• Title/Summary/Keyword: Serpentine spring

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Design, Fabrication and Characterization of Lateral PZT actuator using Stiffness Control (강성제어 구조물을 이용한 수평구동형 박막 PZT 엑츄에이터의 설계, 제작 및 특성평가)

  • 서영호;최두선;이준형;이택민;제태진;황경현
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2004.10a
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    • pp.756-759
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    • 2004
  • We present a piezoelectric actuator using stiffness control and stroke amplification mechanism in order to make large lateral displacement. In this work, we suggest stiffness control approach that generates lateral displacement by increasing the vertical stiffness and reducing the lateral stiffness using additional structure. In addition, an additional structure of a serpentine spring amplifies the lateral displacement like leverage structure. The suggested lateral PZT actuator (bellows actuator) consists of serpentine spring and PZT/electrode layer which is located at the edge of the serpentine spring. The edge of the serpentine spring prevents the vertical motion of PZT layer, while the other edge of the serpentine spring makes stroke amplification like leverage structure. We have determined dimensions of the bellows actuator using ANSYS simulation. Length, width and thickness of PZT layer are 135$\mu$m, 20$\mu$m and 0.4$\mu$m, respectively. Dimensions of the silicon serpentine spring are thickness of 25$\mu$m, length of 300$\mu$m, and width of 5$\mu$m. The bellows actuator has been fabricated by SOI wafer with 25$\mu$m-top silicon and 1$\mu$m-buried oxide layer. The bellows actuator shows the maximum 3.93$\pm$0.2$\mu$m lateral displacement at 16V with 1Hz sinusoidal voltage input. In the frequency response test, the fabricated bellows actuator showed consistent displacement from 1Hz to 1kHz at 10V. From experimental study, we found the bellows actuator using thin film PZT and silicon serpentine spring generated mainly laterally displacement not vertical displacement at 16V, and serpentine spring played role of stroke amplification.

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Design of a large deflection 2 DOF scanning mirror using an electromagnetic force (전자기력을 이용한 대변위 구동 2축 스캐닝 미러의 설계)

  • Lee, Kyoung-Gun;Jang, Yun-Ho;Yoo, Byung-Wook;Jin, Joo-Young;Lim, Yong-Geun;Kim, Yong-Kweon
    • Proceedings of the KIEE Conference
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    • 2008.10a
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    • pp.181-182
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    • 2008
  • In this paper, we present the design of an electromagnetic scanning mirror with rotated serpentine springs. We considered three types of torsional springs: simple beam springs (SBS), classic serpentine springs (CSS), and rotated serpentine springs (RSS). The analysis was done for an electrical resistance, differences in the mode-frequency, and resonances regarding to spring thickness. Electromagnetic coils under the mirror plate were also analyzed for power consumption and the mechanical deflection. From the analysis result, RSS and electromagnetic coils were designed for the silicon scanning mirror.

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Design of Electromagnetically Driven Micro Scanning Mirror for Laser Animation System (레이저 디스플레이를 위한 전자력 구동 스캐닝 미러의 설계)

  • Lee, Kyoung-Gun;Jang, Yun-Ho;Yoo, Byung-Wook;Jin, Joo-Young;Lim, Yong-Geun;Kim, Yong-Kweon
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.58 no.3
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    • pp.578-585
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    • 2009
  • In this paper, we present the design of an electromagnetic scanning mirror with torsional springs. The scanning mirror consisting of torsional springs and electromagnetic coils was designed for the applications of laser animation systems. We analyzed and optimized three types of torsional springs, namely, straight beam springs (SBS), classic serpentine springs (CSS), and rotated serpentine springs (RSS). The torsional springs were analyzed in terms of electrical resistance, fabrication error tolerance, and resonance mode separation of each type using analytical formula or numerical analysis. The RSS has advantages over the others as follows: 1) A low resistance of conductors, 2) wide resonance mode separation, 3) strong fabrication error tolerance, 4) a small footprint. The double-layer coils were chosen instead of single-layer coils with respect to electromagnetic forces. It resulted in lower power consumption. The geometry of the scanning mirror was optimized by calculations; RSS turn was 12 and the width of double-layer coil was $100{\mu}m$, respectively. When the static rotational angle is 5 degrees, the power consumption of the mirror plate was calculated to be 9.35 mW since the resistance of the coil part and a current is $122{\Omega}$ and 8.75 mA, respectively. The power consumption of full device including the mirror plate and torsional springs was calculated to be 9.63 mW.

Novel Intensity-Based Fiber Optic Vibration Sensor Using Mass-Spring Structure (질량-스프링 구조를 이용한 새로운 광세기 기반 광섬유 진동센서)

  • Yi, Hao;Kim, Hyeon-Ho;Choi, Sang-Jin;Pan, Jae-Kyung
    • Journal of the Institute of Electronics and Information Engineers
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    • v.51 no.6
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    • pp.78-86
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    • 2014
  • In this paper, a novel intensity-based fiber optic vibration sensor using a mass-spring structure, which consists of four serpentine flexure springs and a rectangular aperture within a proof mass, is proposed and its feasibility test is given by the simulation and experiment. An optical collimator is used to broaden the beam which is modulated by the displacement of the rectangular aperture within the proof mass. The proposed fiber optic vibration sensor has been analyzed and designed in terms of the optical and mechanical parts. A mechanical structure has been designed using theoretical analysis, mathematical modeling, and 3D FEM (Finite Element Method) simulation. The relative aperture displacement according to the base vibration is given using FEM simulation, while the output beam power according to the relative displacement is measured by experiment. The simulated sensor sensitivity of $15.731{\mu}W/G$ and detection range of ${\pm}6.087G$ are given. By using reference signal, the output signal with 0.75% relative error shows a good stability. The proposed vibration sensor structure has the advantages of a simple structure, low cost, and multi-point sensing characteristic. It also has the potential to be made by MEMS (Micro-Electro-Mechanical System) technology.