• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1296-1301
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• 2003

The chemical mechanical polishing(CMP) is necessarily applied to manufacturing the dielectric layer and metal line in the semiconductor device. The conditioning of polishing pad in CMP process additionally operates for maintaining the removal rate, within wafer non-uniformity, and wafer to wafer non-uniformity. But the fixed abrasive pad(FAP) using the hydrophilic polymer with abrasive that has the swelling characteristic by water owns the self-conditioning advantage as compared with the general CMP. FAP also takes advantage of planarity, resulting from decreasing pattern selectivity and defects such as dishing due to the reduction of abrasive concentration. This paper introduces the manufacturing technique of FAP. And the tungsten CMP using FAP achieved the good conclusion in point of the removal rate, non-uniformity, surface roughness, material selectivity, micro-scratch free contemporary with the pad life-time.

• The Magazine of the Society of Air-Conditioning and Refrigerating Engineers of Korea
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• v.32 no.5
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• pp.22-26
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• 2003

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.4
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• pp.321-326
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• 2005

Chemical mechanical polishing(CMP) process is essential technology to be applied to manufacturing the dielectric layer and metal line in semiconductor devices. It has been known that overpolishing in CMP depends on pattern selectivity as a function of density and pitch, and use of fixed abrasive pad(FAP) is one method which can improve the pattern selectivity. Thus, dishing & erosion defects can be reduced. This paper introduces the manufacturing technique of FAP using hydrophilic polymers with swelling characteristic in water and explains the self-conditioning phenomenon. When applied to tungsten blanket wafers, the FAP resulted in appropriate performance in point of uniformity, material selectivity and roughness. Especially, reduced dishing and erosion was observed in CMP of tungsten pattern wafer with the proposed FAP.

• Journal of the Chungcheong Mathematical Society
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• v.9 no.1
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• pp.123-128
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• 1996

This paper is to study the regular $^*$ semigroup, to define the self-involutive semi-group, to introduce the properties of the self-involutive semigroup, and to generalize the maximum idempotent-separating congruence which was found by conditioning self-involutive semigroups.

• Journal of Korean Academy of Nursing
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• v.35 no.7
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• pp.1410-1419
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• 2005

Purpose: This study identified and compared influential variables on intention and action to quit smoking between adolescent smokers and adult smokers. Methods: For the selection of variables, the transtheoretical theory was used. A survey was conducted with 376 adolescent smokers in 4 high schools and 451 adult smokers in community settings in South Korea. Discriminant analysis was used for data analysis Results: The variables of adolescent smokers that predicted an intention to quit smoking were: smoking temptation, self re-evaluation, counter conditioning and stimulus control. The variables that predicted an action to quit smoking were: self-efficacy for smoking abstinence, pros for smoking, self reevaluation, and self liberation. The variables of adult smokers that predicted an intention to quit were: smoking temptation, pros for smoking, cons for smoking, self reevaluation. The variables that self liberation and predicted an action to quit smoking were: self efficacy for smoking abstinence, smoking temptation, and counter conditioning. Conclusions: Developing stage specific smoking intervention methods based on different ways of how individuals make a decision to quit smoking within their contexts needs to be done.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.12 no.9
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• pp.853-859
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• 2000

In this study, low temperature waste heat recovery heat exchanger was developed using a principle of self-excited oscillating heat pipe. The heat exchanger of serpentine type was composed of extruded flat aluminum tube with 6 channels (3 nm$\times$ 2.75nm) and louvered fin. The heat transfer area density of heat exchanger was $331.9 m^2/m^3$. Working fluid is R141b and charge ratio was 40% by volume. Heat transfer rate and the effectiveness of heat exchanger was primary concern of this study. As a result, the effectiveness of heat exchanger was about 0.4-0.67, and recovered waste heat rate was about 4.5 kW per one unit of heat exchanger.

• 한국태양에너지학회:학술대회논문집
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• 2009.11a
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• pp.409-414
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• 2009

Since cryogens are stored at very low temperatures, the cryogenic storage systems are quite sensitive to heat leaks. Even though the vessel operated under sealed condition with vacuum insulation and reflective coatings are used, the heat leakage into the vessel is still unavoidable. Therefore, this paper concerns with numerical study of self-pressurization used to analysis the optimum design with the variation volume fraction, effect of heat flux and storage pressure of liquid nitrogen. The result shows that as the volume fraction increases, the pressure rise reduces and the relatively at atmosphere pressure is better than the higher one. In addition, higher heat flux leads the pressure rise increases faster than low one. The additional of heat pipe system to reduce the pressure rise rate also has been done. By this comparison, the optimum design for storage umbilical cord blood can be selected.

• Journal of the Korea Institute of Military Science and Technology
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• v.14 no.4
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• pp.615-621
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• 2011

In this paper, the proper quantity of conditioning rounds has been studied using the statistical analysis on the basis of the acceptance test data of K676 and K677 propelling charge for K9 self propelled howitzer. In general, the muzzle velocity of the initial rounds tends to be a little lower than that of the succeeding rounds. The latter rounds are likely to have the constant velocities after firing the appropriate conditioning rounds. The main cause of velocity difference was proved to be the proper quantity of conditioning rounds by doing the correlation analysis among the initial tube temperature, the tube life and the quantity of conditioning rounds. The result of paired t-test shows that two rounds of conditioning projectiles are proved to be enough to maintain the constant velocity in the case of the acceptance test of K676 and K677 propelling charge.

• The korean journal of orthodontics
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• v.42 no.1
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• pp.32-38
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• 2012

Objective: The aim of this study was to compare the effects of different enamel conditioning techniques for bracket bonding. Methods: Ninety-one human premolars were randomly divided in six groups of 15 specimens each. The enamel surfaces of the teeth were etched with 35% orthophosphoric acid in Group 1, with a self-etching primer in Group 2, sandblasted in Group 3, sandblasted and etched with 35% orthophosphoric acid in Group 4, conditioned by Er:YAG laser in Group 5 and conditioned by Er:YAG laser and etched with 35% phosphoric acid gel respectively in Group 6. After enamel conditioning procedures, brackets were bonded and shear bonding test was performed. After debonding, adhesive remnant index scores were calculated for all groups. One tooth from each group were inspected by scanning electron microscope for evaluating the enamel surface characteristics. Results: The laser and acid etched group showed the highest mean shear bond strength (SBS) value ($13.61{\pm}1.14$ MPa) while sandblasted group yielded the lowest value ($3.12{\pm}0.61$ MPa). Conclusions: Although the SBS values were higher, the teeth in laser conditioned groups were highly damaged. Therefore, acid etching and self-etching techniques were found to be safer for orthodontic bracket bonding. Sandblasting method was found to generate inadequate bonding strength.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.7
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• pp.22-29
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• 2004

As a result of high integration of semiconductor device, the global planarization of multi-layer structures is necessary. So the chemical mechanical polishing(CMP) is widely applied to manufacturing the dielectric layer and metal line in the semiconductor device. CMP process is under influence of polisher, pad, slurry, and process itself, etc. In comparison with the general CMP which uses the slurry including abrasives, fixed abrasive pad takes advantage of planarity, resulting from decreasing pattern selectivity and defects such as dishing & erosion due to the reduction of abrasive concentration especially. This paper introduces the manufacturing technique of fixed abrasive pad using hydrophilic polymers with swelling characteristic in water and explains the self-conditioning phenomenon. And the tungsten CMP using fixed abrasive pad achieved the good conclusion in terms of the removal rate, non-uniformity, surface roughness, material selectivity, micro-scratch free contemporary with the pad life-time.