• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.731-734
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• 2004

Nowadays, CRTs are threatened by the flat panel displays(FPD). The depth of CRTs becomes one of the most important design factor to maintain the dominated portion in the display market. The slim CRT design is introduced in this paper.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.17-19
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• 2008

An advanced TFT-LCD structure was proposed to increase aperture ratio (AR). In this structure, metal layers formed below the data lines are used as light-blocking layers, achieving higher AR ratio than that of a conventional structure. Since average misalignment between the metal light-blocking layers and pixel electrodes is smaller than that of black matrixes on color filter glass, substantially less light-blocking areas are needed to achieve misalignment margin. The AR of the LCD panel fabricated by using proposed structure was enhanced by 18.7 % over that of the conventionally structured panel.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.352-354
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• 2008

A 15.4" WXGA TFT-LCD, featuring integrated a-Si:H gate driver circuits and reduced data driver ICs, has been developed. To reduce number of data lines into 1/2 of conventional structure, the pixel array has been re-mapped with re-organized data signal. Unintended artificial effects such as flicker were removed by adopting the novel pixel array having a 'zigzag' map. To minimize the power consumption, a column inversion method was incorporated in the zigzag pixel array (Fig.1) without modifying the polarity map of conventional dot inversion method.

• Journal of Information Display
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• v.2 no.1
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• pp.43-46
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• 2001

To meet the demand of the display market for large, flat, high-resolution screen, the Super Common eXtended field Oval lens (S-CXO) has been developed with resolution improvement of 10% or more compared to a conventional electron gun. A new main lens structure is adopted, to enhance the effectiveness of aperture and the performance. The new main lens can be assembled using an existing assembly system

• Asia Marketing Journal
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• v.7 no.3
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• pp.105-119
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• 2005

Samsung Fire & Marine Insurance Co., Ltd. launched 'Samsung Super Insurance Package', an insurance policy combining household's property & casualty insurance policies, except insurance with savings and pension insurance, into one for the first time in Korea. The product was developed to tackle challenges and threats from environmental changes, whose success owes to an excellent marketing strategies like adopting MCS system which is coined to support sales force activities, and building SRC(Samsung Risk Consultant), the organization dedicated to the sales of the product. The case shows how Samsung Fire & Marine Insurance Co., Ltd. developed and successfully marketed the combined insurance policy for the first time in Korea identifying the key success factors and discusses its business implications and future challenges.

• Proceedings of the KIEE Conference
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• 2001.07d
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• pp.2493-2495
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• 2001

Burst Error Channel의 에러 정정 기술로써 Reed-Solomon Product Code(RSPC)가 광범위하게 사용되고 있다. 그러나 Random Error Channel과는 달리 Burst Error Channel 상에서 RSPC의 에러 정정 평가 방법에는 많은 어려움이 있다. 우리는 이번 논문에서 Burst Error Channel 상에서 RSPC의 Error Correction Capability의 확률적인 계산 방법을 기술하려 한다.

• 한국정보디스플레이학회:학술대회논문집
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• 2003.07a
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• pp.1160-1163
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• 2003

The effects of time delay between a video signal and a current signal applied to velocity modulation coil on free-spot movement and beam size were measured and analyzed quantitatively in this study. The result shows that it is the most important to avoid signal mismatching in order to achieve the optimal velocity modulation performance.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07b
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• pp.1179-1182
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• 2005

Nowadays, CRTs are threatened by the flat panel displays (FPD). The screen quality of the CRT is one of best among the displays, however, the depth of CRTs becomes one of the most important design factor to maintain the dominated portion in the display market. When designing slim CRTs, the structure of the glass is important design factor because of the weight and safety. The stress in the glass is increased according to the shortening the total length of tube. The residual stress of the seal is also a major factor should be considered due to the large seal edge thickness. The glass design concept for Vixlim is introduced in this paper.

• Journal of Korean Society of Occupational and Environmental Hygiene
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• v.25 no.1
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• pp.36-44
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• 2015

Objectives: This study aimed to elucidate the physicochemical properties of silica powder and airborne particles as by-products generated from fabrication processes to reduce unknown risk factors in the semiconductor manufacturing work environment. Materials and Methods: Sampling was conducted at 200 mm and 300 mm semiconductor wafer fabrication facilities. Thirty-two powder and airborne by-product samples, diffusion(10), chemical vapor deposition(10), chemical mechanical polishing(5), clean(5), etch process(2), were collected from inner chamber parts from process and 1st scrubber equipment during maintenance and process operation. The chemical composition, size, shape, and crystal structure of silica by-product particles were determined by using scanning electron microscopy and transmission electron microscopy techniques equipped with energy dispersive spectroscopy, and x-ray diffractometry. Results: All powder and airborne particle samples were composed of oxygen(O) and silicon(Si), which means silica particle. The by-product particles were nearly spherical $SiO_2$ and the particle size ranged 25 nm to $50{\mu}m$, and most of the particles were usually agglomerated within a particle size range from approximately 25 nm to 500 nm. In addition, the crystal structure of the silica powder particles was found to be an amorphous silica. Conclusions: The silica by-product particles generated from the semiconductor manufacturing processes are amorphous $SiO_2$, which is considered a less toxic form. These results should provide useful information for alternative strategies to improve the work environment and workers' health.

• Proceedings of the KIEE Conference
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• 2001.07d
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• pp.2496-2498
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• 2001

광 디스크 channel상에서 RSPC의 error correction capability를 확률적인 계산 방법으로 계산하는 데는 많은 어려움이 있다. 그 이유는 바로 광 디스크 channel이 burst error channel이기 때문인데, 이 burst error를 어떻게 다루는 가에 따라 그 error correction capability는 사뭇 달라진다. 이 논문에서는 Sony의 dust error distribution[1] 아래에서 4-state Morkov Chain[2]로 modeling하고 그 결과를 가지고 burst error를 channel의 특성과 ECC format의 특성에 맞게 제어할 수 있는 확률적인 계산방법을 소개하고 그것을 simulation하고자 한다.