• Title/Summary/Keyword: Self-etching system

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A COMPARATIVE STUDY OF SHEAR BOND STRENGTH OF FLOWABLE RESIN ASSOCIATED WITH DENTIN ADHESIVE SYSTEMS WITH THERMOCYCLING EFFECT (상아질접착제와 열순환에 따른 유동성 레진의 전단결합강도 비교 연구)

  • Nam Ki-Young
    • The Journal of Korean Academy of Prosthodontics
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    • v.44 no.4
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    • pp.383-393
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    • 2006
  • Statement of problem : Limited research on flowable resin has been undertaken on its application directly on dentin associated with the adhesive systems. Purpose : This study was to evaluate the shear bond strengh and fracture aspect of flowable resin on human dentin with various types of dentin bonding adhesives with thermo cycling effect. Materials and methods: Filtek-Flow(3M ESPE, USA) was used as flowable resin and Eighty human molars were randomly divided into 4 groups : three dentin bonding adhesives (Scotchbond-Multipurpose : 3-step contentional system, One-Step : One-bottle system. Prompt L-Pop : All-in-one, self-etching primer) and 32% etching treatment without bonding adhesive as a control group. For evaluating their durability of bonding, each group was subdivided : storaging in the water at 37$^{\circ}C$(24 hours) and thermocycling (0$^{\circ}C$-55$^{\circ}C$, 30 seconds intervals, 1000 cycle). Shear bond strength tests were performed and resin-dentin interface and fracture mode were observed. Results were analysed by one-way ANOVA and Scheffe's multiple range test. Results and Conclusion : 1. At 0 cycle, the mean shear bond strength of One-Step exhibited the highest value of all groups(p<0.05), and there were no significant differences between Prompt L-Pop and Scotchbond-Multipurpose, Scotchbond-Multipurpose and control(p>0.05). After 1000 thermocycling, One-Step exhibited higher value than other groups(p<0.05), and there were no significant differences among other groups (p>0.05). 2. The shear bond strength of each group was significantly decreased after thermocycling except Scotchbond-Multipurpose (p>0.05). 3. The most common failure mode was adhesive type and mixed type, next in order.

EFFECT OF DENTINAL TUBULES ORIENTATION ON PENETRATION PATTERN OF DENTIN ADHESIVES USING CONFOCAL LASER SCANNING MICROSCOPY (상아세관의 주행방향에 따른 상아질 접착제의 침투양상에 대한 공초점레이저주사현미경 연구)

  • Kim, Dong-Jun;Hwang, Yun-Chan;Kim, Sun-Ho;Oh, Won-Mann;Hwang, In-Nam
    • Restorative Dentistry and Endodontics
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    • v.28 no.5
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    • pp.392-401
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    • 2003
  • The purpose of this study was to evaluate the penetration pattern of dentin adhesives according to the orientation of dentinal tubules with confocal laser scanning microscopy. Specimens having perpendicular. parallel and oblique surface to dentinal tubules were fabricated. The primer of dentin adhesives (ALL $BOND^{\circledR}{\;}2,{\;}CLEARFIL^{TM}$ SE BOND and PQ1) was mixed with fluorescent material. rhodamine B isothio-cyanate (Aldrich Cherm. CO., Milw., USA), It was applied to the specimens according to the instructions of manufactures. The specimens were covered with composite resin (Estelite, shade A2) and then cut to a thickness of 500$\mu\textrm{m}$ with low speed saw (Isomet^{TM}, Buehler. USA). The adhesive pattern of dentin adhesives were observed by fluorescence image using confocal laser scanning microscopy. The results were as follows. 1. For the groups with tubules perpendicular to bonded surface. funnel shape of resin tag was observed in all specimen. However. resin tags were more prominent in phosphoric acid etching system (ALL $BOND^{\circledR}$ 2 and PQ1) than self etching system ($CLEARFIL^{TM}$ SE BOND). 2. For the groups with tubules parallel to bonded surface. rhodamine-labeled primer penetrated into peritubular dentin parallel to the orientation of dentinal tubules. But rhodamine-labeled primer of PQ1 diffused more radially into surrounding intertubular dentin than other dentin adhesive systems. 3. For the groups with tubules oblique to bonded surface. resin tags appeared irregular and discontinuous. But they penetrated deeper into dentinal tubules than other groups.

Comparison of shear bond strength of different bonding systems on bleached enamel (수종의 치질 접착제의 미백 처리된 법랑질에 대한 전단접착강도 비교)

  • Kim, Kwang-Keun;Park, Jeong-Won
    • Restorative Dentistry and Endodontics
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    • v.29 no.1
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    • pp.30-35
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    • 2004
  • 치아 미백술은 치아의 심미성을 향상시키는 가장 보존적인 방법의 하나로 인식되어져 왔으며 최근의 심미치과에 대한 관심의 증가와 함께 그 빈도가 급격히 증가하고 있는 술식의 하나이다. 일반적으로 치아 미백술 후 바로 접착수복을 할 경우 결합력이 감소하는 것으로 알려져 있으며 이를 해소하기 위해 일정시간 경과 후 접착수복 술식을 시행할 것을 권장 하고 있다. 자가산부식형 (self-etching primer system) 접착제는 기존의 접착제와 다른 성분으로 인해 치아미백제에 의한 영향에 대해 잘 알려져 있지 않은 상태이다. 이에 본 실험에서는 미백술을 시행한 법랑질 상에서 서로 다른 세 가지의 접착 시스템을 이용하여 미백술 후의 지연 시간이 결합력에 미치는 영향을 비교하고자 하였다. 발거한 대구치 68개를 물기가 있는 상태에서 근원심으로 절단하고 치관부를 자가중합 레진에 식립하여 시편을 제작하였다. 세 가지 접착제로 $One-step^{\circledR}$, Clearfil SE Bond $primer^{\circledR}$, One-up Bond $F^{\circledR}$를 이용하였다. 각 접착제를 미백을 시행하지 않는 대조군과 미백 시행 후 바로 접착한 즉시 접착군, 그리고 2주간 생리식염수에 보관한 후에 접착한 지연군으로 나누어 총 9개의 실험군으로 나누었다. 접착제를 처리한 면에 Clearfil $AP-X^{\circledR}$ 복합레진을 2mm충전하고, 40초간 광중합을 시행하였다. 24시간 후 전단접착강도를 측정하였으며, 그 결과는 다음과 같이 나타났다. $One-step^{\circledR}$의 경우, 즉시 접착군에서 지연 접착군보다 유의성 있게 낮은 접착강도를 나타내었다. Clearfil SE $Bond^{\circledR}$의 경우, 즉시 접착군과 미백을 시행하지 않은 군간에는 접착 강도에 유의한 차가 없었으나,지연접착군에서는 낮은 강도를 나타내었다. One-Up Bond F$^{\circledR}$의 경우, 즉시 접착군에서 유의성 있게 낮은 전단접착강도를 나타내었고, 전반적인 접착 강도가 다른 두 접착제에 비해서 유의성 있게 낮은 값을 보였다. $One-step^{\circledR}$을 사용할 경우 지연접착을 하는 것이 추천되며, Clearfil SE Bond$^{\circledR}$의 경우에는 즉시 접착을 시행하더라도 영향을 적게 받는 것으로 나타났으며, One-Up Bond $F^{\circledR}$의 경우 미백술 후 접착수복 과정에 사용에 제한이 있는 것으로 나타났다.

Modeling of Two-dimensional Self-consistent RF Plasmas on Discharge Chamber Structures (전극 구조에 관한 2차원 RF 플라즈마의 모델링)

  • So, Soon-Youl;Lim, Jang-Seob;Kim, Chel-Woon
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.19 no.4
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    • pp.1-8
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    • 2005
  • Plasma researches using parallel-plate electrodes are widely used in semiconductor application such as etching and thin film deposition. Therefore, a quantitative understanding and control of plasma behavior are becoming increasingly necessary because their important applications and simulation techniques have been actively carried out in order to solve such problems above. In this paper, we developed a two-dimensional(2D) self-consistent fluid model, because 2D models can deal with real reactor geometries. The fluid model is based on particle continuity equations for taking account of an electrode system in a cylindrical geometry. An pure Ar gas was used at 500[mTorr] and radio-frequency (13.56(MHz)). Four models were simulated under the different electrode geometries which have chamber widths of 5.25, 6.0, 8.0, and 10.0[cm] and we compared their results with each other. Plasma uniformity and a do self-bias voltage were also discussed.

Micro-tensile Bond Strength of Composite Resin Bonded to Er:YAG Laser-prepared Dentin (Er:YAG 레이저로 삭제된 상아질에 대한 컴포지트 레진의 미세인장결합강도에 관한 연구)

  • Min, Suk-Jin;Ahn, Yong-Woo;Ko, Myung-Yun;Park, June-Sang
    • Journal of Oral Medicine and Pain
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    • v.31 no.3
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    • pp.211-221
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    • 2006
  • Purpose The aims of this study were to evaluate micro-tensile bond strength of composite resin bonded to dentin following high-speed rotary handpiece preparation or Er:YAG laser preparation with two different adhesive systems and to assess the influence of different Er:YAG laser energies on the micro-tensile bond strength. Materials and Methods In this study, 40 third morlars were used. Flat dentin specimans were obtained and randomly assigned to eight groups. Dentin surfaces were prepared with one of four cutting types: carbide bur, Er:YAG laser (2 W, 3 W and 4 W) and conditioned with two bonding systems, Scotchbond Multipurpose Plus (SM), Clearfil SE bond (SE) and composite resin-build ups were created. After storage for 24 hours, each specimen was serially sectioned perpendicular to the bonded surface to produce more than thirty slabs in each group. Micro-tensile bond strength test was performed at a crosshead speed of 1.0 mm/min. Micro-tensile bond strengths (${\mu}TBS$) were expressed as means$\pm$SD. Data were submitted to statistical analysis using two-way ANOVA, one-way ANOVA, Student-Newman-Keuls' multiple comparison test and t-test. Results and Conclusion 1. Regardless of bonding systems, the ${\mu}TBS$ according to cutting types were from highest to lowest : 3 W, 2 W, Bur, and 4 W. In addition, there was no significant difference between Bur and 4 W (p<0.001). 2. Regardless of cutting types, SM showed significantly higher ${\mu}TBS$ than SE (p<0.001). 3. Bonding to dentin conditioned with SM resulted in higher ${\mu}TBS$ for 3 W compared to Bur, 2 W, and 4 W. There was no significant difference between 2 W and Bur (p<0.001). 4. Bonding to dentin conditioned with SE resulted in higher ${\mu}TBS$ for 3 W compared to 2 W, 4 W, and Bur. Bur exhibited significant lower ${\mu}TBS$ than all other cutting types. There were no significant differences between 3 W, 2 W and between 4 W and Bur (p<0.001). 5. The ${\mu}TBS$ of laser cutting groups were shown in order from highest to lowest: 3 W, 2 W and 4 W in two bonding systems. There was no significant difference between 2 W and 3 W in SE (p<0.001). : The ${\mu}TBS$ of composite resin bonded dentin was significantly affected by interaction between the cutting type and bonding system. In the range of 2 W-3 W, cavity preparation of the Er:YAG laser seems to supply good adhesion of composite resin restoration no less than bur preparation. In particular, if you want to use the self-etching system, including Clearfil SE bond for the purpose of a simplification of the bonding procedures and prevention of adverse effects by excessive etching, an Er:YAG laser may offer better adhesion than a bur.

Development of High-Quality LTCC Solenoid Inductor using Solder ball and Air Cavity for 3-D SiP

  • Bae, Hyun-Cheol;Choi, Kwang-Seong;Eom, Yong-Sung;Kim, Sung-Chan;Lee, Jong-Hyun;Moon, Jong-Tae
    • Journal of the Microelectronics and Packaging Society
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    • v.16 no.4
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    • pp.5-8
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    • 2009
  • In this paper, a high-quality low-temperature co-fired ceramic (LTCC) solenoid inductor using a solder ball and an air cavity on a silicon wafer for three-dimensional (3-D) system-in-package (SiP) is proposed. The LTCC multi-layer solenoid inductor is attached using Ag paste and solder ball on a silicon wafer with the air cavity structure. The air cavity is formed on a silicon wafer through an anisotropic wet-etching technology and is able to isolate the LTCC dielectric loss which is equivalent to a low k material effect. The electrical coupling between the metal layer and the LTCC dielectric layer is decreased by adopting the air cavity. The LTCC solenoid inductor using the solder ball and the air cavity on silicon wafer has an improved Q factor and self-resonant frequency (SRF) by reducing the LTCC dielectric resistance and parasitic capacitance. Also, 3-D device stacking technologies provide an effective path to the miniaturization of electronic systems.

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Deposition of aluminum nitride nanopowders and fabrication of superhydrophobic surfaces (질화알루미늄 나노분말의 부착과 이를 활용한 초소수성 표면 제작)

  • Kwangseok Lee;Heon-Ju Choi;Handong Cho
    • Journal of the Korean institute of surface engineering
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    • v.57 no.1
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    • pp.49-56
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    • 2024
  • Superhydrophobic surfaces have been expected to be able to provide considerable performance improvements and introduce innovative functions across diverse industries. However, representative methods for fabricating superhydrophobic surfaces include etching the substrate or attaching nanosized particles, but they have been limited by problems such as applicability to only a few materials or low adhesion between particles and substrates, resulting in a short lifetime of superhydrophobic properties. In this work, we report a novel coating technique that can achieve superhydrophobicity by electrophoretic deposition of aluminum nitride (AlN) nanopowders and their self-bonding to form a surface structure without the use of binder resins through a hydrolysis reaction. Furthermore, by using a water-soluble adhesive as a temporary shield for the electrophoretic deposited AlN powders, hierarchical aluminum hydroxide structures can be strongly adhered to a variety of electrically conductive substrates. This binder-free technique for creating hierarchical structures that exhibit strong adhesion to a variety of substrates significantly expands the practical applicability of superhydrophobic surfaces.

Magnetoresistance of Bi Nanowires Grown by On-Film Formation of Nanowires for In-situ Self-assembled Interconnection

  • Ham, Jin-Hee;Kang, Joo-Hoon;Noh, Jin-Seo;Lee, Woo-Young
    • Proceedings of the Korean Magnestics Society Conference
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    • 2010.06a
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    • pp.79-79
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    • 2010
  • Semimetallic bismuth (Bi) has been extensively investigated over the last decade since it exhibits very intriguing transport properties due to their highly anisotropic Fermi surface, low carrier concentration, long carrier mean free path l, and small effective carrier mass $m^*$. In particular, the great interest in Bi nanowires lies in the development of nanowire fabrication methods and the opportunity for exploring novel low-dimensional phenomena as well as practical application such as thermoelectricity[1]. In this work, we introduce a self-assembled interconnection of nanostructures produced by an on-film formation of nanowires (OFF-ON) method in order to form a highly ohmic Bi nanobridge. A Bi thin film was first deposited on a thermally oxidized Si (100) substrate at a rate of $40\;{\AA}/s$ by radio frequency (RF) sputtering at 300 K. The sputter system was kept in an ultra high vacuum (UHV) of $10^{-6}$ Torr before deposition, and sputtering was performed under an Ar gas pressure of 2m Torr for 180s. For the lateral growth of Bi nanowires, we sputtered a thin Cr (or $SiO_2$) layer on top of the Bi film. The Bi thin films were subsequently put into a custom-made vacuum furnace for thermal annealing to grow Bi nanowires by the OFF-ON method. After thermal annealing, the Bi nanowires cannot be pushed out from the topside of the Bi films due to the Cr (or $SiO_2$) layer. Instead, Bi nanowires grow laterally as a mean s of releasing the compressive stress. We fabricated a self-assembled Bi nanobridge (d=192 nm) device in-situ using OFF-ON through annealing at $250^{\circ}C$ for 10hours. From I-V measurements taken on the Bi nanobridge device, contacts to the nanobridge were found highly ohmic. The quality of the Bi nanobridge was also proved by the high MR of 123% obtained from transverse MR measurements. These results manifest the possibility of self-assembled nanowire interconnection between various nanostructures for a variety of applications and provide a simple device fabrication method to investigate transport properties on nanowires without complex patterning and etching processes.

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Development of Pressure Sensor on Polymer Substrate for Real-time Pulse and Blood Pressure Measurements (실시간 맥박 및 혈압 측정을 위한 폴리머 기판 압력센서 개발)

  • Kim, Jin-Tae;Kim, Sung Il;Joung, Yeun-Ho
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.26 no.9
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    • pp.669-676
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    • 2013
  • In this study, we introduce a polymer(polyimide) based pressure sensor to measure real-time heart beat and blood pressure. The sensor have been designed with consideration of skin compatibility of material, cost effectiveness, manufacturability and wireless detection. The designed sensor was composed of inductor coils and an air-gap capacitor which generate self-resonant frequency when electrical source is applied on the system. The sensor was obtained with metalization, etching, photolithography, polymer adhesive bonding and laser cutting. The fabricated sensor was shaped in circular type with 10mm diameter and 0.45 mm thickness to fit radial artery. Resonant frequencies of the fabricated sensors were in the range of 91~96 MHz on 760 mmHg pressurized environment. Also the sensor has good linearity without any pressure-frequency hysteresis. Sensitivity of the sensor was 145.5 kHz/mmHg and accuracy was less than 2 mmHg. Real-time heart beat measurement was executed with a developed hand-held measurement system. Possibility of real-time blood pressure measurement was showed with simulated artery system. After installation of the sensor on skin above radial artery, simple real blood pressure measurement was performed with 64 mmHg blood pressure variation.

A STUDY OF SHEAR BOND STRENGTH OF ER:YAG LASER-IRRADIATED PRIMARY DENTIN (Er:YAG 레이저를 조사한 유치 상아질의 전단결합강도에 관한 연구)

  • Lee, Jin-Hwa;Kim, Jong-Soo;Yoo, Seung-Hoon
    • Journal of the korean academy of Pediatric Dentistry
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    • v.34 no.4
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    • pp.569-578
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    • 2007
  • This study was performed to compare the shear bond strength of self etching system and two bottle bonding system with or without laser preparation. Group I was prepared with high speed rotary instrument and $Prompt^{TM}$ L-$Pop^{TM}$, group II with Er:YAG laser and $Prompt^{TM}$ L-$Pop^{TM}$, group III with Er:YAG laser, 37% phosphoric acid and Single bond, group IV with Er:YAG laser and Single bond and group V with high speed, etching and Single bond. And also observation of the prepared and etched dentin surface were performed under scanning electro-microscope. The possibility of clinical application of laser preparation which might have an advantage to reduce pain for children with less unfavorable noise were evaluated. The results obtained are as follows; 1. Group V showed significantly higher bond strength than other groups. And group IV showed significantly lower bond strength than other groups. 2. There was no significant difference between group I and group III. 3. Group II showed significantly lower bond strength than group I, III, V, but showed significantly higher bond strength than group IV. 4. Under scanning electro-microscope, laser-preparated dentin surface showed high irregularity and no smear layer. The surface showed less irregularities and more exposed dentinal tubules with etching. Laser preparation has many advantages over conventional tooth preparation. But this method showed lower resin bonding strength. Laser preparated tooth surface differed from the conventionally preparated tooth surface. More researches are needed on suitable methods for laser preparated dentin surface.

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