• International Journal of Precision Engineering and Manufacturing
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• v.9 no.2
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• pp.28-33
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• 2008

In a scanning electron microscope (SEM), outside acoustic noise causes image noise that distorts observations of the specimen being examined. A SEM that is less sensitive to acoustic noise is highly desirable. This paper investigates the image noise problem by addressing the mode shapes of the base plate and the transmission path of the acoustic noise and vibration. By arranging the position of the rib, a new SEM base plate was developed that had twisting as the 1st and 2nd modes. In those two twisting modes, vibration nodes existed near the center of the base plate where the specimen chamber is placed. Less vibration was transmitted to the chamber and to the specimen by the twisting modes compared to bending ones, which are the 2nd and 3rd modes for a rectangular plain base plate. An SEM with the developed base plate installed exhibited a significant reduction of image noise when exposed to acoustic noises below 250 Hz.

• Journal of the Korean Society for Precision Engineering
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• v.8 no.4
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• pp.118-125
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• 1991

Acoustic microscopy has attracted much interest recently as potential nondestructive evaluation technique for detecting and sizing defects of surface and sub-surface. Also acoustic emission testing method has been developed for detecting microcracks which is more than 30${\mu}m$ in length quantitatively on ceramics. In the present paper, acoustic emission during the four point bending test in hot-pressed sintered $Si_3N_4$ specimen which was stressed by thermal shock, has been measured by high sensitive sensing system. The surface and sub-surface cracks were detected by scanning acoustic micrscope of 800 MHz and conventional ultrasonic testing in C-scope image. The purpose was to investigate the location and size of cracks by SAM and AE technique, whose experimental data demonstrate good for detecting microcracks.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2010.10a
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• pp.776-779
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• 2010

Implementation for Gated Peak Detector CSAM (C Scanning Acoustic Microscope) based on One Chip processor is proposed in this paper. GDP (Gated Peak Detector) is implemented with VHDL tool. The proposed method leads to be available for its application and integration in all systems as well as acoustic microscope and the method is compared with the conventional methods. The technique results in efficiency in size and application.

• Journal of the Korean Society for Nondestructive Testing
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• v.32 no.4
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• pp.393-400
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• 2012

In recent years, nano-structured thin film systems are often applied in industries such as MEMS/NEMS device, optical coating, semiconductor or like this. Thin films are used for many and varied purpose to provide resistance to abrasion, erosion, corrosion, or high temperature oxidation and also to provide special magnetic or dielectric properties. Quite a number of articles to evaluate the characterization of thin film structure such as film density, film grain size, film elastic properties, and film/substrate interface condition were reported. Among them, the evaluation of film adhesive to substrate has been of great interest. In this study, we fabricated the polymeric thin film system with different adhesive conditions to evaluate the adhesive condition of the thin film. The nano-structured thin film system was fabricated by spin coating method. And then V(z) curve technique was applied to evaluate adhesive condition of the interface by measuring the surface acoustic wave(SAW) velocity by scanning acoustic microscope(SAM). Furthermore, a nano-scratch technique was applied to the systems to obtain correlations between the velocity of the SAW propagating within the system including the interface and the shear adhesive force. The results show a good correlation between the SAW velocities measured by acoustic spectroscope and the critical load measured by the nano-scratch test. Consequently, V(z) curve method showed potentials for characterizing the adhesive conditions at the interface by acoustic microscope.

• The Journal of the Acoustical Society of Korea
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• v.16 no.2E
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• pp.21-26
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• 1997

We propose to use transverse waves instead of longitudinal waves in a scanning tomographic acoustic microscope (STAM) and new type of multiple-transducer with the functions of muliple-angle and multiple-frequency tomography. Proposed multiple-transducer scheme has three insonification angles and three resonance frequencies in order to operate in the transverse wave mode and multiple-angle and multiple frequency tomography for the STAM. In order to evaluate the performance of proposed transducer scheme we have simulated tomographic reconstruction with back-and-forth propagation(BFP) algorithm. Simulation results showed proposed multiple-transducer scheme is capable of obtaining good resolution with transverse wave mode and multiple-frequency tomography. It is also showed that proposed scheme is an efficient rotation scheme by proportion to the number of projections.

• Journal of the Korean Society for Nondestructive Testing
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• v.16 no.4
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• pp.234-240
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• 1997

We studied the resolution enhancement of a novel scanning laser acoustic microscope (SLAM) using transverse waves. Mode conversion of the ultrasonic wave takes place at the liquid-solid interface and some energy of the insonifying longitudinal waves in the water will convert to transverse wave energy within the solid specimen. The resolution of SLAM depends on the size of detecting laser spot and the wavelength of the insonifying ultrasonic waves. Science the wavelength of the transverse wave is shorter than that of the longitudinal wave, we are able to achieve the high resolution by using transverse waves. In order to operate SLAM in the transverse wave mode, we made wedge for changing the incident angle. Our experimental results with model 2140 SLAM and an aluminum specimen showed higher contrast of the SLAM image in the transverse wave mode than that in the longitudinal wave mode.

• Journal of the Korean Society for Nondestructive Testing
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• v.24 no.5
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• pp.518-524
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• 2004

The feasibility of Y(z) curve method of scanning acoustic microscope using high frequency transducer was experimentally studied for assessment of the thermal degradation in Co-based superalloy. Thermal degradation was performed to simulate the microstructural changes in Co-based superalloy arising from long term exposure at high temperature. Longitudinal wave velocity measured by pulse echo method using 10MHz transducer and leaky surface acoustic wave (LSAW) velocity measured by V(z) curve method using 200MHE transducer were measured to investigate the effect on thermal degradation. Ultrasonic velocity decreased as the aging time increased in both ultrasonic waves. Moreover, the low frequency longitudinal wave velocity decreased a little. Otherwise, the high frequency LSAW velocity drastically decreased up to a maximum of 4.7% at the aging time of 4,000hours. A good correlation was found between LSAW and Vickers hardness. Consequently, V(z) curve method of SAM using high frequency transducer could be a potential tool for assessing thermal degradation.

• Journal of the Korean Society for Nondestructive Testing
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• v.21 no.6
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• pp.598-606
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• 2001

Recently, semiconductor packages trend to be thinner, which makes difficult to detect defects therein. A preconditioning test is generally performed to evaluate the reliability of semiconductor packages. The test procedure includes two scanning acoustic microscope (SAM) tests at the beginning and end of the entire test, in order to help detect physical defects such as delaminations and package cracks. In particular, of primary concern are package cracks and delaminations caused by moisture absorbed under ambient conditions. This paper discusses the failure mechanism associated with the moisture absorbed and encapsulated in semiconductors, and the use SAM to detect failures such as tracks and delaminations grown during the preconditioning test.

• The Journal of the Acoustical Society of Korea
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• v.16 no.3
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• pp.51-56
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• 1997

In this paper, we studied the configuration and depth measurement method of the crack in the interior of solid with scanning laser acoustic microscope. Precision measurement method of crack depth is required in SLAM because that system reconstructs the shadow image to the transmission coefficient. We proposed this method that used geometrical structure to the shadow area of SLAM images obtained from oblique incidence and the mode conversion of ultrasound in specimen and then experimented it. For this experiment, we fabricated various specimens which had the vertical line-crack with different depth and made the wedge as 20$^{\circ}$ for oblique incidence. Experimental results showed that the shadow area of SLAM images were proportional to the depth of crack. Measured depth error to the crack was less than 6% compared with practical crack depth.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1991.04a
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• pp.127-133
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• 1991

Acoustic microscopy has attracted much intrest recently as potential mondestructive evalution technique for detecting and sizing defects of surface and sub-surface. Also acoustic emission testing method has been developed for detecting microcracks which is more than 30 umm in length quintitatively on ceramics material. In the present paper, acoustic emission during the four point bending test in hot-pressed sintered Si$\_$3/N$\_$4/ specimen which was stressed bythermal shock has been measured by high sensitive sensing system. The surface and sub-surface cracks were detected by scanning acoustic microscope of 800 MHz and conventional ultrasonic testing in C-scope image. The purpose was to investigate the location and size of cracks by SAM and AE technique, whose experimental datas demontrates good agreement for detecting microcracks.