• Design & Manufacturing
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• v.8 no.1
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• pp.27-30
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• 2014

Alloy tool steel such as SKD11 and SKD61 or high speed tool like SKH51 are used as materials for semiconductor dies. Cavities, curl blocks, pot blocks and housings are made from those materials. To make those parts from alloy tool steel or high speed tool, one utilizes discharge machining, and mechanical machining including machining center, milling, drilling, forming grinding and others. In the process of cutting machining and polishing, the die materials become unsuitable for machining owing to bubbles and foreign substances in them, which hinders production process. Therefore, this study focuses on die material selection criteria, and on analysis and comparison of material characteristics to help companies to solve their problems, make die manufacture less burdensome and extend die life.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.30A no.2
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• pp.46-52
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• 1993

The estimation of yield for semiconductor devices requires not only establishment of critical area but also a new parameter of process defect density that contains inspection mean defect density related cleanness of manufacure process line, minimum feature size and the total number of mask process. We estimate the repaired yield of memory devide, leads the semiconductor technique, repaired by redundancy scheme in relation with defect density distribution function, and we confirm the repaired yield for different devices as this model. This shows the possibility of the yield estimation as statistical analysis for the condition of device related cleanness of manufacture process line, design and manufacture process.

• Proceedings of the KIEE Conference
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• 1998.07g
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• pp.2390-2392
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• 1998

In this paper, we discuss the development of monitoring system with data process equipment which transfers data from Remote Terminal Unit(RTU) to monitoring computer. The RTUs sense temperature, pressure and PLC(Programmable Logic Controller) nodes conditions of scrubber in semiconductor manufacture processing. The data Process equipment is connected every RTU and a monitoring computer through serial communication. This equipment receives informations from RTU, process data, and transfers them to monitoring computer. To avoid congestion in data communication, task scheduling algorithm used RT O/S(Real-Time Operating System) is embedded in ROM which is a part of data Process equipment.

• Journal of the Semiconductor & Display Technology
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• v.9 no.4
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• pp.93-97
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• 2010

Fast incipient fault diagnosis is becoming one of the key requirements for economical and optimal process operation management in high-tech industries. Artificial neural networks have been used to detect faults for a number of years and shown to be highly successful in this application area. This paper presents a novel test technique for fault detection and classification for module process of TFT-LCD manufacture using support vector machines (SVMs). In order to evaluate SVMs, this paper examines the performance of the proposed method by comparing it with that of multilayer perception, one of the artificial neural network techniques, based on real benchmarking data.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2004.05a
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• pp.195-201
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• 2004

In design stage of high precision manufacture/inspect ion FAB building, it is necessary to investigate the vibration allowable limits of high precision equipment and to study a structure dynamic characteristics of C/R and Sub-structure in order to provide a structure vibration environment to satisfy thess allowable limits. The aim of this study is to investigate the dynamic characteristics of PC-Type mock-up structures designed for next TFT LCD FAB through vibration measurement and analysis procedure, therefore, to provide a proper dynamic structure design for high precision manufacture/inspection work process, which satisfy thess allowable limits.

• Journal of the Semiconductor & Display Technology
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• v.10 no.1
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• pp.101-105
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• 2011

In case of high-tech process industries such as semiconductor and TFT-LCD manufactures, fault of a virtually finished product that is value-added one, since it has gone throughout the most of processes, may give rise to quality cost nearly amount to its selling price and can be a main cause that decreases the efficiency of manufacturing process. This paper proposes a real-time dispatching algorithm for semiconductor manufacturing process with rework. In order to evaluate the proposed algorithm, this paper examines the performance of the proposed method by comparing it with that of the existing dispatching algorithms, based on various experimental data.

• Journal of the Semiconductor & Display Technology
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• v.6 no.3
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• pp.7-11
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• 2007

The design and manufacture of injection-molded parts with desired properties is a costly process dominated by empiricism, Including the repeated modification of actual tooling. The objective of this study is to obtain the good design of injection-molded polymeric parts using axiomatic design approach.

• Journal of the Korea Safety Management & Science
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• v.4 no.3
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• pp.1-11
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• 2002

It has been Management for stabilize Enterprise-Management for Economic demand for to Productivity, Automation, customer satisfaction, Especially Semiconductor-Industry has been, potential-risk in working to factory to machine equipment, all kinds of utility, gas, chemical, electronic, Fire. This study of basic-purpose has Research Different From as Follow to analysis and Solution For semiconductor product Factory of a actual point Data and specific-gravity to Relation for company-Injury. 1. It has been try to Injury-Tendency and cause-Analysis for our County-Manufacture-Occupation. 2, Semiconductor Injury of Actual-condition in Enforcement for problem and Analysis that Injury Problem has occupated it Submitted to Solution for ordinary Injury theory View to point Solve at for New Model has applicated to that nilem for processed to Solution.

• Journal of Korean Society of Occupational and Environmental Hygiene
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• v.22 no.1
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• pp.52-59
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• 2012

Objectives: The purpose of this study was to evaluate the exposure possibility of by-products during the semiconductor manufacturing processes. Methods: The authors investigated types of chemicals generated during semiconductor manufacturing processes by the qualitative experiment on generation of by-products at the laboratory and a literature survey. Results: By-products due to decomposition of photoresist by UV-light during the photo-lithography process, ionization of arsine during the ion implant process, and inter-reactions of chemicals used at diffusion and deposition processes can be generated in wafer fabrication line. Volatile organic compounds (VOCs) such as benzene and formaldehyde can be generated during the mold process due to decomposition of epoxy molding compound and mold cleaner in semiconductor chip assembly line. Conclusions: Various types of by-products can be generated during the semiconductor manufacturing processes. Therefore, by-products carcinogen such as benzene, formaldehyde, and arsenic as well as chemical substances used during the semiconductor manufacturing processes should be controlled carefully.

• Journal of the Semiconductor & Display Technology
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• v.7 no.3
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• pp.55-58
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• 2008

The objective of this research is to design, manufacture and test a mass flow controller capable of measuring compressible as well as incompressible fluid flows based on a 'bucket and stop-watch' method. The basic principle behind such a system is the measurement of time, where the time taken to fill and empty a bucket of known volume is measured. This device should be able to handle fluid flows in the range of 0.1 ml/min to 10 ml/min within an accuracy of ${\pm}$1%. For the flow meter to be able to compete with established designs, it must be not only comparable in cost and robustness, but also very accurate and reliable as well.