• 제목/요약/키워드: Self diffusion

검색결과 386건 처리시간 0.024초

Thermal and Photochemistry of Methyl Iodide on Ice Film Grown on Cu(111)

  • Sohn, Young-Ku;White, John M.
    • Bulletin of the Korean Chemical Society
    • /
    • 제30권7호
    • /
    • pp.1470-1474
    • /
    • 2009
  • Thermal and photochemistry of methyl iodide ($CH_3I)\;adsorbed\;on\;D_2O$ ice film on Cu(111) at 100 K were studied using temperature-programmed desorption (TPD) time-of-flight mass spectrometry (TOF-MS), X-ray and ultraviolet photoelectron spectroscopies. On the basis of TPD, multilayer and monolayer $CH_3I$ molecules desorb from $D_2O$ ice layer at 120 and 130 K, respectively. Photo-irradiation at 100 K exhibits dramatic changes in the TPD and I $3d_{5/2}\;XPS\;of\;CH_3I$ on ice film, due to a dramatic dissociation of $CH_3I$. The dissociation is likely activated by solvated electrons transferred from the metal substrate during photo-irradiation. No other photo-initiated reaction products were found within our instrumental detection limit. During photo-irradiation, the $CH_3I$, $CH_3$ and I could be trapped (or solvated) in ice film by rearrangement (and self-diffusion) of water molecules. A newly appeared parent molecular desorption peak at 145 K is attributed to trapped $CH_3I$. In addition, the $CH_3$ and I may diffuse through ice and chemisorb on Cu(111), indicated by TPD and I $d_{5/2}$ XPS taken with photo-irradiation time, respectively. No molecular ejection was found during photo-irradiation at 100 K. The work functions for $CH_3I/Cu(111),\;D_2O/Cu(111)\;and\;CH_3I/D_2$O/Cu(111) were all measured to be about 3.9 eV, 1.0 eV downward shift from that of clean Cu(111).

압밀이 오염물질 이동에 미치는 장기적 영향 (Long-Term Effect of Consolidation on Contaminant Transport)

  • 이장근;김도윤;박재우
    • 한국지반공학회논문집
    • /
    • 제27권1호
    • /
    • pp.35-40
    • /
    • 2011
  • 하저 또는 해저 퇴적오염물질 처리 및 제거는 준설과 매립에 의해 활발히 진행되었다. 그러나 준설과 매립은 준설과정에서 발생하는 퇴적오염물질의 교란, 매립지 선정문제, 고비용 공사비 등으로 인한 많은 제약이 따르고 있다. 이러한 문제로 인해 협소한 지역의 퇴적오염물질에 대해서는 오염물질의 용출 저감을 위한 현장 캡핑이 근래 들어 많이 사용되고 있다. 현장 캡핑에 따른 오염물질 이동에 관해서는 분자확산에 의한 영향이 지배적으로 해석되어 왔으나, 근래 들어 보다 정확한 모사를 하기 위하여 이류-확산을 복합적으로 해석할 필요성이 제기되었다. 퇴적물은 초기 함수율이 높은 슬러지(sludge)상태로 비교적 적은 상재하중과 자중에 의한 압밀이 발생하고, 압밀 과정에서 발생한 간극수 흐름의 변화는 오염물질의 이류에 의한 이동에도 영향이 미친다. 본 연구에서는 기존의 연구에서 수행된 압밀 과정에서 오염물질의 이동뿐만 아니라 압밀 후 간극비의 감소에 따른 오염물질 이동의 변화에 대하여 분석하고자 한다.

초고층 건축물 매트 기초용 고성능 콘크리트 내구성 평가 (Durability Evaluation of High-Performance, Low-Heat Self-Compacting Concrete for Foundation of Tall Buildings)

  • 김영봉;박동천
    • 한국건축시공학회지
    • /
    • 제22권5호
    • /
    • pp.425-430
    • /
    • 2022
  • 초고층 건축물용 매트기초에 사용되는 콘크리트는 시공성 및 품질확보를 위하여 일체타설로 진행되는 경우가 많다. 하지만 일체타설의 경우 수화반응 과정에서 온도균열이 발행할 우려가 높으며 혼화재 치환을 통해 고성능 고내구성 콘크리트 최적배합을 도출할 필요가 있다. 본 연구에서는 저자의 기존연구에서 도출한 최적 고성능 저발열 콘크리트 배합으로 제작된 시험체를 대상으로 염해 및 탄산화, 내황산염에 대한 실험을 실시하고 염소이온 확산계수와 탄산화계수, 황산염에 대한 시멘트 매트릭스의 저항을 정량적으로 평가하였다. 혼화재의 혼입에 의한 잠재수경성 및 포졸란 반응에 의한 높은 저항성을 확인할 수 있었다.

적외선검출소자를 위한 GaSb 결정 및 MBE로 성장한 Gasb/SI-GaAs 박막의 진성결함에 관한 연구 (Study on the Intrinsic Defects in Undoped GaSb Bulk and MBE-grown GaSb/SI-GaAs Epitaxial Layers for Infrared Photodetectors)

  • 김준오;신현욱;최정우;이상준;노삼규
    • 한국진공학회지
    • /
    • 제18권2호
    • /
    • pp.127-132
    • /
    • 2009
  • Sb에 기초한 응력 초격자 적외선검출소자의 구성 물질인 도핑하지 않은 기판 GaSb 결정과 GaSb/SI-GaAs 박막에 잔존하고 있는 진성결함 (intrinsic defect)을 비교 조사하였다. 상온 근처 (250 K)까지 광여기 발광 (PL)을 보이는 GaSb 결정에서의 발광 에너지의 온도의존성으로부터, 밴드갭 에너지에 관한 경험식인 Varshni 함수의 파라미터 ($E_o$, $\alpha$, $\beta$)를 결정하였다. GaAs 기판 위에 성장된 이종 GaSb 박막에서는 GaSb 주요 진성결함으로 알려져 있는 29 meV의 이온화 에너지를 가지는 위치반전 (antisite) Ga ([$Ga_{Sb}$]) 결함과 함께 위치반전 Sb ([$Sb_{Ga}$])와의 복합결함 ([$Ga_{Sb}-Sb_{Ga}$])과 관련된 것으로 분석된 732/711 meV의 한 쌍의 깊은준위 (deep level)가 관측되었다. PL의 온도 및 여기출력 의존성을 분석하여, Sb-rich상태에서 성장된 GaSb 박막에서는 잉여 Sb의 자발확산 (self-diffusion)에 의하여 치환된 위치전도 [$Ga_{Sb}$] 및 [$Sb_{Ga}$]가 결합하여 [$Ga_{Sb}-Sb_{Ga}$]의 깊은준위를 형성하는 것으로 해석되었다.

Factors affecting Pig Farmers' Adoption of the HACCP System

  • Jung, Gu-Hyun;Ahn, Kyeong Ah;Kim, Han-Eul;Jo, Hye Bin;Choe, Young-Chan
    • Agribusiness and Information Management
    • /
    • 제3권2호
    • /
    • pp.43-62
    • /
    • 2011
  • The goal of this study is to determine, based on survey results, the underlying factors that affect the intention of the farmers who have not adopted the Hazard Analysis and Critical Control Points (HACCP) system for the rearing phase of pig production to adopt this system in the future. The research model for this study was con structed based on strategic contingency theory, the theory of the diffusion of innovation, and the technology acceptance model (TAM). Using structural equation modeling with partial least squares (PLS), this study analyzes the effects of the intensity of competition, the environmental uncertainty, the innovativeness and self-efficacy of the individual farmers, and the impact of the credibility of the Agricultural Technology Service Center (ATSC), which acts as the principal agent of technology dissemination and as a leader of change, on the perceived usefulness of technology and the farmers' intention to adopt the system. The results of the analysis are as follows. First, with regard to the underlying factors affecting the intention to adopt the new system, the intensity of competition within the industry and the institutional credibility of the ATSC were inferred to underlie the perceived usefulness. Second, institutional credibility has a positive impact on the perceived usefulness of the system, and the perceived usefulness, in turn, has a positive impact on the intention to adopt. The perceived ease of use also has a positive impact on the intention to adopt. Because the factor that has the biggest impact on the intention of a farm to adopt is the credibility of the ATSC, it is crucial for extension organizations, such as the ATSC, to make greater efforts to promote the expansion of the HACCP system. Because farmers feel that the implementation of the HACCP system is an instrumental strategy for coping with the high intensity of competition within the industry, they attempt to gain a competitive edge through the production of safe livestock products.

  • PDF

저온 및 고전류밀도 조건에서 전기도금된 구리 박막 간의 열-압착 직접 접합 (Thermal Compression of Copper-to-Copper Direct Bonding by Copper films Electrodeposited at Low Temperature and High Current Density)

  • 이채린;이진현;박기문;유봉영
    • 한국표면공학회:학술대회논문집
    • /
    • 한국표면공학회 2018년도 춘계학술대회 논문집
    • /
    • pp.102-102
    • /
    • 2018
  • Electronic industry had required the finer size and the higher performance of the device. Therefore, 3-D die stacking technology such as TSV (through silicon via) and micro-bump had been used. Moreover, by the development of the 3-D die stacking technology, 3-D structure such as chip to chip (c2c) and chip to wafer (c2w) had become practicable. These technologies led to the appearance of HBM (high bandwidth memory). HBM was type of the memory, which is composed of several stacked layers of the memory chips. Each memory chips were connected by TSV and micro-bump. Thus, HBM had lower RC delay and higher performance of data processing than the conventional memory. Moreover, due to the development of the IT industry such as, AI (artificial intelligence), IOT (internet of things), and VR (virtual reality), the lower pitch size and the higher density were required to micro-electronics. Particularly, to obtain the fine pitch, some of the method such as copper pillar, nickel diffusion barrier, and tin-silver or tin-silver-copper based bump had been utillized. TCB (thermal compression bonding) and reflow process (thermal aging) were conventional method to bond between tin-silver or tin-silver-copper caps in the temperature range of 200 to 300 degrees. However, because of tin overflow which caused by higher operating temperature than melting point of Tin ($232^{\circ}C$), there would be the danger of bump bridge failure in fine-pitch bonding. Furthermore, regulating the phase of IMC (intermetallic compound) which was located between nickel diffusion barrier and bump, had a lot of problems. For example, an excess of kirkendall void which provides site of brittle fracture occurs at IMC layer after reflow process. The essential solution to reduce the difficulty of bump bonding process is copper to copper direct bonding below $300^{\circ}C$. In this study, in order to improve the problem of bump bonding process, copper to copper direct bonding was performed below $300^{\circ}C$. The driving force of bonding was the self-annealing properties of electrodeposited Cu with high defect density. The self-annealing property originated in high defect density and non-equilibrium grain boundaries at the triple junction. The electrodeposited Cu at high current density and low bath temperature was fabricated by electroplating on copper deposited silicon wafer. The copper-copper bonding experiments was conducted using thermal pressing machine. The condition of investigation such as thermal parameter and pressure parameter were varied to acquire proper bonded specimens. The bonded interface was characterized by SEM (scanning electron microscope) and OM (optical microscope). The density of grain boundary and defects were examined by TEM (transmission electron microscopy).

  • PDF

Relationship of Smoking with Self-perceived Health and Selected Health Behaviors

  • Choi Eun-Jin
    • 보건교육건강증진학회지
    • /
    • 제21권4호
    • /
    • pp.35-49
    • /
    • 2004
  • The purpose of this study was to analyze variables associated with smoking and selected health behaviors. This study targeted adult men and women over 20 of age. The sample population was drawn from the national sample, and the samples were chosen from the telephone book. A total of 1,500 cases were collected through a telephone based interview survey. As a tool for this study, a structured questionnaire was developed. the variables included self-perceived health status, and selected 7 health behaviors; smoking behavior, physical activities, eating habit, weight control, alcohol consumption, stress management, and cancer exam. The healthy life practice actions of Trans-theoretical model have been classified into five stages. Smokers were more likely than non-smokers to positive attitudes toward smoking and the impact of smoking in this study. This means that smokers's awareness toward the impact of smoking is very week. Smoking behavior was significantly related to other health related behaviors based on the correlation analysis. However, gender, engaging in regular physical activities, moderate consumption of alcoholic beverages, and receiving a cancer examination were the variables that can explain and predict a person's stages of adopting a non-smoking behavior. Self perceived health status was closely related to other health behaviors. Gender, age, and monthly household income were important demographic variables that have significant relationship with the self-perceived health status. Among the health behaviors, regular physical activities and weight control were significant predictable variables. Similar results have been found in the National health and Nutrition examination survey in Korea. As a result of this study, it was found that among the selected health behaviors, engaging in physical activity was an important variable to increase positive sense of health and non-smoking behaviors. Educational and policy level input is needed to increase awareness and provide chances to participate in fitness activities. To those who maintain exercise, the environmental support and diffusion of knowledge information and education data should be strengthened. To change attitudes toward smoking, more in-dept awareness campaign and education should be provided according to people's different behavioral status. In addition, not only diffusing health education data and delivering knowledge information through related programs, but also environmental support system that helps an individual maintain his/her action is required. Such a support system means settlement of the health enhancement base of school, workplace and community should be carried out, and the policy level support and regular programs should be provided and spread to the unit of community.

포장에서 물리적 진행과정에 의해 영향을 받은 물질과 수분의 이동성 (Mobility of Water and Solute Intluenced by PHYSICAL PROCESSES in field Soils)

  • Doug Young Chung
    • 한국토양환경학회지
    • /
    • 제1권2호
    • /
    • pp.73-81
    • /
    • 1996
  • 실험실 내에서 부피비로 약 50%내외의 수분함량을 가진 3개의 서로 다른 깊이의 토양에서 염소와 중수의 확산계수는 4.8$\times$ $10${-7}$ 부터 7.2$\times$ $10${-7}$ $\textrm{cm}^2$/sec와 5.5 $\times$ $10${-5}$ 부터 1.6$\times$ $10${-4}$ $\textrm{cm}^2$//sec였다. 한편, 물과 물질의 이동성에 대한 연구는 중간사로 구성된 토양층 위에 위치하는 점토로부터 미사질 양토에 속하는 약 70cm깊이의 토양에서 실시되었고, 87일간의 실험기간동안 리터당 15.2$m\ell$의 염소와 0.6bq의 중수로 처리된 물을 일정한 유량(2cm/일)으로 관개하였다. 토양의 깊이와 시간에 따른 염소와 중수의 변동위치는 suction probe에 채취된 토양수를 가지고 측정하였는데 실험지 안에서 서로 다른 깊이 또는 동일 위치에서 염소와 중수가 발견되었다. 이러한 실험의 결과로부터 추정컨대 토양수의 유속과 표면확산 계수가 염소와 중수의 분포에 직접적인 영향을 미쳤고 24개의 suction probe에서의 결과는 실질적 물질과 토양의 상호작용의 효과를 나타내는 순수치의 25% 내외에서 평가치를 추정할 수 있었다.

  • PDF

확산펌프 기반의 O2 축전결합 플라즈마를 이용한 PMMA와 폴리카보네이트의 건식 식각 (Dry Etching of PMMA and Polycarbonate in a Diffusion Pump-based Capacitively Coupled O2 Plasma)

  • 박주홍;이성현;최경훈;노호섭;이제원
    • 한국재료학회지
    • /
    • 제19권8호
    • /
    • pp.421-426
    • /
    • 2009
  • We report on the capacitively coupled O2 plasma etching of PMMA and polycarbonate (PC) with a diffusion pump. Plasma process variables were process pressure and CCP power at 5 sccm $O_2$ gas flow rate. Characterization was done in order to analyze etch rate, etch selectivity, surface roughness, and morphology using stylus surface profilometry and scanning electron microscopy. Self bias decreased with increase of process pressure in the range of 25$\sim$180 mTorr. We found an important result for optimum pressure for the highest etch rate of PMMA and PC, which was 60 mTorr. PMMA and PC had etch rates of 0.46 and 0.28 ${\mu}m$/min under pressure conditions, respectively. More specifically, etch rates of the materials increased when the pressure changed from 25 mTorr to 60 mTorr. However, they reduced when the pressure increased further after 60 mTorr. RMS roughnesses of the etched surfaces were in the range of 2.2$\sim$2.9 nm. Etch selectivity of PMMA to a photoresist was $\sim$1.5:1 and that of PC was $\sim$0.9:1. Etch rate constant was about 0.04 ${\mu}m$/minW and 0.02 ${\mu}m$/minW for PMMA and PC, respectively, with the CCP power change at 5 sccm $O_2$ and 40 mTorr process pressure. PC had more erosion on the etched sidewall than PMMA did. The OES data showed that the intensity of the oxygen atomic peak (777.196 nm) proportionally increased with the CCP power.

Ni/Ni-aluminide//Ti/Ti-aluminide 구조경사형 층상재료의 균열 전파 거동 (Crack propagation behavior of in-situ structural gradient Ni/Ni-aluminide//Ti/Ti-aluminide laminate materials)

  • 정동석;김진곤;조현
    • 한국결정성장학회지
    • /
    • 제15권6호
    • /
    • pp.269-275
    • /
    • 2005
  • Ni/Ni-aluminide//Ti/Ti-aluminide 경사기능 층상 복합재료를 박막 hot press법을 이용하여 제작하였다. NiAl과 $TiAl_3$ 금속간화합물 층이 자전고온합성반응을 통해 비교적 두껍게 형성되었고, 얇고 연속적인 $Ni_3Al$과 TiAl 층이 고상 확산을 통해 형성되었다. 파괴저항은 하중 방향이 crack arrester인 경우가 금속 층이 균열의 성장을 방해하기 때문에 crack divider 방향인 경우보다 높다. $Ni_3Al$과 NiAl 금속간화합물 층은 각각 벽개파괴와 입계파괴 거동을 보였고, $TiAl_3$층의 파괴 형태는 입내벽개파괴이었다. Ni/Ni-aluminide 층에서 관찰되는 기공과 금속 층과 금속간화합물 층의 미결합 부위가 낮은 파괴저항의 원인으로 판단된다. Acoustic emission (AE) 원파형 해석을 통해 제작된 복합재료의 파괴특성을 고찰하였다.