• 한국산업융합학회 논문집
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• 제12권4호
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• pp.215-219
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• 2009

A packaging technology based on flip-chip bonding and Pb-free solder for silicon pressure sensors on printed circuit board (PCB) is presented. First, the bump formation process was conducted by Pb-free solder. Ag-Sn-Cu solder and the pressed-screen printing method were used to fabricate solder bumps. The fabricated solder bumps had $189-223{\mu}m$ width, $120-160{\mu}m$ thickness, and 5.4-6.9 standard deviation. Also, shear tests was conducted to measure the bump shear strength by a Dage 2400 PC shear tester; the average shear strength was 74 g at 0.125 mm/s of test speed and $5{\mu}m$ shear height. Then, silicon pressure sensor packaging was implemented using the Pb-free solder and bump formation process. The characteristics of the pressure sensor were analogous to the results obtained when the pressure sensor dice are assembled and packaged using the standard wire-bonding technique.

• 센서학회지
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• 제32권2호
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• pp.105-109
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• 2023

In this study, we present a power-efficient driving method for gas sensor systems based on the analysis of input signal characteristics. The analysis of the gas sensor output signal characteristics in the frequency domain shows that most of the signal portions are distributed in a relatively low frequency region when extracting the gas sensor signal, which can lead to further performance improvement of the gas sensor system. Therefore, the proposed gas signal extracting technique changes the operating frequency of the read-out circuit based on the frequency characteristics of the output signal of the gas sensor, resulting in a reduction of power consumption at the whole system level. The proposed sensing technique, which can be applied to a general-purpose commercial gas sensor system, was implemented in a printed circuit board (PCB) to verify its effectiveness at the commercial level.

• 한국안전학회지
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• 제32권3호
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• pp.15-20
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• 2017

This study presented the strength of the materials and parts for smart distribution board fabrication, and developed a work operation process chart for smart distribution board fabrication. This work operation process chart for smart distribution board fabrication complied with SPS-KEMC regulations, and the applicable range and object are less than 1,000 V and 1,000 Hz for the AC distribution board and less than 1,500 V for the DC distribution board. The power supply is 3 phase 4 wires ($3{\Phi}$ 4W), divided into a single phase circuit and a 3 phase circuit. In addition, the circuit was configured so that the leakage current flowing through the distribution line of the load could be monitored in real time by using the sensor module installed at the rear end of the circuit breaker. Therefore, the administrator can easily find the risk factor of the load since engineer can check the leakage current of each distribution line. In addition, if a leakage current greater than standard value flows, it is possible to generate an alarm against a short circuit and cut off the leakage current. The work operation process chart for the smart distribution board fabrication consists of the following steps: raw and subsidiary materials, sheet metal work, tube making, welding, painting, busbar fabrication, assembly and wiring, product inspection, shipment, etc. Moreover, symbols, ${\Delta}$, ${\nabla}$, ${\bigcirc}$, ${\Rightarrow}$, etc. were used according to the type of work and work progress so that workers can easily understand the progress of the work.

• Korean Chemical Engineering Research
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• 제47권6호
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• pp.715-719
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• 2009

본 연구에서는 DNA 정보를 상변화 물질의 전기저항 변화특성으로 검출할 수 있는 상변화 전극 기판을 개발하였다. 이를 위해 반도체 공정에서 사용하는 Al을 사용하여 전극 기판을 제작하였다. 하지만 주사전자현미경을 이용하여 Al 전극의 단면 상태를 확인해 본 결과 PETEOS(plasma enhanced tetraethyoxysilane) 내에서 보이드(void)가 발생하여 후속공정인 에치백과 세정공정 분위기에 과도하게 노출되어 심하게 손상되어 전극과 PETEOS 사이에 홀(hole)로 변형된다. 이 문제점을 해결하기 위하여 에치백 및 세정 공정을 진행하지 않으면서 $Ge_2Sb_2Te_5$(GST) 박막의 단차피복성(stepcoverage)을 좋게 할 수 있고, 열역학적으로 GST 박막과의 반응성을 고려했을 때 안정적이면서 비저항이 낮은 TiN 재료를 사용하여 상변화 전극 기판을 제작하였다. 주사전자현미경을 통하여 전극의 단면의 상태를 관찰하였으며 TiN 전극과 GST 박막이 정상적으로 연결되어 있는 것을 확인하였다. 또한 저항측정 장비를 사용하여 TiN 상변화 전극 기판 위에 증착된 GST의 비정질과 결정질의 저항을 측정하였고, GST의 비정질과 결정질저항의 차이는 약 1,000배 정도로 신호를 검출하는데 충분함을 확인하였다.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2001년도 하계종합학술대회 논문집(2)
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• pp.9-12
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• 2001

In oriental medicine, it is possible to classify each person into eight kinds of constitutions based on the eight constitutional medicine theory. We developed a piezoelectric 3-channel tactile sensor using PVDF (polyvinylidene fluoride) film for pulse detection of the radial artery. High frequency buffer (impulse buffer), amplifier, 60 Hz noise notch filter and low pass filter were integrated on three sheets of PCB board. The pulses of the radial artery at three points were checked using our system. Each constitution of the eight ones has different combinations of pulses.

• 대한전기학회논문지:시스템및제어부문D
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• 제52권6호
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• pp.342-350
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• 2003

In this paper, a levitation controller for a magnetic levitation(MagLev) system is designed and implemented. The target to be controlled is PEM(permanent and electromagnet) type with 4-corners levitation which is open-loop unstable, highly non-linear and time-varying system. The digital control system consists of a VME-based CPU board, AD board, PU board, 4-Quadrant chopper, and gap sensor, accelerometer as feedback sensors. In order to estimate the velocity of the magnet, we used 2nd-order state observer with acceleration and gap signal as input and output, respectively. Using the estimated states, a state feedback control law for the plant is designed and the feedback gains are selected by using the pole-placement method. The designed controller is experimentally validated by step-type gap reference change and force disturbance test.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2005년도 추계학술대회논문집
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• pp.883-886
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• 2005

This paper proposed a wireless measurement system (WMS) for an effective condition monitoring using wireless communication. WMS consists of two parts: transmitter(TM) acquired a dynamic signal from physical system using ICP type accelerometer sensor. An acquired signal modulated through the low/high pass filter and amplifier in DAQ board, which converted to digital signal. Embedded board(E-board) transferred digital signals to base station(BS) through the socket IEEE.802.11.b. BS is adopted IOCP server structure. Because it can acquired signal well during transferred digital signal. Signal processing used LabVIEW Library, BS(server) designed to realize multi-thread using visual C++.NET for 1 many meaning data processing

• 센서학회지
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• 제17권3호
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• pp.168-177
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• 2008

An indoor environmental monitoring system using IEEE 802.15.4 based wireless sensor network is proposed to monitor the amount of pollutant entering to the room from outside and also the amount of pollutant that is generated in indoor by the building materials itself or human activities. Small-size, low-power wireless sensor node and low power electrochemical sensor board is designed to measure the condition of indoor environment in buildings such as home, offices, commercial premises and schools. In this paper, two query models, the broadcasting query protocol and flooding query protocol, were designed and programmed as a query-based routing protocol in wireless sensor network for an environment monitoring system. The flooding query routing protocol in environment monitoring is very effective as a power saving routing protocol and reliable data transmission between sensor nodes.

• Smart Structures and Systems
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• 제15권6호
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• pp.1543-1567
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• 2015

In this study, a wireless crack sensor is developed for monitoring cracks propagating in two dimensions. This sensor is developed by incorporating a laser-based optical navigation sensor board (ADNS-9500) into a smart wireless platform (Imote2). To measure crack propagation, the Imote2 sends a signal to the ADNS-9500 to collect a sequence of images reflected from the concrete surface. These acquired images can be processed in the ADNS-9500 directly (the navigation mode) or sent to Imote2 for processing (the frame capture mode). The computed crack displacement can then be transmitted wirelessly to a base station. The design and the construction of this sensor are reported herein followed by some calibration tests on one prototype sensor. Test results show that the sensor can provide sub-millimeter accuracy under sinusoidal and step movement. Also, the two modes of operation offer complementary performance as the navigation mode is more accurate in tracking large amplitude and fast crack movement while the frame capture mode is more accurate for small and slow crack movement. These results illustrate the feasibility of developing such a crack sensor as well as point out directions of further research before its actual implementation.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.1067-1070
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• 2003

In this paper, we present a remote measurement system for the wireless monitoring of ECU Sensor Signals of vehicle. In order to measure the ECU sensor signals, the interface circuit is designed to communicate ECU and designed terminal wirelessly according to the ISO, SAE regulation of communication protocol standard. A micro-controller 80C196KC is used for communicating ECU sensor signals. ECU sensor signals are transmitted to the RF-wireless terminal that was developed using the micro controller 80386EX. LCD, and RF-module. 80386EX software is programmed to monitor the ECU sensor signals using the Borland C++ compiler in which the half duplex method was used for the RS232 communication. The algorithms for measuring the ECU sensor signals are verified to monitor ECU state. At the same time, the information to fix the vehicle's problem can be shown on the developed monitoring software. The possibility for remote measurement of ECU sensor signals using 80386EX is also verified through the developed systems and algorithms.