• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.85-91
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• 2002

Even though electroless Hi and Sn-Ag-Cu solder are widely used materials in electronic packaging applications, interfacial reactions of the ternary Ni-Cu~Sn system have not been known well because of their complexity. Because the growth of intermetallics at the interface affects reliability of solder joint, the intermetallics in Ni-Cu-Sn system should be identified, and their growth should be investigated. Therefore, in present study, interfacial reactions between electroless Ni UB7f and 95.5Sn-4.0Ag-0.5Cu alloy were investigated focusing on morphology of the IMCs, thermodynamics, and growth kinetics. The IMCs that appear during a reflow and an aging are different each other. In early stage of a reflow, ternary IMC whose composition is Ni$_{22}$Cu$_{29}$Sn$_{49}$ forms firstly. Due to the lack of Cu diffusion, Ni$_{34}$Cu$_{6}$Sn$_{60}$ phase begins growing in a further reflow. Finally, the Ni$_{22}$Cu$_{29}$Sn$_{49}$ IMC grows abnormally and spalls into the molten solder. The transition of the IMCs from Ni$_{22}$Cu$_{29}$Sn$_{49}$ to Ni$_{34}$Cu$_{6}$Sn$_{60}$ was observed at a specific temperature. From the measurement of activation energy of each IMC, growth kinetics was discussed. In contrast to the reflow, three kinds of IMCs (Ni$_{22}$Cu$_{29}$Sn$_{49}$, Ni$_{20}$Cu$_{28}$Au$_{5}$, and Ni$_{34}$Cu$_{6}$Sn$_{60}$) were observed in order during an aging. All of the IMCs were well attached on UBM. Au in the quaternary IMC, which originates from immersion Au plating, prevents abnormal growth and separation of the IMC. Growth of each IMC is very dependent to the aging temperature because of its high activation energy. Besides the IMCs at the interface, plate-like Ag3Sn IMC grows as solder bump size inside solder bump. The abnormally grown Ni$_{22}$Cu$_{29}$Sn$_{49}$ and Ag$_3$Sn IMCs can be origins of brittle failure.failure.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.24 no.5
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• pp.224-228
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• 2014

Recently, the demands for separation/recovery of valuable metals such as nickel or tin from copper based alloys has been attracting much attention from the viewpoints of environmental protection and resource utilization. In this report, experimental results on concentration increasement of nickel and tin compared to the previous report are investigated. Ni is successfully separated by a organic solvent and reduced to the metal powder whose concentration is over 98 %. Sn is separated by a selective solution method and its concentration is increased to 97.5 % by three consecutive solution and reduction process. Crystal structure, surface morphology and microstructure of the separated samples are studied.

• Resources Recycling
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• v.3 no.1
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• pp.38-43
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• 1994

The separation of valuable metals from IC chip scrap generated by domestic electronic company was carried out using the mechanical beneficiation such as shredding, crushing, screening and magnetic separation. The distribution of metals in various sizes of crushed IC chip scrap was investigated and metals present in crushed products was separated with the magnetic separator. The particle size distribution of crushed IC chip scrap was 7.5% for +3mm, 17.0% for 3~1mm and 75.5% for -1mm. The weight loss of crushed IC chip scrap was 18% when roasted at $700^{\circ}C$. The content of metals was 96% for +3~1mm, 13% for 1~0.595mm, 3.7% for 0.95~0.5. Au of 99% was present in -1mm crushed IC chip scrap. Ni, Fe, Cu, Sn and Pb were separated from crushed IC chip scrap by the magnetic separator under 700 and 2, 500 Gauss.

• Proceedings of the Korean Nuclear Society Conference
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• 2005.05a
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• pp.309-310
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• 2005

Some minor elements(Al, B, Ba, Ca, Cd, Co, Cr, Cu, Gd, Mg, Mn, Mo, Nd, Ni, P, Pb, Si, Sn, Sr, Ti, V, Yb, Zn and Zr) in iron compounds such as the S/G sludge of a power plant were separated from iron by anionic and cationic exchange methods. If a ICP-AES or AAS determination follows this method, minor elements of more than 2 or 20 ppm of Fe can be determined with an error less than 20% except Sn and Mo. Alkaline elements were excluded from this study since they can be easily recovered from an anionic exchange. Application to real sludge samples is ongoing.

• Resources Recycling
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• v.10 no.5
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• pp.29-35
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• 2001

This study was carried out to recover gold, silver and valuable metals from the printed circuit boards (PCBs) of waste computers. PCBs samples were crushed under 1 mm by a shredder and separated into 30% conducting and loft nonconducting materials by an electrostatic separator. The conducting materials contained valuable metals which were then used as feed materials for magnetic separation. 42% of magnetic materials from the conducting materials was removed by magnetic separation as nonvaluable materials and the others, 58% of non magnetic materials, was used as leaching samples containing 0.227 mg/g Au and 0.697 mg/g Ag. Using the materials of leaching from magnetic separation, more than 95% of copper, iron, zinc, nickel and aluminium was dissolved in 2.0M sulfuric acid solution, added with 0.2M hydrogen peroxide at $85^{\circ}C$. Au and Ag were not extracted in this solution. On the other hand, more than 95% of gold and 100% of silver were leached by the selective leaching with a mixed solvent (0.2M($NH_4$)$_2$$S_2$$O_3$,0.02M $CuSO_4$,0.4M $NH_4$OH). Finally, the residues were reacted with a NaCl solution to leach Pb whereas sulfuric acid was used to leach Sn. Recoveries reached 95% and 98% in solution, respectively.

• Analytical Science and Technology
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• v.13 no.3
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• pp.297-303
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• 2000

Isotope-dilution inductively coupled plasma mass spectrometry was used to determine trace amounts of Cd, Cu, Pb, Ni and Zn in sediment. Sediment samples were dissolved by microwave digestion with addition of mixed acid ($HNO_3$, HF and $HClO_4$). Lead was determined after separation of alkaline and alkaline earth metals by an ammonium pyrrolidenedithiocarbarmate (APDC) solvent extraction. The other elements were determined after separation of iron, tin and titanium by hydroxide precipitation. Recovery efficiency of the analyte elements was not satisfactory, but most of matrix elements causing the isobaric interference could be effectively eliminated by the separation. Good agreement was achieved with the certified values in the analysis of the two sediment reference materials.

• Bulletin of the Korean Chemical Society
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• v.20 no.3
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• pp.352-354
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• 1999

The spectrophotometric determination of Cu(Ⅱ) with α-(2-benzimidazolyl)-α',α"-(N-5-nitro-2-pyridylhydrazone)-toluene has been investigated. The optimum conditions of pH, stability, concentration of ligand and surfactant were evaluated. This method is a simple and sensitive method for determination of Cu(Ⅱ) and offers a selective separation of Cu(Ⅱ) from sample solution containin- I ppm below amount of Ni(Ⅱ), Co(Ⅱ), Zn(Ⅱ) and Sn(Ⅱ). Copper was determined by measuring the absorbance of Cu(Ⅱ)-BINPHT complex extracted with benzene in Brij 58 surfactant at 410 nm. Beer's law is obeyed over the concentration range 0∼2.5 μgmL-1 and the detection limit (S/N=2) is 0.06 μgmL-1. The relative standard deviation at the 0.3 μgmL-1 is 2.4% (N=7). The method was applied for the determination of Cu(Ⅱ) in various milks.

• Bulletin of the Korean Chemical Society
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• v.24 no.4
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• pp.489-493
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• 2003

2-Mercaptobenzothiazole was used as a highly selective and efficient carrier for the uphill transport of silver ion through a chloroform bulk liquid membrane. In the presence of thiosulfate ion as a suitable metal ion acceptor in the receiving phase, the amount of silver transported across the liquid membrane after 180 min was 90 ± 3.0%. The selectivity and efficiency of silver ion transported from aqueous solutions containing equimolar mixtures of $Zn^{2+}, Cu^{2+}, Co^{2+}, Ni^{2+}, Cd^{2+}, Pb^{2+}, Bi^{3+}, Fe^{2+}, Fe^{3+}, Pd^{2+}, Mn^{2+}, Hg^{2+}, Sn^{2+}, Ca^{2+}, Mg^{2+}, K^+, Na^+ and Li^+$ were investigated.

• Archives of design research
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• v.17 no.4
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• pp.241-250
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• 2004

In this research, the copper alloy plates C2200, C5210, C7701, C8113 were selected to make datum and to identify further usage of metal craft experimentation. For its experimentation, the general welding and TIG welding methods were researched; for 2nd experimentation, the Reticulation and Electroforming skill's differences in color and temperature were researched. With these methods 3 different kinds of works are introduced for sample studies. For this research, Dr. Lee, Dong-Woo who works in Poongsan Metal Co, supported 4 kinds of copper alloy metals. Which are Commercial bronze (Cu-Zn), Deoxidiged Copper(Cu-Sn-P), Nickel Silver (Cu-Ni-Zn), and White Bronze (Cu-Ni); they were applied partly and wholly by the method of Laminatin, Reticulation, Fusing, and Electroforming skills. In case of C2200, the brass, the A. C. TIG welding method is better under 2mm slight plate; the D.C. TIG welding is better upper 2mm plate; and 250~300$^{\circ}C$ is recommended for remain heat treatment. In case of C5210, not having Hydrogen in high temperature return period, doesn't need Oxygen in high temperature and hardening in comparative high temperature neither, it is good for welding. It contains Sn 2-9% ad P 0.03-0.4% generally; and in accordance with the growth rate of Sn contain amount, the harden temperature boundary become broad. In case of cold moment after welding, they are recommended that higher speed TIG welding, smaller melting site and less than 200$^{\circ}C$ for pre-heating temperature. In case of C7701, the 10-20% Ni, 15-30% Zn are widely used.. If it is upper 30% Zn, it become (${\alpha}+{\beta}$) system and adhesive power rate become lower, and the productivity become lower in low temperature but the productivity become higher in high temperature. Nickel Silver's resistance of electricity is well; and the heatproof and incorrodibility is good, too. Lastly, in case of C8113, good at persistence in salty and grind; high in strength of high temperature. In case of white brass, contain 10-30% Nickel and hardened in high temperature and become single phrase. For these reason, the crystallization particles easily become large, if the resistance become higher small amount of Pb, P, S separation rate become higher.

• Analytical Science and Technology
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• v.17 no.3
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• pp.199-210
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• 2004

A new polystyrene-divinylbenzene chelating resin containing 4,5-dihydroxy-naphthalene-2,7-disulfonic acid (chromotropic acid : CTA) as functional group has been synthesized and characterized. The sorption and desorption properties of this chelating resin for Cr(III) ion and Cr(VI) ion including nine metal bloodstain. As a results, FOB test kit could be effectively applied to identification of human blood at chelating resin was stable in acidic and alkaline solution. The Cr(VI) ion is selectively separated from Cr (III) ion at pH 2 and the maximum sorption capacity of Cr(VI) ion is 1.2 mmol/g. In the presence of anions such as $F^-$, $SO{_4}^{2-}$, $CN^-$, $CH_3COO^-$, $NO{_3}^-$, the sorption of Cr(VI) ion was reduced but anions such as $PO{_4}^{3-}$ and $Cl^-$ revealed no interference effect. The elution order of metal ions obtained from breakthrough capacity and overall capacity at pH 2 was Cr(VI)>Sn(II)>Fe(III)>Cu(II)>Cd(II)${\simeq}Pb(II){\simeq}Cr(III){\simeq}Mn(II){\simeq}Ni(II){\simeq}Al(III)$. Desorption characteristics for Cr(VI) ion was investigated with desorption agents such as $HNO_3$, HCl, and $H_2SO_4$. It was found that the ion showed high desorption efficiency with 3 M HCl. As the result, the chelating resin, XAD-16-CTA was successfully applied to separation and preconcentration of Cr (VI) ion from several metal ions in metal finishing works.