• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1824-1827
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• 2003

The sheet metal shearing process is normally used in the precision elements such as semi-conductor components. In precision elements, burrs usually reduce the quality of machined parts and cause interference, jamming and misalignment during assembly procedures and because of their sharpness, they can be safety hazard to personnel. Furthermore, not only burrs are hard to predict and avoid, but also deburring, the process of removing burrs, is time-consuming and costly. In order to get the burr-free parts, therefore, we developed the precise burr measuring system using the laser. The laser burr measuring system consists of the laser probe, the photo detector, the achromatic doublet lens, and the rotary ＆ the X-Y table. In previous reports, we used simple vertical measuring method. But, as we used relatively bigger laser spot diameter and had the limited reflection angle, it was difficult to obtain the precise measuring results. So called, the spot size effect makes the profile of burr measured distorted and the burr height measured smaller. By introducing the novel laser measuring method which employing the achromatic lens system and the tilting mechanism, we could make the spot size smaller and get the appropriate beam direction angle. Through the experiments, the accuracy of the developed system is proved. The burr height measured during the punching process can be used for automatic deburring and in-situ aligning.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1998.10a
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• pp.204-209
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• 1998

The acceleration of the performance of machine tools influences the development of the semi-conductor and optical technology as the development of NC and measurement technology. We can mention that a traction role of the acceleration for the development like that depends on the development of the measurement technics Stylus instrument method, STM, SEM, Laser interferometer method which are used for measuring the quasi-static error of machine tools. Because the measurement has been done to unload condition without considering of mechanical stiffness in the case of machining center as we measure the quasi-static error of machine tools on general studies, people who works on the spot has many problems on the data value. Therefor we will help working more accurately on the spot by measuring, analyzing, displaying the deflection of the table and support shaft when we load on the table and the support shaft of machining center using laser interferometer. Also we try to settle new conception of the measurement method and more accurate grasp of the deflection tendency by verifing the tendency of the error measured through the comparison of the simulated error using ANSYS, a common finite element analysis program, which is able to measure heat deformation, material deformation, and error resulted form this study.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.15 no.4
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• pp.44-48
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• 2006

Recently, demand the ultra precision product which is increasing rapidly is used extensively frontier industry field such as semi-conductor, computer, aerospace, precision machine. Ultra precision processing is the portion that is very needed to NT in the field of mechanical engineering. The latest date, together with radical advancement of electronic and photonics industry, necessity of ultra precision processing is on the increase for the manufacture of various kernel parts those are connected with these industrial fields. Specially, require motion accuracy of high resolution of nm order in stroke of hundreds millimeters according as diameter of processing object great and processing accuracy rises. In this case ,the response speed absolute delay because inertial mass of moving part is very large. Therefore, real time motion error compensation becomes very hardly. In this paper, we used ultra precision cutting unit(UPCU) to cope such problem. a UPCU is designed and tested to obtain sub-micrometer from accuracy in diamond turning of flat surfaces. The thermal growth spindle error is compensated for real time using a UPCU driven by piezoelectric actuator along with a laser encoder displacement sensor.

• 제어로봇시스템학회:학술대회논문집
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• 1992.10a
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• pp.393-400
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• 1992

The DC(Direct-Current) servo motor has widely used for many application areas, FA(Factory Automation), OA(Office Automation) and home applications. But DC servo motor needs periodical inspection because it has brush and commutator. Recently, AC servo motor has expanded it's application areas due to for the development of the power semi-conductor and control technology. But it has large torque ripple for it's small number of commutation. And it also has cogging torque due to permanent magenet rotor. Therefore it can't run balence rotarion. Many torque ripple reduction methods are published. In this paper, phase advanced method adopted for torque ripple reduction of AC servo motor. In this research, AC servo motor torque characteristic variation surveied under the phase advance control through the computer simulation. Under the simulation, the load inertia varied from 0.0001[Kg.m$^{2}$] to 0.0314[Kg.m$^{2}$]. The result os nonlinear simulation, torque and speed ripple of AC servo motor under the phase advance control reduced approximately 50[%] and 10[%]. And maximum torque of AC servo motor under phase advance control condition increased about 5[%] as compare with fixed switching time.

• Journal of the Semiconductor & Display Technology
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• v.8 no.4
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• pp.53-58
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• 2009

A SMT mounter is a kind of equipment that mounts SMD parts quickly on the printed circuit board. By using linear motors, it is controlled with high speed and precision, which is similar to semi-conductor and display process equipment. It is necessarily used in an assembly process of an electronic device. Mobile devices such as a mobile phone and PDA are required to reduce mount areas due to the demands for high performance and small size. Hence, super small sized and complex mobile devices have been developed. To improve the productivity of the corresponding equipment, designs with large sized, high speed, and multidisciplinary functions have been consistently performed. Meanwhile, a design trend of large size and light-weight on SMT mounter causes a low natural frequency of systems and vibration problems at the high speed operation. In this paper, the dynamic characteristics of the SMD mounter system were investigated through a modal test and transmissibility test, and verified by finite element method. Also, various design improvement was performed to avoid the resonance phenomena.

• Proceedings of the Optical Society of Korea Conference
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• 2000.02a
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• pp.276.2-278
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• 2000

In a recent years, a number of approaches have been studied, including passive, active, and hybrid mode-locking of semi-conductor lasers for short pulse generation and research has been devoted to achieve low timing-jitter operation since the timing jitter is unfavorable for system applications. Among the methods of mode locking, passive mode locking does not need external rf drives, and therefore the operation and fabrication procedures are simplified. In spite of these attractive advantages of passive mode-locked laser, it has critical drawbacks such as large timing jitter and the difficulty in synchronization with external circuits. Their inherent large timing jitter value was shown to be suppressed to certain levels by means of hybrid mode-locking technique$^{(1)}$ , where the saturable absorber section was modulated by an external signal with the cavity round trip frequency. Furthermore, the subharmonic mode-locking (SHML) technique alleviates the restrictions of high speed driving electronics. It has been demonstrated experimentally$^{(1)}$ that the hybrid subharmonic mode-locking technique has lead to significant reduction of the timing jitter. (omitted)

• Journal of the Korean Society for Precision Engineering
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• v.13 no.11
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• pp.38-45
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• 1996

In recent years, ultrasonic has been widely applied in measurement and industrial fields and its application range has been expanded as a result of continuous research and development. Wire Bonding Machine, an instrument fabricating semi-conductor, makes use of ultrasonic bonding method. Specially, the method utilizes the longitudinal vibration of ultrasonic transducer composed of piezoelectric vibrator and horn. This work investigates the design conditions affecting the dynamic characteristics through the theretical and experimental analysis. It conducts separately the system identification of piezoelectric vibrator in time domain and the modal analysis of horn in frequency domain. The integrated modeling is conducted via a combbination of dynamic identification of piezoelectric vibrator and theroretical analysis of horn. Then comparison is made for theroretical and experimental results of the dynamic characteristics of the ultrasonic transducer comprised of piezoelectric vibrator and horn. Form the results of the comparison we develop the design technique of ultrasonic transducer using dynamic characteristics analysis and propose the possibility of ultrasonic bonding considering the optimal conditions for the longitudinal vibration of ultrasonic transducer and other conditions.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.32A no.12
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• pp.184-197
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• 1995

In this paper, high speed IC package-to-package interconnections are modeled as lossless multiconductor transmission lines operating in the TEM mode. And, three mathematical algorithms for computing electrical parameters of the lossless multiconductor transmission lines are described. A semi-analytic Green's function method is used in computing per unit length capacitance and inductance matrices, a matrix square root algorithm based on the QR algorithm is used in computing a characteristic impedance matrix, and a matrix algorithm based on the theory of M-matrix is used in computing a diagonally matched load impedance matrix. These algorithms are implemented in a computer program DIME (DIagonally Matched Load Impedance Extractor) which computes electrical parameters of the lossless multiconductor transmission lines. Also, to illustrate the concept of design database for high speed IC package-to-package interconnection, a database for the multi conductor strip transmission lines system is constructed. This database is constructed with a sufficiently small number of nodes using the multi-dimensional cubic spline interpolation algorithm. The maximum interpolation error for diagonally matched load impedance matrix extraction from the database is 1.3 %.

• Journal of Environmental Science International
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• v.14 no.3
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• pp.335-343
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• 2005

The objective of this research is to evaluate a feasibility of wastewater reuse by membrane treatment with vibrating membrane separation equipment. Molecular weight of compounds in wastewater, permeability of membrane and retentate characterization after membrane filtration were investigated in order to determine appropriate membrane pore size and materials for wastewater treatment. Selected membrane was evaluated with vibration membrane separation equipment to optimize operating conditions. The following conclusion are drawn. 1. We got as following test results after the distribution of particles in the semiconductor wastewater, are made up of $1\~20{\mu}m$. Si, gold and Al in turn are contained in semiconductor wastewater. 2. Recovery rate is changeless under increasing recovery rate in operation. Though a value can be if pressure can be changed, the highest value of permeate rate is presented in 150 psi. 3. The AS-100(polysulpone) was selected as the most appropriate membranes for the treatment of semi-conductor wastewater to VSEP system. The fouling almost did not occur during this experiments. The analyses of treated water with VSEP system showed conductivity: 0.059,us/cm, TDS: 40mg/l, COD: 20mg/l, SS : 5mg/l, n-Hexane: 8.3mg/l. Comparing previous systems, operating expenses is decreased by more $50\%$.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.8 no.6
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• pp.55-63
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• 1999

The acceleration of the performance of machine tools influences the development of the semi-conductor and optical technology as the development of NC and measurement technology. Because the measurement has been done to unload condition without considering of mechanical stiffness in the case of machining center as we measure the quasi-static error of machine tools on general study people who works on the spot has many problems on the data value. Also there are no satisfiable results until now in spite of many studys about this because the deflections of the table and the shaft supporting a workpiece influence, influence the accuracy of the table and shaft supporting a workpiece influence the accuracy of the workpiece. And there is doubt about the inspection method of measured error. In this paper Therefor we will help working more accurately on the spot by measuring analyzing displaying the defoec-tion of the table and support shaft when we load on the table and the support shaft of machining center using laser interfer-ometer. Also we try to settle new conception of the measurement method and more accurate grasp of the deflection tenden-cy by verifing the tendency of the error measured through the comparison of the simulated error measured through the comparison of the simulated error using ANSYS a common finite element analysis program which is able to measure heat deformation material deformation and error resulted from this study.