• Elastomers and Composites
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• v.53 no.3
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• pp.175-180
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• 2018

Solution-styrene-butadiene rubber (SSBR) composites were manufactured using four kinds of fillers: silica-silane coated carbon black (SC-CB) hybrid, starch-SC-CB hybrid, pure silica, and pure starch. The influence of filler type on the mechanical properties of the rubber matrix was studied in this work. SC-CB was prepared by silane-graft-coating using vinyl triethoxy silane and carbon black, which enhanced the dispersion effect between the rubber matrix and the filler, and improved the mechanical properties of the compounds. The morphology of the composites was observed by field-emission scanning electron microscopy (FE-SEM). The thermal decomposition behavior of the composites was determined by thermogravimetric analysis (TGA), and the crosslinking behavior of the composites was tested using a rubber process analyzer (RPA). The hardness, tensile strength, swelling ratio, and gas transmittance rate of the composites were evaluated according to ASTM. The test results revealed that with the addition of SC-CB, the hybrid fillers, especially those blended with silica, showed a better reinforcement effect, the highest hardness and tensile strength, and stable thermal decomposition behavior. This implies that the silica-SC-CB hybrid filler has a notable mechanical reinforcement effect on the SSBR matrix. Because of self-crosslinking during its synthesis, the starch-SC-CB hybrid filler produced the most dense matrix, which improved the anti-gas transmittance property. The composites with the hybrid fillers had better anti-swelling properties as compared to the neat SSBR composite, which was due to the hydrophilicity of silica and starch.

• Journal of the Semiconductor & Display Technology
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• v.21 no.1
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• pp.148-154
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• 2022

As the 4th industrial age approaches, the demand for semiconductors is increasing enough to be used in all electronic devices. At the same time, semiconductor technology is also developing day by day, leading to ultraprecision and low power consumption. Semiconductors that keep getting smaller generate heat because the energy density increases, and the generated heat changes the shape of the semiconductor package, so it is important to manage. The temperature change is not only self-heating of the semiconductor package, but also heat generated by external damage. If the package is deformed, it is necessary to manage it because functional problems and performance degradation such as damage occur. The package burn in test in the post-process of semiconductor production is a process that tests the durability and function of the package in a high-temperature environment, and heat dissipation performance can be evaluated. In this paper, we intend to review a new material formulation that can improve the performance of the adapter, which is one of the parts of the test socket used in the burn-in test. It was confirmed what characteristics the basic base showed when polyamide, a high-molecular material, and alumina, which had high thermal conductivity, were mixed for each magnification. In this study, functional evaluation was also carried out by injecting an adapter, a part of the test socket, at the same time as the specimen was manufactured. Verification of stiffness such as tensile strength and flexural strength by mixing ratio, performance evaluation such as thermal conductivity, and manufacturing of a dummy device also confirmed warpage. As a result, it was confirmed that the thermal stability was excellent. Through this study, it is thought that it can be used as basic data for the development of materials for burn-in sockets in the future.

• Journal of the Korean Society for Nondestructive Testing
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• v.29 no.4
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• pp.323-330
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• 2009

The objective of this research was to develop a practical integrated approach using extracted features from electrical resistance measurements and coupled electromechanical models of damage, for in-situ damage detection and sensing in carbon fiber reinforced plastic(CFRP) composites. To achieve this objective, we introduced specific known damage (in terms of type, size, and location) into CFRP laminates and established quantitative relationships with the electrical resistance measurements. For processing of numerous measurement data, an autonomous data acquisition system was devised. We also established a specimen preparation procedure and a method for electrode setup. Coupon and panel CFRP laminate specimens with several known damage were tested. Coupon specimens with various sizes of artificial delaminations obtained by inserting Teflon film were manufactured and the resistance was measured. The measurement results showed that increase of delamination size led to increase of resistance implying that it is possible to sense the existence and size of delamination. A quasi-isotropic panel was manufactured and electrical resistance was measured. Then three different sizes of holes were drilled at a chosen location. The panel was prepared using the established procedures with six electrode connections on each side making a total of twenty-four electrodes. Vertical, horizontal, and diagonal pairs of electrodes were chosen and the resistance was measured. The measurement results showed the possibility of the established measurement system for an in-situ damage detection method for CFRP composite structures.