• Title/Summary/Keyword: Semiconductors

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Stimulated emission from optically pumped column-III nitride semiconductors at room temperature (III족 질화물 반도체의 실온 광여기 유도방출)

  • 김선태;문동찬
    • Electrical & Electronic Materials
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    • v.8 no.3
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    • pp.272-277
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    • 1995
  • We report the properties of optically pumped stimulated emission at room temperature (RT) from column-III nitride semiconductors of GaN, AlGaN/GaN double heterostructure (DH) and AlGaN/GaInN DH which prepared on a sapphire substrate using an AIN buffer-layer by the nietalorganic vapor phase epitaxy (MOVPE) method. The peak wavelength of the stimulated emission at RT from AIGaN/GaN DH is 369nm and the threshold of excitation pumping power density (P$\_$th/) is about 84kW/cm$\^$2/, and they from AlGaN/GaInN DH are 402nm and 130kW/cm$\^$2/ at the pumping power density of 200kW/cm$\^$2/, respectively. The P$\_$th/ of AIGaN/GaN and AlGaN/GaInN DHs are lower than the single layers of GaN and GaInN due to optical confinement within the active layers of GaN and GaInN, respectively.

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Growth features and nucleation mechanism of Ga1-x-yInxAlyN material system on GaN substrate

  • Simonyan, Arpine K.;Gambaryan, Karen M.;Aroutiounian, Vladimir M.
    • Advances in nano research
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    • v.5 no.4
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    • pp.303-311
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    • 2017
  • The continuum elasticity model is applied to investigate quantitatively the growth features and nucleation mechanism of quantum dots, nanopits, and joint QDs-nanopits structures in GaInAlN quasyternary systems. We have shown that for GaInAlN material system at the critical strain of ${\varepsilon}^*=0.039$ the sign of critical energy and volume is changed. We assume that at ${\varepsilon}={\varepsilon}^*$ the mechanism of the nucleation is changed from the growth of quantum dots to the nucleation of nanopits. Obviously, at small misfit (${\varepsilon}$ < ${\varepsilon}^*$), the bulk nucleation mechanism dominates. However, at ${\varepsilon}$ > ${\varepsilon}^*$, when the energy barrier becomes negative as well as a larger misfit provides a low-barrier path for the formation of dislocations, the nucleation of pits becomes energetically preferable. The free energy of mixing for $Ga_{1-x-y}In_xAl_yN$ quasiternary system was calculated and studied and its 3D sketch was plotted.

A study on wafer processing using backgrinding system

  • Seung-Yub Baek
    • Design & Manufacturing
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    • v.18 no.2
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    • pp.9-16
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    • 2024
  • Recently, there has been extensive research conducted on the miniaturization of semiconductors and the improvement of their integration to achieve high-quality and high-performance electronic devices. To integrate and miniaturize multiple semiconductors, thin and precise wafers are essential. The backgrinding process, which involves high-precision processing, is necessary to achieve this. The backgrinding system is used to grind and polish the back side of the wafer to reduce its thickness to ㎛ units. This enables the high integration and miniaturization of semiconductors and a flattening process to allow for detailed circuit design, ultimately leading to the production of IC chips. As the backgrinding system performs precision processing at the ㎛ unit, it is crucial to determine the stability of the equipment's rigidity. Additionally, the flatness and surface roughness of the processed wafer must be checked to confirm the processability of the backgrinding system. IIn this paper, the goal is to verify the processability of the back grinding system by analyzing the natural frequency and resonance frequency of the equipment through computer simulation and measuring and analyzing the flatness and surface roughness of wafers processed with backgrinding system. It was confirmed whether processing damage occurred due to vibration during the backgrinding process.