• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.10
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• pp.5906-5911
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• 2014

Currently, there are many processes of package assembly and inspections of real fields that examine whether a manufactured semiconductor can be operated regularly and can endure low humidity or high temperatures. As the inspection equipment of a semiconductor test handler picker has been used at the inspection process, these inspection equipment frames were modelled in 3D and these models were analyzed using 3 kinds of fatigue loadings. As the analysis result, maximum deformation occurred at the midparts of the frames at cases 1 and 2. Among the cases of nonuniform fatigue loads, the 'SAE bracket history' with the severest change in load became the most unstable but the 'Sample history' became the most stable. Fatigue analysis result can be used effectively with the design of an inspecting equipment frame of a semiconductor test handler picker to examine the prevention and durability against damage.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.8
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• pp.4815-4820
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• 2014

As semiconductor chips are on a small scale, large content and high integratation, it is essential to develop the device of pick and place at the system of the semiconductor test handler to ensure its high precision and durability. In this study, inspection equipment frame model of a semiconductor test handler picker was investigated by vibration analysis with the property of the natural frequency and harmonic response. As 3 kinds of analysis case models, the device of pick and place was located at the left side (Case 1), the center (Case 2) and the right side (Case 3) of the upper guideline. The range of natural frequencies until the 6th order on this frame model ranges from 80Hz to 500Hz. As the analysis of the harmonic response when the frame is resonant, Case 2 showed the maximum equivalent stress of 52.802 MPa more than Cases 1 or 3. Case 2 was the most intensive among the three cases. Using the analysis result of this study, the design of the frame model, which can be applied to the safe working environment of the system is believed to be possible.