• Korean Institute of Interior Design Journal
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• v.13 no.2
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• pp.64-71
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• 2004

This study attempts to clarify inter-relationship between design expression in the surface of contemporary multi-family housing and physical trends in this digital age. The study examines characteristics of housing design influenced from new digital technology in the forms of metaphor such as dematerialization, fluidity and mobility. Currently constructed multi-family housing in Europe after 1990 has been analyzed to find digital reflections in the surfaces. As a conclusion, findings are as follows; In this digital age, a house is considered as a base in the forms of boxes and containers to network to outer worlds. In a complex of multi-family housing, public spaces move to the inside and become parts of private domain. Therefore, a house directly faces a street/outer world without transitional areas and devices. The facades of housing become delicate skins to control private domain in the inside and the world in the outside. In this digital age, the surfaces of housing are designed by ways of wrapping and screening. Printing and mapping methods are used to surface design because they are manipulative and flexible methods in design like graphic design. Screening devices using louvers and shutters are powerful tools to make random and unpredictable images. If units of a louver and a shutter were pixels, a whole surface would be a digital screen. In such assumption, the facade of buildings reflects digital screen to interface while the louvers in operation reflect clicking to network. As a conclusion, design expression in surfaces in-between of multi-family housing is a metaphor of digital mechanism.

• JSTS:Journal of Semiconductor Technology and Science
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• v.16 no.2
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• pp.236-250
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• 2016

Electrical Designs for Application Specific Integrated Circuits (ASIC) has undergone a change recently with the advent of the sub-wavelength lithography. The optical projection with 193 nm wavelength has been further extended with the use of immersion and other techniques. The competing trends for printing smaller design features have been discussed in this paper with the discussion of the electrical layout analysis to find unfriendly design features. The early knowledge of the unfriendly design features allows remedial actions in time for better yield on the wafer. There are existing standard design qualification criteria being used in the design and fabrication community, but they seem to be insufficient to guarantee defect free designs. This paper proposes an integrated approach for screening the layout with multiple aspects: layout geometry based, graphical analysis and process model based verification. The results have been discussed with few example design features from the 28nm design layout.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.57 no.1
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• pp.137-141
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• 2008

Biochip, which implements bioanalytical process on a tiny surface, is one of candidates for medical diagnosis, drug screening, and molecular sensing. In general, a type of biochip based on microfluidics is composed of microcomponents including microchannel, pump, and valve, which require complicated processes. In this study, gray-scale photolithography(GSPL) was applied to fabricate a biochip with multiple layers. A mould for casting PDMS(polydimethylsiloxane) channel, was fabricated using GSPL. A gray-photomask was prepared by printing gray patterns on a high-quality glossy paper followed by photoreducing by 10:1 onto the photo-film. The formation of multiple layers was studied according to the change of gray level of pattern and the developing time. A biochip composed of a weir(multiple layer structure) and a reaction chamber in a single microchannel was fabricated in a glass plate. Finally, we investigated the application of biochip to antigen-antibody reaction by packing the microbead coated with antibody.

• Journal of the Korean Ceramic Society
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• v.39 no.10
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• pp.912-918
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• 2002

Ni-Mn-Co-Fe oxide thick films were coated on an alumina substrate by screening printing technique. The microstructure and electrical properties of the thick films, as a function of composition and sintering temperature, were investigated. The components of the NTC thick films sintered at 1150${\circ}C$ were distributed homogeneously. On the other hand, in the case of the NTC thick films sintered at 1200 and 1250${\circ}C$, Co element was distributed homogeneously, but Ni, Mn and Fe elements were distributed heterogeneously, resulting in the formation of Ni rich and Mn-Fe rich regions. All the thick film NTC thermistors prepared showed a linear relationship between log resistance (log R) and the reciprocal of absolute temperature (1/T), indicative of NTC characteristics. At a given NiO and $Mn_3O_4$ content, the resistance, B constant and activation energy of $(Ni_{1.0}Mn_{1.0}Co_{1-x}Fe_x)O_4$ (0.25${\le}$x${\le}$0.75) and $(Ni_{0.75}Mn_{1.25}Co_{1-x}Fe_x)O_4$ (0.25${\le}$x${\le}$0.75) thermistors increased with increasing $Fe_2O_3$ content.

• KSBB Journal
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• v.21 no.4
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• pp.273-278
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• 2006

The noble method of hybrid agarose gel microstamp fabricated by replica molding against PDMS master to make bacteria patterns on agar surface was presented. After the fabricated hybrid agarose gel microstamp was inked with E. coli, we could obtain 2 dimensional bacterial arrays with $50{\mu}m$ circular spots. And the various shaped patterns based on experimental design were easily generated. The analysis of mean fluorescent signal was showed that bacterial pattern have high contrast between spots and background and homogeneity of pattern. Our proposed method solved the problem of wetting and handling with small soft agarose gel microstamp when bacteria were used for ink. The agarose gel stamp provides appropriate environment to inked bacteria, which is essential technology for cell patterning with high retaining viability during the patterning process. This method is reproducible, convenient, rapid, and could be applied to screening system, study of cell-surface interaction, and microbial ecology.

• Journal of the Korean Society of Industry Convergence
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• v.27 no.3
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• pp.685-692
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• 2024

Currently used heating elements are metal and non-metal heating elements, including various types of heaters, and resistance line heating elements have a problem of decreasing thermal efficiency over time, so to solve this problem, a planar heating element using high-purity carbon materials and oxidation-resistant inorganic compounds was applied. Through the manufacture of planar heating elements using CNT, ruthenium composite materials, and ruthenium oxide, physicochemical performance and capacity were increased, and instantaneous responsiveness was increased. Through thick film technology applicable to various base bodies, fine patterns were formed by the screening method in consideration of the fact that the performance of the heat source depends on the viscosity and pattern shape. The heating element was manufactured by thick film printing technology by mixing ruthenium oxide, CNT, Ag, etc. The characteristics of each paste were analyzed through viscosity measurement, and STS 430 was used as a base. Surface temperature and efficiency were measured by testing heaters manufactured for small wind tunnels and real-vehicle experiments. The surface temperature decreased as the air volume increased, and the optimal system boundary was found to be about 200 mm. Among the currently used heating elements, this paper manufactured a planar heating element using thick film technology to find out the relationship between air volume and temperature, and to study the surface temperature.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.41 no.1
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• pp.24-29
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• 2009

The use of fluorescent whitening agents (FWAs) increases as the demand for the whiter and brighter printing papers increases. FWAs are used as internal and surface treatment chemicals. FWAs that are not used properly in the papermaking process, however, remain in the process water and may demage the paper quality and processes. In this study, a new idea to eliminate FWAs from the process water, consisted of the floc formation of FWAs with cationic chemicals, such as cationic polyelectrolytes and alum, and the removal of the floc by screening or sedimentation, was proposed. Flocculation of FWAs, that is the first step to remove FWAs from the process water, was investigated using turbidity and particle size measurement. Relationship between turbidity and particle size showed that the turbidity could reflect the particle size change of FWA flocs and was proper for the evaluation of flocculation phenomena. Poly-DADMAC was more efficient than PEI to induce the flocculation of FWAs. Alum was effective chemical for the flocculation and sedimentation of FWAs.

• Proceedings of the KIEE Conference
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• 2005.11a
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• pp.189-190
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• 2005

Ploycrystalline $Pb(Zr_{0.5},Ti_{0.5))O_3$ and $BaTiO_3$ powder were prepared by sol-gel process. The alumina substrate were sintered at $1400^{\circ}C$ with bottom electrode of Pt for 2 hours. The Pb(Zr0.5,Ti0.5)O3 / BaTiO3 multilayered thick films with laminating times were fabricated on alumina substrate by screening printing method. The obtained thick films were sintered at $800^{\circ}C$ with upper electrode of Ag paste for 1 hour. Structural properties of Pb(Zr0.5,Ti0.5)O3 / BaTiO3 multilayered thick films were investigated. As a result of the Differential Thermal Analysis(DTA) of Pb(Zr0.5,Ti0.5)O3, exothermic peak was observed at around 650 $^{\circ}C$. The X-ray diffraction (XRD) patterns indicated that BaTiO3 and Pb(Zr0.5,Ti0.5)O3 phases and porosities were formed in the interface of Pb(Zr0.5,Ti0.5)O3 / BaTiO3multilayered thick films.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.05b
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• pp.57-59
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• 2005

Ploycrystalline $Pb(Zr_{0.5},Ti_{0.5})O_3$ and $BaTiO_3$ powder were prepared by sol-gel process. The alumina substrate were sintered at $1400^{\circ}C$ with bottom electrode of Pt for 2 hours. The Pb(Zr0.5,Ti0.5)O3 / BaTiO3 multilayered thick films with laminating times were fabricated on alumina substrate by screening printing method. The obtained thick films were sintered at $800^{\circ}C$ with upper electrode of Ag paste for 1 hour. Structural properties of Pb(Zr0.5,Ti0.5)O3 / BaTiO3 multilayered thick films were investigated. As a result of the Differential Thermal Analysis(DTA) of Pb(Zr0.5,Ti0.5)O3, exothermic peak was observed at around $650^{\circ}C$. The X-ray diffraction (XRD) patterns indicated that BaTi03 and Pb(Zr0.5,Ti0.5)O3 phases and porosities were formed in the interface of Pb(Zr0.5,Ti0.5)O3 / BaTiO3 multilayered thick films.

• Proceedings of the KIEE Conference
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• 2005.07c
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• pp.1960-1961
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• 2005

Ploycrystalline $Pb(Zr_{0.5},Ti_{0.5})O_3$ and $BaTiO_3$ powder were prepared by sol-gel process. The alumina substrate were sintered at $1400^{\circ}C$ with bottom electrode of Pt for 2 hours. The Pb(Zr0.5, Ti0.5)O3/BaTiO3 multilayered thick films with laminating times were fabricated on alumina substrate by screening printing method. The obtained thick films were sintered at $800^{\circ}C$ with upper electrode of Ag paste for 1 hour, Structural properties of Pb(Zr0.5,Ti0.5)O3/BaTiO3 multilayered thick films were investigated. As a result of the Differential Thermal Analysis(DTA) of Pb(Zr0.5,Ti0.5)O3, exothermic peak was observed at around $650^{\circ}C$. The X-ray diffraction (XRD) patterns indicated that BaTiO3 and Pb(Zr0.5,Ti0.5)O3 phases and porosities were formed in the interface of Pb(Zr0.5,Ti0.5)O3 / EaTiO3 multilayered thick films.