• 대한전기학회:학술대회논문집
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• 대한전기학회 2007년도 제38회 하계학술대회
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• pp.1283-1284
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• 2007

The barium strontium calcium titanate((Ba,Sr,Ca)$TiO_3$) powders prepared by the sol-gel method and $MnCO_3$ as acceptor were mixed oxide method. The microstructure was investigated with variation of $Pr_{2}O_{3}$ amount. The BSCT powder and $Pr_{2}O_{3}$ were mixed with organic vehicle(Ferro. B75001). BSCT thick films were fabricated by the screen-printing method on alumina substrates. The bottom electrode was Pt and upper electrode was Ag, respectively. All BSCT thick films were sintered at $1420^{\circ}C$, for 2h. The result of the differential thermal analysis(DTA), exothermic peak at around $654^{\circ}C$ due to the formation of the polycrystalline perovskite phase. In the X-ray diffraction(XRD) patterns, all BSCT thick films showed the typical perovskite polycrystalline structure and no pyrochlore phase was dbserved. The microstructure investigated by scanning electron microscope(SEM). Pore and grain size of BSCT thick films were decreased with increasing amount of $Pr_{2}O_{3}$ dopant. And the average grain size and thickness of BSCT thick films doped with 0.1 mol% $Pr_{2}O_{3}$ was $3.09{\mu}m$, $60{\mu}m$, respectively. The relative dielectric constant decreased and dielectric loss decreased with increasing amount of $Pr_{2}O_{3}$ dopant, the values of the BSCT thick films no doped with $Pr_{2}O_{3}$ were 7443 and 4 % at 1 kHz, respectively.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2007년도 제38회 하계학술대회
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• pp.1275-1276
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• 2007

For fabrication of $BaTiO_3$ system Ferroelectric thick films, (Ba,Sr,Ca)$TiO_3$ (BSCT) powders, prepared by using the alkoxide-based sol-gel method, were doped $MnCO_3$ as acceptor and $Dy_{2}O_{3}$ as donor. $MnCO_3$ and $Dy_{2}O_{3}$-doped (Ba,Sr,Ca)$TiO_3$ thick films were fabricated by screen printing techniques on high purity alumina substrates. The structure and dielectric properties were investigated with variation of $Dy_{2}O_{3}$ amount. As a result of the differential thermal analysis(DTA), exothermic peak was observed at around $670^{\circ}C$ due to the formation of the polycrystalline perovskite phase. All the BSCT thick films, sintered at $1420^{\circ}C$ for 2h, showed the typical XRD patterns of perovskite polycrystalline structure and no pyrochlore phase was observed. The average grain size and thickness of specimens no doped with $Dy_{2}O_{3}$ was 1.32mm, 52mm, respectively. The relative dielectric constant decreased and dielectric loss increased with increasing amount of $Dy_{2}O_{3}$ dopant, the values of the BSCT thick films no doped with $Dy_{2}O_{3}$ were 4043 and 0.4% at 1 kHz, respectively. The relative dielectric constant gradually decreased in the measured frequency range from 0.1 to 100 kHz

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.176-176
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• 2007

Flat-panel direct conversion detectors used in compound substance of semiconductor are being studied for digital x-ray imaging. Recently, such detectors are deposited by physical vapor deposition(PVD) generally. But, most of materials (HgI2, PbI2, TlBr, PbO) deposited by PVD have shown difficult fabrication and instability for large area x-ray imaging. Consequently, in this paper, we propose applicable potentialities for screen printing method that is coated on a substrate easily. It is compared to electrical properties among semiconductors such as $HgI_2$, $PbI_2$, PbO, HgBrI, InI, and $TlPbI_3$ under investigation for direct conversion detectors. Each film detector consists of an ~25 to $35\;{\mu}m$ thick layer of semiconductor and was coated onto the substrate. Substrates of $2cm{\times}2cm$ have been used to evaluate performance of semiconductor radiation detectors. Dark current, sensitivity and physics properties were measured. Leakage current of $HgI_2$ as low as $9pA/mm^2$ at the operation bias voltage of ${\sim}1V/{\mu}m$ was observed. Such a value is not better than PVD process, but it is easy to be fabricated in high quality for large area x-ray Imaging. Our future efforts will concentrate on optimization of growth of film thickness that is coated onto a-Si TFT array.

• 한국재료학회지
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• 제22권7호
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• pp.358-361
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• 2012

Co and Ni as catalysts in $SnO_2$ sensors to improve the sensitivity for $CH_4$ gas and $CH_3CH_2CH_3$ gas were coated by a solution reduction method. $SnO_2$ thick films were prepared by a screen-printing method onto $Al_2O_3$ substrates with an electrode. The sensing characteristics were investigated by measuring the electrical resistance of each sensor in a chamber. The structural properties of $SnO_2$ with a rutile structure investigated by XRD showed a (110) dominant $SnO_2$ peak. The particle size of the $SnO_2$:Ni powders with Ni at 6 wt% was about 0.1 ${\mu}m$. The $SnO_2$ particles were found to contain many pores according to a SEM analysis. The sensitivity of $SnO_2$-based sensors was measured for 5 ppm of $CH_4$ gas and $CH_3CH_2CH_3$ gas at room temperature by comparing the resistance in air to that in the target gases. The results showed that the best sensitivity of $SnO_2$:Ni and $SnO_2$:Co sensors for $CH_4$ gas and $CH_3CH_2CH_3$ gas at room temperature was observed in $SnO_2$:Ni sensors coated with 6 wt% Ni. The $SnO_2$:Ni gas sensors showed good selectivity to $CH_4$ gas. The response time and recovery time of the $SnO_2$:Ni gas sensors for the $CH_4$ and $CH_3CH_2CH_3$ gases were 20 seconds and 9 seconds, respectively.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2006년도 춘계학술대회
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• pp.110-112
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• 2006

Membrane electrode assembly (MEA) for polymer electrolyte fuel cell (PEFC) are commonly prepared in the research laboratory by spraying, screen-printing and brushing catalyst slurry onto membrane or other support material like carbon paper or polyimide film in a batch style. These hand applications of the catalyst slurry are painstaking process with respect to precision of catalyst loading and reproducibility. It has been generally mentioned that the adoption of continuous process is very helpful to develop the reliable product. In the present work, we report the results of using continuous type coater with doctor-blade to coat catalyst slurry for preparing the MEA catalyst layers In a faster and highly reproducible fashion. We show that while expectedly faster than batch style, the machine coater requires the use of slurry of appropriate composition and a properly selected transfer decal material in order to achieve superior MEA plat lnw loading reproducibility. To make highly viscous catalyst slurry that is imperative for using coater, we use 40wt.% Nafion solution and minimize the content of organic solvent. And the choice of proper high surface area catalyst is important in the viewpoint of making well-dispersed slurry. After catalyst coating onto the support material, we transferred the catalyst layer to both sides of Nafion membrane by hot-pressing In this case, the degree of transfer was Influenced by hot-pressing condition including temperature, pressure, and time. To compare the transferring ability, we compared so many films and detaching papers. And among the support, polyethylene terephthalate(PET) film shows the prominent result.

• Korean Chemical Engineering Research
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• 제43권5호
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• pp.627-631
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• 2005

고온수증기 전기분해의 양극물질로 이용될 수 있는 $(La_{0.8}Sr_{0.2})_{0.95}MnO_3$/yttria-stabilized zirconia(LSM/YSZ) 복합체 전극을 x-ray diffractometry, scanning electron microscopy 그리고 galvanodynamic, galvanostatic polarization method로 연구하였다. 이런 목적으로 perovskite-type의 LSM 물질은 공침법을 이용하여 제조하였으며, 8 mol% YSZ와 몰분율을 달리하여 복합체 전극을 합성하였다. LSM/YSZ 복합체 전극은 평판의 YSZ 전해질에 LSM/YSZ 복합체를 스크린 프린팅 후 $1,100^{\circ}C$에서 열처리 코팅하여 제조하였다. 실험결과로부터 LSM/YSZ 복합체 전극의 전기화학적 특성은 전극을 이루는 삼상계면의 구조와 전기분해 온도에 영향을 받는다는 것을 확인하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 추계학술대회 논문집 Vol.17
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• pp.276-279
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• 2004

Plasma enhanced chemical vapor deposition (PECVD) of silicon nitride (SiN) is a proven technique for obtaining layers that meet the needs of surface passivation and anti-reflection coating. In addition, the deposition process appears to provoke bulk passivation as well due to diffusion of atomic hydrogen. This bulk passivation is an important advantage of PECVD deposition when compared to the conventional CVD techniques. A further advantage of PECVD is that the process takes place at a relatively low temperature of 300t, keeping the total thermal budget of the cell processing to a minimum. In this work SiN deposition was performed using a horizontal PECVD reactor system consisting of a long horizontal quartz tube that was radiantly heated. Special and long rectangular graphite plates served as both the electrodes to establish the plasma and holders of the wafers. The electrode configuration was designed to provide a uniform plasma environment for each wafer and to ensure the film uniformity. These horizontally oriented graphite electrodes were stacked parallel to one another, side by side, with alternating plates serving as power and ground electrodes for the RF power supply. The plasma was formed in the space between each pair of plates. Also this paper deals with the fabrication of multicrystalline silicon solar cells with PECVD SiN layers combined with high-throughput screen printing and RTP firing. Using this sequence we were able to obtain solar cells with an efficiency of 14% for polished multi crystalline Si wafers of size 125 m square.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 추계학술대회 논문집 Vol.17
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• pp.494-497
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• 2004

본 연구는 방사선 영상센서 적용을 위한 $HgI_2$ 필름의 특성 평가에 관한 것으로서 X-선 조사조건별 인가전압에 따른 검출신호 특성을 조사하였다. 기존의 $HgI_2$ 검출기의 경우 신호량이 크다는 장점이 있으나 노이즈의 양이 크다. 이에 대한 해결책으로 보호층을 삽입하나 이 경우 X-선 조사에 따른 시간 응답 특성이 있어서 전하트랩현상(tailing effect)에 의한 영향이 크게 존재하였다. 따라서 본 논문에서는 이러한 문제점을 해결하고자 보호층으로써 a-Se 을 삽입하여 기존의 $HgI_2$ 검출기에서 사용되어지는 parlyene이 삽입된 검출기와 전기적 특성을 측정, 비교해보고자 한다. 제작방식으로는 대면적 제작이 용이한 스크린 프린팅 방식을 이용하여 두께 $140\;{\mu}m$와 $3\;cm\;{\times}\;2\;cm$ 면적으로 제조하였다. 측정결과, a-Se을 보호층으로 사용한 $HgI_2$ 필름이 민감도는 거의 비슷하나 누설전류가 안정화 되는데 걸리는 감소시간(decay time)이 parlyene을 사용한 구조에 비해 훨씬 낮았다. 또한 X선에 대한 민감도는 기존의 a-Se에 비해 월등히 높아 적은 방사선 조사량(radiation dose)에서도 신호검출이 가능하여 저선량이 요구되는 방사선 투시촬영(digital fluoroscopy) 적용에 유용할 것으로 기대된다.

• 공업화학
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• 제29권6호
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• pp.782-788
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• 2018

서브 미크론 구리-은 코어-쉘 Cu@Ag 입자를 초음파화학과 결합된 금속교환 반응으로 합성하고 인쇄용 전자부품을 위한 저렴한 전도성 페이스트 적용을 평가하였다. 코어-쉘의 합성을 위한 반응에서 코어로 사용된 $Cu_2O/Cu$ 복합체의 $Cu_2O$는 초음파화학 반응으로 Cu로 환원되고 Cu 원자는 Ag의 금속교환 반응의 환원제로 작용하여 코어 표면에 Ag가 코팅된 코어-쉘 구조를 얻었다. TEM-EDS와 TG-DSC를 이용하여 서브 미크론 입자의 코어-쉘 구조를 확인하였다. 70 wt% Cu@Ag를 용매에 분산시킨 전도성 페이스트를 결합제와 습윤제를 사용하여 제조하고, 스크린 인쇄법을 사용하여 폴리아미드 필름상에 코팅하였다. Ag 함량이 8 at%와 16 at%인 Cu@Ag 입자를 함유하는 인쇄된 페이스트 필름은 공기 중의 $180^{\circ}C$에서 소결한 후 각각 96.2와 $38.4{\mu}{\Omega}cm$의 낮은 비저항 값을 나타내었다.

• 마이크로전자및패키징학회지
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• 제27권4호
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• pp.1-10
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• 2020

웨어러블 소자를 구현하기 위한 칩-섬유 접합 기술을 중심으로 전자 섬유에 대한 기술 개발 동향을 소개한다. 전자 부품을 섬유에 접합하기 위해서는 먼저 전자 부품에 전원 공급 및 전기적 신호를 주고 받기 위한 회로를 섬유에 구성해야 하며, 회로의 해상도와 밀도에 따라 전도성 실을 이용하는 자수법 또는 전도성 페이스트 등을 이용한 프린트법을 통해 구현할 수 있다. 전자 부품과 섬유를 접합하기 위해서는 솔더링, ACF/NCA, 자수법, 크림핑 등의 방법을 이용하여 영구적으로 접합하거나 후크, 자석, 지퍼 등을 이용하여 탈부착이 가능하도록 접합하는 방법이 있으며, 접합 배선의 밀도 및 용도에 따라서 단독 또는 융합하여 사용한다. 접합 이후에는 방수 등 사용환경에서의 신뢰성을 확보하기 위해 encapsulation 작업을 수행해야 하며, 현재는 PDMS 등의 폴리머를 이용한 방법이 널리 쓰이고 있다.