• 한국재료학회:학술대회논문집
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• 한국재료학회 2009년도 춘계학술발표대회
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• pp.12.1-12.1
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• 2009

For the micro conductive line, memory device fabrication process use many expensive processes such as manufactur-ing of photo mask, coating of photo resist, exposure, development, and etching. However, direct printing technology has the merits about simple and cost effective processes because nano-metal particles contained inks are directly injective without mask. And also, this technology has the advantage about fabrication of fine pattern line on various substrates such as FPCB, PCB, glass, polymer and so on. In this work, we have fabricated the fine and thick metal pattern line on flexible PCB substrate for the next generation electronic circuit using Ag nano-particles contained ink. To improve the line tolerance on flexible PCB, metal lines are fabricated by sequential prinitng method. Sequential printing method has vari-ous merits about fine, thick and high resolution pattern lines without bulge.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.502-502
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• 2007

Current thin film process using memory device fabrication process use expensive processes such as manufacturing of photo mask, coating of photo resist, exposure, development, and etching. However, direct printing technology has the merits about simple and cost effective processes because inks are directly injective without mask. And also, this technology has the advantage about fabrication of fine pattern line on various substrates such as PCB, FCPB, glass, polymer and so on. In this work, we have fabricated the fine and thick metal pattern line for the electronic circuit board using metal ink contains Ag nano-particles. Metal lines are fabricated by two types of printing methods. One is a conventional printing method which is able to quick fabrication of fine pattern line, but has various difficulties about thick and high resolution DPI(Dot per Inch) pattern lines because of bulge and piling up phenomenon. Another(Second) methods is sequential printing method which has a various merits of fabrication for fine, thick and high resolution pattern lines without bulge. In this work, conductivities of metal pattern line are investigated with respect to printing methods and pattern thickness. As a result, conductivity of thick pattern is about several un.

• 한국정밀공학회지
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• 제17권2호
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• pp.130-136
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• 2000

Generally, the build-up printed circuit board manufactured by the sequential process with etching, plating, drilling etc. requires many types of equipments and lead time. Etching process is suitable for mass production, however, it is not adequate for manufacturing prototype in the developing stage. In this study, we introduce a screen printing technology to prototyping a build-up printed circuit board. As for the material, photo/thermal curable resin and conductive paste are used for the formation of dielectric and conductor. The build-up structure is made by subsequent processes such as the formation of liquid resin thin layer, the solidification by UV/IR light, and via filling with conductive paste. By use of photo curable resin, productivity is greatly enhanced compared with thermal curable resin. Finally, the basic concept and the possibility of build-up printed circuit board prototyping are proposed in comparison with to the conventional process.

• 한국인쇄학회지
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• 제21권1호
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• pp.35-44
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• 2003

Because of computer developing, the digital image making the use of many a field of application with - web-above, electronic publishing. printing, dynamic image management and photo CD production etc., however many problems of save and management. The management image use of compression moth which don't have a affect on image, reduce file size. A study used sequential DCT0based mode and progressive DCT-based mode of JPEG(Joing Photographic Experts Group) compression method and Wavelet compression method. Therefore, the analog image and digital image was changed and applied by several stages according to compression rate. It made inquiries of the optimum compression rate that be compared quality transformation between original image and compressed image. As compression image was printing simply, the quality was studied by subjective valuation method, that was studied propriety and usefulness.

• 한국정밀공학회지
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• 제29권3호
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• pp.295-301
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• 2012

The method for spraying of liquids through an electrical field has become a printing method since it can make very small droplet. For electro-hydrodynamic jet printing to become a reliable jetting tool, the jetting performance should be characterized with respect to various jetting conditions. To optimize jetting conditions, the jetting behavior should be measured. In this study, we present a visualization techniques to measure jetting behavior from electro-hydrodynamic (EHD) inkjet head. Unlike most previous method, we use the CCD camera to measure the jetting behavior. For this purpose, LED light is synchronized with jetting signal and sequential image was obtained by adjusting the delay time of the LED light. Finally, merits and demerits of using CCD camera were discussed to measure jetting image from EHD inkjet head.

• International Journal of Precision Engineering and Manufacturing
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• 제4권4호
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• pp.51-56
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• 2003

Generally, the build-up printed circuit board manufactured by a sequential process involving etching, plating, drilling, etc, which requires many types of equipments and long lead time. Etching process is suitable for mass production, however, it is not adequate for manufacturing a prototype in the development stage. In this study, we introduce a screen printing technology for prototyping a build-up printed circuit board. As for the material, photo/thermal curable resin and conductive paste are used for the formation of dielectric and conductor. The build-up structure is made by subsequent processes such as formation of a liquid resin thin layer, solidification by a UV/IR light, and via hole filling with a conductive paste. By use of photo curable resin, productivity is greatly enhanced compared with thermal curable resin. Finally, the basic concept and the possibility of build-up printed circuit board prototyping are proposed in comparison with the conventional process.

• Korean Chemical Engineering Research
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• 제60권1호
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• pp.132-138
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• 2022

본 연구에서는 광경화 3D 프린팅 방식인 SLA (Stereo Lithography Apparatus) 방식 출력물의 후처리 방법에 따른 표면 특성의 변화를 체계적으로 비교하고, 용도에 맞는 후처리 방법에 대한 정보를 제공하기 위한 기초 연구를 수행하였다. SLA 방식 출력물은 연마를 통해 표면의 불규칙한 미세구조를 규칙적으로 변화시켜 투명도를 일부 개선할 수는 있었으나, 유리와 같은 충분한 투명도를 확보하기는 어려웠다. 연마에 따른 접촉각 특성 변화는 연마 시간이 증가할 수록 그리고 사용된 사포의 입도가 작을 수록 다소 증가하는 경향을 보였으나 샘플 간 편차가 크고 평균 77~90°의 접촉각을 나타내어 대부분 통계적으로 유의미한 차이를 보이지는 않았다. 연마 이외 다양한 방법을 통한 표면처리 방법이 시도되었으며, 시판되는 차량용 흠집제거제나 실리콘 오일 등을 도포하여 쉽고 간단하게 투명도를 개선하는 것이 가능함을 확인하였다. 또한, 입도 사이즈를 줄이며 순차적으로 연마한 후 흠집제거제를 사용함으로써 유리와 같은 높은 투명도를 확보할 수 있는 방법을 제안하였다. 마지막으로 연마와 다양한 방법을 통해 표면처리를 하더라도 접촉각은 90° 이상을 확보하기 어려웠으며 소수성의 특성을 필요로 하는 경우, 본 연구에서 사용된 다양한 방법 외 소수성 코팅과 같은 추가적인 처리가 필요함을 확인하였다.

• 한국기계가공학회지
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• 제14권3호
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• pp.15-20
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• 2015

After the US government declared 3D printing technology a next-generation manufacturing technology, there have been many practical studies conducted to expand 3D printing technology to manufacturing technologies, called AMERICA MAKES. In particular, the Keck Center, located at the University of Texas at El Paso, has studied techniques for easily combing the 3D stacking process with space mobility and expanded these techniques to simultaneous staking techniques for multiple materials. Additionally, it developed convergence manufacturing techniques, such as direct inking techniques, in order to produce a module structure that combines electronic circuits and components, such as CUBESET. However, in these studies, it is impossible to develop a unified system using traditional independent through simple sequencing connections. This is because there are many problems in the integration between the stacking modeling of 3D printers and post-machining, such as thermal deformations, the precision accuracy of 3D printers, and independently driven coordinate problems among process systems. Therefore, in this paper, the integration method is suggested, which combines these 3D printers and subsequent machining process systems through an Internet-based cloud. Additionally, the sequential integrated system of a 3D printer, an NC milling machine, machine vision, and direct inking are realized.

• 한국인쇄학회지
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• 제25권1호
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• pp.121-133
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• 2007

The CMS(color management system) software was to enable consistent color reproduction from original to reproduction. The CMS was to create RGB monitor and printer characterization profiles and then use the profiles for device independent color transformation. The implemented CMM(color management module) used the CIELAB color space for the profile connection. Various monitor characterization model was evaluated for proper color transformation. To construct output device profile, SLI(sequential linear interpolation) method was used for the color conversion from CMYK device color to device independent CIELAB color space and tetrahedral interpolation method was used for backward transformation. UCR(under color removal) based black generation algorithm was used to construct CIELAB to CMYK LUT(lookup table). When transforming the CIE Lab colour space to CMYK, it was possible to involve the gray revision method regularized in the brightness into colour transformation process and optimize the colour transformation by black generation method based on UCR technique. For soft copy colour proofing, evaluating several monitor specialism methods showed that LUT algorithm was useful. And it was possible to simplify colour gamut mapping by constructing both the look-up table and the colour gamut mapping algorithm to a reference table.

• KSII Transactions on Internet and Information Systems (TIIS)
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• 제18권1호
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• pp.170-191
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• 2024

The transmission of confidential data using cover media is called steganography. The three requirements of any effective steganography system are high embedding capacity, security, and imperceptibility. The text file's structure, which makes syntax and grammar more visually obvious than in other media, contributes to its poor imperceptibility. Text steganography is regarded as the most challenging carrier to hide secret data because of its insufficient redundant data compared to other digital objects. Unicode characters, especially non-printing or invisible, are employed for hiding data by mapping a specific amount of secret data bits in each character and inserting the character into cover text spaces. These characters are known with limited spaces to embed secret data. Current studies that used Unicode characters in text steganography focused on increasing the data hiding capacity with insufficient redundant data in a text file. A sequential embedding pattern is often selected and included in all available positions in the cover text. This embedding pattern negatively affects the text steganography system's imperceptibility and security. Thus, this study attempts to solve these limitations using the Part-of-speech (POS) tagging technique combined with the randomization concept in data hiding. Combining these two techniques allows inserting the Unicode characters in randomized patterns with specific positions in the cover text to increase data hiding capacity with minimum effects on imperceptibility and security. Format-preserving encryption (FPE) is also used to encrypt a secret message without changing its size before the embedding processes. By comparing the proposed technique to already existing ones, the results demonstrate that it fulfils the cover file's capacity, imperceptibility, and security requirements.