• 제목/요약/키워드: Shape Inspection

검색결과 487건 처리시간 0.021초

소형(1mm이하) hole의 형태 및 크기 측정을 위한 자동초점 비젼검사기 (Automatic Focusing Vision System for Inspection of Size and Shape of Small Hole)

  • 한문용;한헌수
    • 한국정밀공학회지
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    • 제16권10호
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    • pp.80-86
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    • 1999
  • Since the quality of the coated wires is in various applications dependant on the coating depth, accuracy of hole size of dies used for coating wires must be maintained precisely, in general within one micron. This paper proposes a new vision system which measures automatically the size and shape of small holes having diameters less than 1mm within an error limit of 1 micron. To quickly obtain the focused image, this paper proposes an estimation method of the camera position using only a couple of defocused hole images. It measures the distributions of light intensity around the image boundary and decides the direction and distance of a camera motion. The proposed system measures the size, shape distortion, inclination of the hole against the axis of the dies structure, to decides the acceptability of the dies for use. The proposed algorithm has been implemented using a cheap 640${\times}$480 image system and has shown an average size error of 1micron when measuring the dieses having 0.1mm to 1.0mm diameters. It can be applied to the inspection of the size and position of holes in PCB, too.

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열교환기 브레이징 결함의 유형 분류 및 형상 디스플레이 (Type Classification and Shape Display of Brazing Defect in Heat Exchanger)

  • 김진영
    • 제어로봇시스템학회논문지
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    • 제19권2호
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    • pp.171-176
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    • 2013
  • X-ray cross-sectional image-based inspection technique is one of the most useful methods to inspect the brazing joints of heat exchanger. Through X-ray cross-sectional image acquisition, image processing, and defect inspection, the defects of brazing joints can be detected. This paper presents a method to judge the type of detected defects automatically, and to display them three-dimensionally. The defect type is classified as unconnected defect, void, and so on, based on location, size, and shape information of defect. Three-dimensional display which is realized using OpenGL (Open Graphics Library) will be helpful to understand the overall situation including location, size, shape of the defects in a test object.

교량의 경관설계 방법과 구조형상의 시각적 안전성 평가 (Landscape Design Method of Bridges and Visual Safety Estimation of Structural Shape)

  • 양승현;시오미 히로유키
    • 한국구조물진단유지관리공학회 논문집
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    • 제2권3호
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    • pp.235-244
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    • 1998
  • In the design of bridges, the points of concem are the landscape design, the function, safety and economical efficiency. But most of studies have been performed on structural engineering. The study on the landscape design of bridges has not been done in korea. Therefore, in this research, the design method of bridges by the judgement of structural engineering and landscape engineering has been proposed, through the process to decide the shape of bridges. Also, the research studies a problem about the visual safety of the structural shape in the landscape design of bridges. The visual experiments applied to the seven models about the shape of hunch in bridge pier. The experiment was made in moving velocity of view point, steady looking time and track of eyeball movement.

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양면 PCB의 납땜부 검사를 위한 새로운 X선 단층영상 시스템 (A new X-ray cross-sectional image system for solder joint inspection of double-sided PCB)

  • 강성택;정재훈;조형석
    • 제어로봇시스템학회:학술대회논문집
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    • 제어로봇시스템학회 1996년도 한국자동제어학술회의논문집(국내학술편); 포항공과대학교, 포항; 24-26 Oct. 1996
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    • pp.117-120
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    • 1996
  • In this paper, a new approach to acquire the cross-sentional image for automatic solder joint inspection of double-sided PCB using X-ray source is presented. We designed the apparatus with fixed X-ray source to realize the cross-sectional image by tunning object and detector synchronously. The cross-sectional images are captured at several view angle of X-ray source, the geometric image distortions caused by view angle and the shape of image intensifier are compensated. The precision variation of cross-sectional image by the change of view angle was investigated. Also we acquired the cross-sectional image to the solder joint of double-sided PCB and reconstructed the shape of solder joint.

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곡률 기반의 측정점 결정 알고리즘 개발 (Determination of Sampling Points Based on Curvature distribution)

  • 박현풍;손석배;이관행
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2000년도 추계학술대회 논문집
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    • pp.295-298
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    • 2000
  • In this research, a novel sampling strategy for a CMM to inspect freeform surfaces is proposed. Unlike primitive surfaces, it is not easy to determine the number of sampling points and their locations for inspecting freeform surfaces. Since a CMM operates with slower speed in measurement than optical measuring devices, it is important to optimize the number and the locations of sampling points in the inspection process. When a complete inspection of a surface is required, it becomes more critical. Among various factors to cause shape errors of a final product, curvature characteristic is essential due to its effect such as stair-step errors in rapid prototyping and interpolation errors in NC tool paths generation. Shape errors are defined in terms of the average and standard deviation of differences between an original model and a produced part. Proposed algorithms determine the locations of sampling points by analyzing curvature distribution of a given surface. Based on the curvature distribution, a surface area is divided into several sub-areas. In each sub-area, sampling points are located as further as possible. The optimal number of sub-areas. In each sub-area, sampling points are located as further as possible. The optimal number os sub-areas is determined by estimating the average of curvatures. Finally, the proposed method is applied to several surfaces that have shape errors for verification.

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PMP 방식을 이용한 BGA 볼의 3차원 형상측정 시스템 (3-Dimensional Shape Measurement System for BGA Balls Using PMP Method)

  • 김효준;김준식;주효남
    • 제어로봇시스템학회논문지
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    • 제22권1호
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    • pp.59-65
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    • 2016
  • As modern electronic devices get smaller and smaller, high-resolution, large Field-Of-View (FOV), fast, and cost-effective 3-dimensional (3-D) measurement is requested more and more. In particular, defect inspection machines using machine-vision technology nowadays require 3-D inspection as well as the conventional 2-D inspection. Phase Measuring Profilometry (PMP) is one of the fast non-contact 3-D shape measuring methods currently being extensively investigated in the electronic component manufacturing industry. The PMP system is well known and is successfully applied to measuring complex surface profiles with varying reflectance properties. However, for highly reflective surfaces, such as Ball Grid Arrays (BGAs), it has difficulty accurately measuring 3-D shapes. In this paper, we propose a new fast optical system that can eliminate the highly reflective saturated regions in BGA ball images. This is achieved by utilizing four Low Intensity Grating (LIG) images together with the conventional High Intensity Grating (HIG) images. Extensive experiments using BGA samples show a repeatability of under ${\pm}20um$ in standard deviation, which is suitable for most 3-D shape measurements of BGAs.

통계적 방법에 의한 마이크로솔더볼의 3차원형상검사 (Statistical Approach to 3-Dimensional Shape Inspection of Micro Solder Balls)

  • 김지홍
    • 마이크로전자및패키징학회지
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    • 제28권4호
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    • pp.19-23
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    • 2021
  • 본 논문은 경면반사특성을 갖는 솔더볼의 생산공정 관리와 품질확보를 목적으로 머신비전을 적용한 3차원형상을 결함검사방법으로서, 60미크론 이내의 마이크로 솔더볼을 대상으로 정밀한 위치제어장치가 필요없이 임의로 위치한 솔더볼의 반사영상을 취득 후 통계적으로 분석하여 3차원 형상의 결함유무를 검사하는 방법을 제안한다. 이를 위해 복수개의 LED를 링형태로 배열한 광원을 사용하여 트레이에 위치한 많은 수의 마이크로솔더볼을 동시에 촬영한 영상을 취득하고, 영상처리를 통해 반사되는 LED의 상대적 위치를 구한 후, 통계적 분석을 통하여 결함의 유무를 판단하는 방법을 제안하고 실험을 통해 그 효용성을 보인다.

위치제어가 없는 복수개의 마이크로솔더볼의 형상검사 (A Shape Inspection of Multiple Micro Solder Balls without Positioning Control)

  • 김지홍
    • 마이크로전자및패키징학회지
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    • 제31권3호
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    • pp.62-66
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    • 2024
  • 초록 본 논문은 경면반사특성을 갖는 마이크로솔더볼의 품질확보를 위한 3차원형상의 결함검사 수단으로서, 정밀한 위치제어장치없이 유리접시에 임의로 놓여있는 마이크로솔더볼의 반사영상을 취득하고 이를 통계적으로 분석하여 3차원 형상의 결함유무를 검사하는 방법을 제안한다. 또한, 마이크로솔더볼에 인위적인 진동을 인가하여 위치와 방향을 바꾸면서 촬영과 검사를 반복하여 결함을 검출하는 방법을 제시하여, 마이크로솔더볼의 일부분만이 보이는 촬영영상의 한계를 극복하였다. 이를 위해 복수개의 LED를 링형태로 배열한 광원을 사용하고, 유리접시에 위치한 많은 수의 마이크로솔더볼을 동시에 촬영한 영상을 취득하고, 영상처리를 통해 반사되는 LED의 상대적 위치를 구한 후, 통계적 분석을 통하여 결함의 유무를 판단하는 방법을 제안하고 실험을 통해 그 효용성을 보인다.

건축구조물의 내진성능 향상을 위한 강재댐퍼 형상 및 이력 거동 (Metallic Damper Shape and Cyclic Behavior for the Seismic Capacity Improvement of Building Structures)

  • 이현호;김세일
    • 한국구조물진단유지관리공학회 논문집
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    • 제14권3호
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    • pp.123-130
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    • 2010
  • 본 논문에서는 기존 건축물의 내진성능을 향상시키기 위해 시공성과 설치 비용적인 측면에서 상대적으로 우수한 강재댐퍼를 대상으로 기존 개발된 장치와 새로 개발된 형상의 장치에 대한 평가를 해석적으로 수행하였다. 해석결과는 강도 및 에너지 소산능력으로 평가하였으며, 제안된 내력 산정식의 적용을 아울러 평가하였다. 연구대상 댐퍼의 스트럿 형상은 V형, S형이며, 댐퍼의 스트럿 높이와 각도를 주요 변수로 한 후 ABAQUS를 이용하여 유한요소 해석하였다. 해석은 최대변위를 50mm로 하고 점진적인 이력변위곡선을 적용하여 수행하였다. 항복강도, 최대강도, 에너지 소산능력 평가결과, V형 및 S형 모두 우수한 성능을 보유한 것으로 평가되었으며, 또한 스트럿 각도 $60^{\circ}$ 및 높이 140, 200 mm의 성능이 안정적인 것으로 평가되었다. 전체적으로는 S형의 응답이 V형보다 안정적인 것으로 평가되어, S형 강재댐퍼의 적용성이 V형보다 유리한 것으로 평가되었다.

In-line Automatic defect inspection and repair method for TFT-LCD production

  • Honoki, Hideyuki;Arai, T.;Edamura, T.;Yoshimura, K.;Nakasu, N.
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권1호
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    • pp.286-289
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    • 2007
  • We have developed an automated circuit defect inspection and repair method that can be used to improve the yield ratio of TFT-LCD. The method focuses on correcting resist patterns after the development process to ensure shape regularity. We built a prototype system and confirmed that the method is valid.

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