• Title/Summary/Keyword: Semiconductor

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Direct Writing Lithography Technique for Semiconductor Fabrication Process Using Proton Beam

  • Kim, Kwan Do
    • Journal of the Semiconductor & Display Technology
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    • v.18 no.1
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    • pp.38-41
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    • 2019
  • Proton beam writing is a direct writing lithography technique for semiconductor fabrication process. The advantage of this technique is that the proton beam does not scatter as they travel through the matter and therefore maintain a straight path as they penetrate into the resist. The experiment has been carried out at Accelerator Mass Spectrometry facility. The focused proton beam with the fluence of $100nC/mm^2$ was exposed on the PMMA coated silicon sample to make a pattern on a photo resist. The results show the potential of proton beam writing as an effective way to produce semiconductor fabrication process.

Position Control of Wafer Lift Pin for the Reduction of Wafer Slip in Semiconductor Process Chamber

  • Koo, Yoon Sung;Song, Wan Soo;Park, Byeong Gyu;Ahn, Min Gyu;Hong, Sang Jeen
    • Journal of the Semiconductor & Display Technology
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    • v.19 no.4
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    • pp.18-21
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    • 2020
  • Undetected wafer slip during the lift pin-down motion in semiconductor equipment may affect the center to edge variation, wafer warpage, and pattern misalignment in plasma equipment. Direct measuring of the amount of wafer slip inside the plasma process chamber is not feasible because of the hardware space limitation inside the plasma chamber. In this paper, we demonstrated a practice for the wafer lift pin-up and down motions with respect to the gear ratio, operating voltage, and pulse width modulation to maintain accurate wafer position using remote control linear servo motor with an experimentally designed chamber mockup. We noticed that the pin moving velocity and gear ratio are the most influencing parameters to be control, and the step-wised position control algorithm showed the most suitable for the reduction of wafer slip.

Optimal filter design at the semiconductor gas sensor by using genetic algorithm (유전알고리즘을 이용한 반도체식 가스센서 최적 필터 설계)

  • Kong, Jung-Shik
    • Design & Manufacturing
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    • v.16 no.1
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    • pp.15-20
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    • 2022
  • This paper is about elimination the situation in which gas sensor data becomes inaccurate due to temperature control when a semiconductor gas sensor is driven. Recently, interest in semiconductor gas sensors is high because semiconductor sensors can be driven with small and low power. Although semiconductor-type gas sensors have various advantages, there is a problem that they must operate at high temperatures. First temperature control was configured to adjust the temperature value of the heater mounted on the gas sensor. At that time, in controlling the heater temperature, gas sensor data are fluctuated despite supplying same gas concentration according to the temperature controlled. To resolve this problem, gas and temperature are extracted as a data. And then, a relation function is constructed between gas and temperature data. At this time, it is included low pass filter to get the stable data. In this paper, we can find optimal gain and parameters between gas and temperature data by using genetic algorithm.

The Identification of Emerging Technologies of Automotive Semiconductor

  • Daekyeong Nam;Gyunghyun Choi
    • KSII Transactions on Internet and Information Systems (TIIS)
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    • v.17 no.2
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    • pp.663-677
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    • 2023
  • As the paradigm of future vehicles changes, the interest in automotive semiconductor, which plays a key role in realizing this, is increasing. Automotive semiconductors are the technology with very high entry barriers that require a lot of effort and time because it must secure technology readiness level and also consider safety and reliability. In this technology field, it is very important to develop new businesses and create opportunities through technology trend analysis. However, systematic analysis and application of automotive semiconductor technology trends are currently lacking. In this paper, U.S. registered patent documents related to automotive semiconductor were collected and investigated based on the patent's IPC. The main technology of automotive semiconductor was analyzed through topic modeling, and the technology path such as emerging technology was investigated through cosine similarity. We identified that those emerging technologies such as driving control for vehicle and AI service appeared. We observed that as time passed, both convergence and independence of automotive semiconductor technology proceeded simultaneously.

EV Spreads and Semiconductor Convergence Study according to Price Inflection Points

  • Dae Sung Seo
    • International Journal of Internet, Broadcasting and Communication
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    • v.15 no.2
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    • pp.202-209
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    • 2023
  • This study aims to analyze the correlation between semiconductor innovation and market dominance in the mobility electric vehicle industry. To this end, the study presentsstrategiesthat provide low-price competitiveness along with high-value creation in the electric vehicle and semiconductor markets. The first change in the era of high interest rates is to overcome the crisis of survival for value. Furthermore, the study acknowledges the ongoing second wave of change as the digital technology's value continues to rise, and companies experience decreased productivity due to rising ESG labor costs. The study analyzed price competitiveness in the context of the increased adoption of electric vehicles and the integration of semiconductor prices, proving that Tesla and Samsung Semiconductor have developed technology to dominate the market, with appropriate low-cost strategies applied as the value of innovation declines.

Deep Learning-Based Defect Detection in Cu-Cu Bonding Processes

  • DaBin Na;JiMin Gu;JiMin Park;YunSeok Song;JiHun Moon;Sangyul Ha;SangJeen Hong
    • Journal of the Semiconductor & Display Technology
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    • v.23 no.2
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    • pp.135-142
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    • 2024
  • Cu-Cu bonding, one of the key technologies in advanced packaging, enhances semiconductor chip performance, miniaturization, and energy efficiency by facilitating rapid data transfer and low power consumption. However, the quality of the interface bonding can significantly impact overall bond quality, necessitating strategies to quickly detect and classify in-process defects. This study presents a methodology for detecting defects in wafer junction areas from Scanning Acoustic Microscopy images using a ResNet-50 based deep learning model. Additionally, the use of the defect map is proposed to rapidly inspect and categorize defects occurring during the Cu-Cu bonding process, thereby improving yield and productivity in semiconductor manufacturing.

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An Experimental Study on IMP-based and DOB-based Controllers for Position Control of a BLDC Motor System

  • Dong Cheol Song;Seung Tae Hwang;Nebiyeleul Daniel Amare;Young Ik Son
    • Journal of the Semiconductor & Display Technology
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    • v.23 no.2
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    • pp.92-99
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    • 2024
  • As semiconductor processes require several nanometers precision, the importance of motor control is increasing in semiconductor equipment. Due to unpredictable uncertainties such as friction and mechanical vibrations achieving precise position control in semiconductor processes is challenging. The internal model principle-based controller is a control technique that ensures robust steady-state performance by incorporating a model of the reference and disturbance. The disturbance observer-based controller is a prominent robust control technique implemented to cope with various nonlinearities and uncertainties. Provided that the two controllers can be designed to exhibit equivalent performance under certain conditions, this paper demonstrates through experiments that they yield identical results for the case of a BLDC position control problem. The experimental results also indicate that they can offer enhanced robustness compared with the conventional PID controller in the presence of a time-varying disturbance.

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Status Change Monitoring of Semiconductor Plasma Process Equipment (주파수 도메인 반사파 측정법을 이용한 플라즈마 공정장비 상태변화 연구)

  • Yunsang Lee;Sang Jeen Hong
    • Journal of the Semiconductor & Display Technology
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    • v.23 no.1
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    • pp.52-55
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    • 2024
  • In this paper, a state change study was conducted through Frequency Domain Reflectometry (FDR) technology for the process chamber of plasma equipment for semiconductor manufacturing. In the experiment, by direct connecting the network analyzer to the RF matcher input of the 300 mm plasma enhanced chemical vapor deposition (PECVD) chamber, S11 was measured in a situation where plasma was not applied, and the frequency domain reacting to the chamber state change was searched. Response factors to changes in the status, such as temperature, spacing of the heating chuck, internal pressure difference, and process gas supply state were confirmed. Through this, the frequency domain in which a change in the reflection value was detected through repeated experiments. The reliability of the measured micro-displacement was verified through reproducibility experiments.

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The Impact of US Export Controls on Korean Semiconductor Exports

  • HANHIN KIM;JAEHAN CHO
    • KDI Journal of Economic Policy
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    • v.46 no.3
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    • pp.1-23
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    • 2024
  • This study empirically investigates the impact of recent US export controls on China on South Korea's semiconductor exports. We analyze South Korean export data to shed light on the repercussions of US export restrictions on a third country. Our findings reveal a significant decline in Korean semiconductor exports following the October 2022 imposition of US controls. This decline was most pronounced in the memory, discrete devices, and discrete device components subsectors of the semiconductor industry. In addition, we observed a decrease in unit prices, especially for memory semiconductors, pointing to downward pressure on South Korea's high-value-added semiconductor exports. These results provide some evidence of substantial negative impacts of US export controls on South Korea's semiconductor industry, and particularly with regard to its high-tech products.