• Transactions on Electrical and Electronic Materials
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• v.17 no.4
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• pp.196-200
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• 2016

We have developed new electrostatic discharge (ESD) protection devices with, bidirectional flip chip transient voltage suppression. The devices differ in their epitaxial (epi) layers, which were grown by reduced pressure chemical vapor deposition (RPCVD). Their ESD properties were characterized using current-voltage (I-V), capacitance-voltage (C-V) measurement, and ESD analysis, including IEC61000-4-2, surge, and transmission line pulse (TLP) methods. Two BD-FCTVS diodes consisting of either a thick (12 μm) or thin (6 μm), n-Si epi layer showed the same reverse voltage of 8 V, very small reverse current level, and symmetric I-V and C-V curves. The damage found near the corner of the metal pads indicates that the size and shape of the radius governs their failure modes. The BD-FCTVS device made with a thin n- epi layer showed better performance than that made with a thick one in terms of enhancement of the features of ESD robustness, reliability, and protection capability. Therefore, this works confirms that the optimization of device parameters in conjunction with the doping concentration and thickness of epi layers be used to achieve high performance ESD properties.

• Journal of the Semiconductor & Display Technology
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• v.22 no.4
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• pp.103-107
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• 2023

To solve the reliability problem of organic devices that are often used outdoors, multifunctional gas barriers that block reactive gases such as moisture and oxygen and reflect harmful light such as ultraviolet rays are needed. In this study, ALD nanolaminate-based optically functional n-DBR was developed to overcome the poor gas permeability of polymer substrates and protect organic devices from harmful light. n-DBR not only achieved a WVTR of 8.76 × 10^-6 g·m^-2·day^-1, but also showed a visible light transmittance of 94.3% and an ultraviolet ray blocking ability of 2.67%. In particular, n-DBR based on a nanolaminate structure maintained its permeability characteristics even in a high temperature and high humidity environment despite being used as a layer of Al₂O₃. This functional barrier Structure can not only be used as a functional encapsulation barrier for the reliability of organic devices, but can also be used as a tinting film for vehicles.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.05a
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• pp.991-994
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• 2000

Recently, reliability engineering is regarded as the major field for aerospace and electronics, semiconductor related industry to improve safety and life cycle. And advanced manufacturing systems with high speed and intelligent have been developed for the betterment of machining ability In this case, reliability prediction has also important roll from design procedure to manufacturing and assembly process. Accordingly in this study, reliability evaluation system has been developed for prevention trouble. quality and life cycle improvement extremely for advanced mother machinary.

• Journal of Korean Society of Occupational and Environmental Hygiene
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• v.26 no.4
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• pp.404-410
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• 2016

Objectives: This study aimed to examine and analyze the material safety data sheet(MSDS) information for photoresist chemicals used in certain processes in semiconductor plants. Methods: After collecting MSDS for 178 chemical products currently used in certain processes in semiconductor plants, we analyzed Sections 2, 3, 11, and 15 of each MSDS with reference to the guidelines for evaluating the reliability of MSDS provided by the Korea Occupational Safety and Health Agency. In addition, we reviewed the recorded uses and the ratios of trade secrets. Results and Conclusions: We studied a total of 178 chemical products. An MSDS was available for 176(98.9%) of them and all adhered to the Globally Harmonized System(GHS) regulations. There were 37 cases of errors in Hazard Identification, pertaining to 20.8% of all products surveyed. There were 64 cases of errors in the current legal circumstances, pertaining to 36.0% of all products. There were a total of 407 trade secrets across 52.2% of products. We believe that a government-led education and certification system needs to be introduced to improve the transfer of MSDS information. The government, chemical manufacturers and suppliers all need to make an effort to produce reliable MSDS.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.1
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• pp.1-16
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• 2023

Recently, the shift to next-generation wide-bandgap (WBG) power semiconductor for electric vehicle is accelerated due to the need to improve power conversion efficiency and to overcome the limitation of conventional Si power semiconductor. With the adoption of WBG semiconductor, it is also required that the packaging materials for power modules have high temperature durability. As an alternative to conventional high-temperature Pb-based solder, Ag sintering die attach, which is one of the power module packaging process, is receiving attention. In this study, we will introduce the recent research trends on the Ag sintering die attach process. The effects of sintering parameters on the bonding properties and methodology on the exact physical properties of Ag sintered layer by the realization 3D image are discussed. In addition, trends in thermal shock and power cycle reliability test results for power module are discussed.

• Journal of Advanced Navigation Technology
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• v.14 no.3
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• pp.432-438
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• 2010

In this paper, we propose a system which can perceive status of semiconductor equipment and evaluate its performance. The proposed system acquires the information such acceleration, pressure, temperature and gas sensors in the surrounding semiconductor equipment. After acquiring information, it is sent to server through multi hop transmission. The transmitted data generates 3 steps alarm using context-aware algorithm of unit or multiple event. From the experiment's result of the proposed system, we confirm that the reliability and efficiency of information is more improved about 80% than a system that doesn't use context-aware algorithm. Moreover, this system can be effective status monitoring of semiconductor equipment because lots of client nodes acquire surrounding information.

• International Journal of Quality Innovation
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• v.8 no.1
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• pp.137-153
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• 2007

Failure mode and effects analysis (FMEA) is a preventive technique in reliability management field. The successful implementation of FMEA technique can avoid or reduce the probability of system failure and achieve good product quality. The FMEA technique had applied in vest scopes which include aerospace, automatic, electronic, mechanic and service industry. The marking process is one of the back ends testing process that is the final process in semiconductor process. The marking process failure can cause bad final product quality and return although is not a primary process. So, how to improve the quality of marking process is one of important production job for semiconductor testing factory. This research firstly implements FMEA technique in laser marking process improvement on semiconductor testing factory and finds out which subsystem has priority failure risk. Secondly, a CCD position solution for priority failure risk subsystem is provided and evaluated. According analysis result, FMEA and CCD position implementation solution for laser marking process improvement can increase yield rate and reduce production cost. Implementation method of this research can provide semiconductor testing factory for reference in laser marking process improvement.

• Journal of the Semiconductor & Display Technology
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• v.20 no.2
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• pp.126-130
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• 2021

The ball grid array is one of the packaging methods that used in high density printed circuit board. Solder void defects caused by voids in the solder ball during the BGA process do not directly affect the reliability of the product, but it may accelerate the aging of the device on the PCB layer or interface surface depending on its size or location. Void inspection is important because it is related in yields with products. The most important process in the optical inspection of solder void is the segmentation process of solder and void. However, there are several segmentation algorithms for the vision inspection, it is impossible to inspect all of images ideally. When X-Ray images with poor contrast and high level of noise become difficult to perform image processing for vision inspection in terms of software programming. This paper suggests the solution to deal with the suggested problem by means of using Mask R-CNN instead of digital image processing algorithm. Mask R-CNN model can be trained with images pre-processed to increase contrast or alleviate noises. With this process, it provides more efficient system about complex object segmentation than conventional system.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.326-329
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• 2009

We investigated the degradation of $In_2O_3-Ga_2O_3$-ZnO (IGZO) thin-film transistors (TFTs), which is promising device for driving circuits of nextgeneration displays. We performed the electronic stress test by applying gate and drain voltage. We discussed the degradation mechanism by thermal analysis and device simulation.

• Journal of the Korean Society for Precision Engineering
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• v.17 no.7
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• pp.217-225
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• 2000

Scanning Acoustic Microscope (SAM) is used as an important nondestructive test tool in semiconductor reliability evaluation and failure analysis. However, inspections of chip attach adhesive interface fer thin chip has proven difficulty as the reflected signals from the chip top and bottom are superimposed. In this paper, in order to overcome this difficulty, a new signal processing method based on the deconvolution technique combined with the wavelet transform is proposed. The wavelet transform complements a disability of deconvolution technique of which performance largely decreases when the waveform of target signal is not identical to that of reference signal. Performances of the proposed method are demonstrated by through computer simulations using model signal and experiments for the fabricated semiconductor samples, and satisfactory results are obtained.