies using SACA with 4 vol% LMPAs showed stable metallurgical interconnection formation and electrical resistance due to the favorable selective wetting behavior of molten LMPAs for the solder bump and Cu metallization.

• Progress in Superconductivity and Cryogenics
• /
• v.8 no.2
• /
• pp.29-32
• /
• 2006

An advanced superconducting fault current limiter (SFCL) using $high-T_c$ superconducting (HTS) wire has been developed. The SFCL has a non-inductively wound magnet for reducing loss in normal state. Two types of non-inductively wound magnets, the solenoid type and the pancake type, were designed and manufactured by using Bi-2223 wire in this research. Short-circuit tests of the magnets were performed in sub-cooled $LN_2$ cooling system of 65 K. The magnets are thermally more stable and have a higher critical current in 65 K sub-cooled $LN_2$ cooling system than in 77 K saturated one. Because the resistivity of matrix at 65 K is lower than the resistivity at 77 K, the magnets generate a small resistance to reduce the fault current when the quench occurs. The magnets could limit the fault current to low current level with such a small resistance. The current limiting characteristic of the magnets was analyzed from the test result. The solenoid type was wound in parallel to make it non-inductive. The pancake type was also connected in parallel to be compared with the solenoid type in the same condition. The solenoid type was found to have a good thermal stability compared with the pancake type. It also had as large resistance as the pancake type to limit the fault current in sub-cooled $LN_2$ cooling system.

• Solar Energy
• /
• v.11 no.3
• /
• pp.74-83
• /
• 1991

In this study, the (p)ZnTe/(n)Si solar cell and (n)CdS-(p)ZnTe/(n)Si poly-junction thin film are fabricated by vaccum deposition method at the substrate temperature of $200{\pm}1^{\circ}C$ and then their electrical properties are investigated and compared each other. The test results from the (p)ZnTe/(n)Si solar cell the (n)CdS-(p)ZnTe/(n)Si poly-junction thin fiim under the irradiation of solar energy $100[mW/cm^2]$ are as follows; Short circuit current$[mA/cm^2]$ (p)ZnTe/(n)Si:28 (n)CdS-(p)ZnTe/(n)Si:6.5 Open circuit voltage[mV] (p)ZnTe/(n)Si:450 (n)CdS-(p)ZnTe/(n)Si:250 Fill factor (p)ZnTe/(n)Si:0.65 (n)CdS-(p)ZnTe/(n)Si:0.27 Efficiency[%] (p)ZnTe/(n)Si:8.19 (n)CdS-(p)ZnTe/(n)Si:2.3 The thin film characteristics can be improved by annealing. But the (p)ZnTe/(n)Si solar cell are deteriorated at temperatures above $470^{\circ}C$ for annealing time longer than 15[min] and the (n)CdS-(p)ZnTe/(n)Si thin film are deteriorated at temperature about $580^{\circ}C$ for longer than 15[min]. It is found that the sheet resistance decreases with the increase of annealing temperature.

• Korean Chemical Engineering Research
• /
• v.59 no.3
• /
• pp.339-344
• /
• 2021

In order to improve the PEMFC (Proton Exchange Membrane Fuel Cell) durability, it is important to accurately evaluate the durability of the membrane in a short time. Recently, DOE (Department of Energy) reported a protocol that combines the chemical and mechanical durability of membranes to evaluate them effectively. This protocol applies chemical/mechanical deterioration to the membrane by repeating wet/dry while OCV (Open Circuit Voltage) holding. The problem of this protocol is that it is highly affected by electrode degradation due to change cycles in OCV and that the evaluation time is long. By using oxygen instead of air as the cathode gas while leaving the other conditions of the DOE protocol as it is, the durability evaluation time could be reduced from 408 hours to 144 hours. By reducing the number of voltage change cycles to 1/3, the electrode degradation due to the voltage change cycle was reduced to 1/12 when oxygen was used compared to air at the end, thereby enabling more accurate evaluation of polymer membrane durability.