• 제목/요약/키워드: Sample pre-treatment

검색결과 223건 처리시간 0.022초

Scenedesmus sp.로부터 Taguchi 법을 이용한 지방추출의 최적화 (Optimization of Lipid Extraction from Scenedesmus sp. Using Taguchi Approach)

  • 김나영;오성호;최운용;이현용;이신영
    • KSBB Journal
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    • 제25권4호
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    • pp.371-378
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    • 2010
  • For the biodiesel fuel production from microalgae, the lipid from wet and dry samples of green algae Scenedesmus sp. was extracted by using various solvents and pre-treatment methods. Extraction yield of the lyophilized sample was better than that of dry sample. Chloroform/methanol (2:1, v/v) and ultrasonication or homogenization method were also selected as the most effective solvent and pre-treatment methods for lipid extraction, respectively. Under these constraint conditions, optimization experiment of lipid extraction was investigated by Taguchi approach using orthogonal matrix $L_9$ ($3^4$) method. The optimum extraction conditions of lipid extraction was obtained at pre-treatment of homogenization, extraction time of 5 hour, temperature of $35^{\circ}C$, and solvent ratio of 1:20 (w/v). Yield of extraction at optimized condition was 20.55% and it was 96% of total lipid content (21.38%) of Scenedesmus sp.

Al-Mg-Mn합금의 기계적(機械的) 성질(性質)에 미친 여비압재(予備圧在)의 영향(影響) (Effect of Pre-Rolling on the Mechanical Properties of AI-Mg-Mn Alloy)

  • 예길촌;맹선재
    • Applied Microscopy
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    • 제4권1호
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    • pp.5-10
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    • 1974
  • 본 실험에서는 여비압연이 4. 6%Mg-0.5% Mn-0.18%Cr의 알루미늄합금의 균질화처리 및 그의 기계적 성질에 마치는 영향을 조사하였다. 여비압연후 균질화 열처리된 시편은 주조상태의 시편에 비하여 실온 인장강도 및 연신률이 증가되고 있음을 보여주었다. $400^{\circ}C$의 고온 인장시험의 결과는 여비압연후 균질화열처리한 시편이 주조상태 또는 그의 균질화처리만 시행한 것에 비하여 다소 낮은 인장강도와 현저히 향상된 연신률을 소지함을 보여주었다. 여비압연후 균질화열처리된 시편의 금속현미경조직은 다른 시편들에 비해 결정입계에 ${\beta}$ 상등의 제2상이 현저히 감소되고 있음을 나타내고 있다. 시편의 결정입내 및 입계에 있어서의 주된 합금첨가원소인 Mg 분포상태를 EPMA를 사용하여 조사하였다. 이 결과는 균질화처리를 시행하기 전에 여비압연을 도입함으로써 균질화처리의 효과가 증대되고 있음을 보여주고 있다.

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큰 초기접합력을 갖는 Si기판 직접접합에 관한 연구 (A Study on Si-wafer direct bonding for high pre-bonding strength)

  • 정연식;김재민;류지구;정귀상
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2001년도 하계학술대회 논문집
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    • pp.447-450
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    • 2001
  • Abstract-Si direct bonding(SDB) technology is very attractive for both Si-on-insulator(SOI) electric devices and MEMS applications because of its stress free structure and stability. This paper presents on pre-bonding according to HF pre-treatment conditions in Si wafer direct bonding. The characteristics of bonded sample were measured under different bonding conditions of HF concentration, and applied pressure. The bonding strength was evaluated by tensile strength method. The bonded interface and the void were analyzed by using SEM and IR camera, respectively. Components existed in the interlayer were analysed by using FT-lR. The bond strength depends on the HF pre-treatment condition before pre-bonding (Min : 2.4kgf/cm$^2$∼Max : 14.9kgf/cm$^2$).

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극한 환경 MEMS용 3C-SiC기판의 직접접합 (Direct Bonding of 3C-SiC Wafer for MEMS in Hash Environments)

  • 정연식;이종춘;정귀상
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2002년도 하계학술대회 논문집 C
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    • pp.2020-2022
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    • 2002
  • SiC direct bonding technology is very attractive for both SiCOI(SiC-on-insulator) electric devices and SiC-MEMS fileds because of its application possibility in harsh environements. This paper presents on pre-bonding according to HF pre-treatment conditions in SiC wafer direct bonding using PECVD oxide. The PECVD oxide was characterized by XPS and AFM, respectively. The characteristics of bonded sample were measured under different bonding conditions of HF concentration and applied pressure, respectively. The bonding strength was evaluated by tensile strength method. Components existed in the interlayer were analyzed by using FT-IR. The bond strength depends on the HF pre-treatment condition before pre-bonding (Min : 5.3 kgf/$cm^2{\sim}$ Max : 15.5 kgf/$cm^2$).

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VTM광으로부터 환원 전처리를 이용한 바나듐 회수 공정 개발 (Development of Vanadium Recovery Process Using Reduction Pre-treatment from Vanadium Titanium-Magnetite (VTM) Ore)

  • 고병헌;정도현;한요셉;김성민;추연이;김병수;전호석
    • 자원리싸이클링
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    • 제31권2호
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    • pp.12-19
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    • 2022
  • 본 연구에서는 국내에 부존된 함바나듐 티탄자철석(Vanadium TitanoMagnetite, VTM)을 대상으로 환원 전처리를 이용한 바나듐 회수 공정 개발 연구를 진행하였다. 연구에 사용된 시료는 경기 포천시 관인광산에서 제공한 시료로 바나듐 품위는 0.54V2O5%이며, 자철석과 티탄철석이 대부분 차지하고 있는 것을 확인하였다. 단일자력선별 실험결과, 자력선별만으로는 바나듐 품위 1.10V2O5%대가 한계임을 확인하였다. 이를 해결하기 위하여 탄소(C)를 이용, 자철석 내에 존재하는 철을 환원시켜 철 내부에 존재하는 바나듐을 농축, 품위를 향상시키고자 하였다. 실험결과를 바탕으로 환원 전처리를 적용한 자력선별 공정을 개발하였으며 최종적으로 V2O5기준으로 품위 1.31%, 회수율 79.68%인 바나듐 정광을 회수할 수 있었다. 또한 환원 전과 후, 최종 바나듐 정광에 대한 XRD 분석을 실시하여 환원 전처리에 의한 바나듐의 거동을 확인하였다.

CVD 절연막을 이용한 3C-SiC기판의 직접접합에 관한 연구 (A Study on Direct Bonding of 3C-SiC Wafers Using PECVD Oxide)

  • 정연식;류지구;정귀상
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2002년도 하계학술대회 논문집
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    • pp.164-167
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    • 2002
  • SiC direct bonding technology is very attractive for both SiCOI(SiC-on-insulator) electric devices and SiC-MEMS applications because of its application possibility in harsh environments. This paper presents on pre-bonding according to HF pre-treatment conditions in SiC wafer direct bonding using PECVD oxide. The characteristics of bonded sample were measured under different bonding conditions of HF concentration, and applied pressure. The 3C-SiC epitaxial films grown on Si(100) were characterized by AFM and XPS, respectively. The bonding strength was evaluated by tensile strength method. Components existed in the interlayer were analyzed by using FT-IR. The bond strength depends on the HF pre-treatment condition before pre-bonding (Min : 5.3 kgf/$\textrm{cm}^2$∼Max : 15.5 kgf/$\textrm{cm}^2$).

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지류포장재에서의 수은 정량분석을 위한 전처리 방법 연구 (Study on the Pre-treatment for Quantitative Analysis of Mercury in Paper Packaging Materials)

  • 고승태;이태주;박지현;김형진
    • 펄프종이기술
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    • 제42권5호
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    • pp.67-73
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    • 2010
  • Paper packaging materials are essential in protection and transportation of commercial or industrial products. Raw materials for packaging paper production are mainly obtained from various grades of waste paper. For this reason, the recycled fibers from waste paper would probably have possibility of containing heavy metals. This study was focused on the development of optimum pre-treatment method for the quantitative analysis of mercury. The optimum pre-treatment for open digestion system were obtained at the treatment conditions of acid combination with $HNO_3/HCl/H_2O_2$ or $HNO_3/H_2SO_4$ at $80^{\circ}C$. The optimum pre-treatment conditions in closed digestion system were determinated by the acid combination with $HNO_3/HCl/H_2O_2/HF$ in microwave at 320 W for 20 min. The recovery rate in open digestion system was 85~94% and in closed digestion system was indicated as about 100%. Therefore, the closed system is superior than the open system in pre-treatment method for the quantitative analysis of mercury, and the detected mercury contents in the sample of KOCC, AOCC and kraft sack paper were measured below 1 ppm.

열전처리와 반응조 형태가 고형 유기물의 혐기성 처리에 미치는 영향 (Effects of Heat Pre-Treatment and Reactor Configurations on the Anaerobic Treatment of Volatile Solids)

  • 홍영석;배재호
    • 상하수도학회지
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    • 제10권2호
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    • pp.104-116
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    • 1996
  • Anaerobic digestion is generally used for the treatment of volatile organic solids such as manure and sludge from waste water treatment plants. However, the reaction rate of anaerobic process is slow, and thus it requires a large reactor volume. To minimize such a disadvantage, physical and chemical pre-treatment is generally considered. Another method to reduce the reactor size is to adopt different reactor system other than CSTR. In this paper, the effects of heat pre-treatment and reactor configurations on the anaerobic treatability of volatile solids was studied. Carrot, kale, primary sludge, and waste activated sludge was chosen as the test materials, and the BMP method was used to evaluate the maximum methane production and first order rate constants from each sample. After the heat treatment at $130^{\circ}C$ for 30min., the measured increase in SCOD per gram VS was up to 394 mg/L for the waste activated sludge. However, the methane production potential per gram VS was increased for only primary and waste activated sludge by 17-23%, remaining the same for carrot and kale. The overall methane production process for the tested solids can be described by first order reactions. The increased in reaction constant after heat pre-treatment was also more significant for the primary and waste activated sludge than that for carrot and kale. therefore, the heat pre-treatment appeared to be effective for the solids with high protein contents rather than for the solids with high carbohydrate contents. Among the four reactor systems studied, CSTR, PFR, CSTR followed by PFR, and PFR with recycle, CSTR followed by PFR appeared to be the best choice considering methane conversion rate and the operational stability.

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HF 전처리시 Si기판 직접접합의 초기접합에 관한 연구 (A study on pre-bonding of Si wafer direct bonding at HF pre-treatment)

  • 정귀상;강경두
    • 센서학회지
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    • 제9권2호
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    • pp.134-140
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    • 2000
  • Si기판 직접접합기술은 전자소자 및 MEMS에의 응용에 있어 대단히 매력적인 기술이다. 본 논문에서는 Si기판 직접접합에 있어서 HF 전처리 조건에 따른 초기접합에 관하여 서술한다. 접합된 시료들의 특성은 HF 농도, 인가하중과 같이 각각의 접합조건하에서 분석하였으며, 접합력은 인장강도측정법에 의해 평가하였다. 계면상의 결합성분과 표면의 거칠기는 FT-IR과 AFM을 사용하여 평가하였다. HF 전처리 후 Si기판 표면상의 Si-F결합은 DI water에 세정하는 동안 Si-OH로 재배열되며, 결과적으로 hydrophobic 기판은 Si-OH$\cdots$(HOH$\cdots$HOH$\cdots$HOH)$\cdots$OH-S의 수소결합되어 hydrophilic화된다. 초기접합력은 초기접합전의 HF 전처리 조건에 의존한다. (최소 : $2.4kgf/cm^2{\sim}$최대 : $14.9kgf/cm^2$)

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CVD 절연막을 이용한 3C-SiC 기판의 초기직접접합에 관한 연구 (A Study on Pre-bonding of 3C-SiC Wafers using CVD Oxide)

  • 정귀상;정연식
    • 한국전기전자재료학회논문지
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    • 제15권10호
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    • pp.883-888
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    • 2002
  • SiC direct bonding technology is very attractive for both SiCOI(SiC-on-insulator) electric devices and SiC-MEMS(micro electro mechanical system) fields because of its application possibility in harsh environments. This paper presents pre-bonding techniques with variation of HF pre-treatment conditions for SiC wafer direct bonding using PECVD(plasma enhanced chemical vapor deposition) oxide. The PECYD oxide was characterized by XPS(X-ray photoelectron spectrometer) and AFM(atomic force microscopy). The characteristics of the bonded sample were measured under different bonding conditions of HF concentration and an applied pressure. The bonding strength was evaluated by the tensile strength method. The bonded interface was analyzed by using SEM(scanning electron microscope). Components existed in the interlayer were analyzed by using FT-IR(fourier transform infrared spectroscopy). The bonding strength was varied with HF pre-treatment conditions before the pre-bonding in the range of 5.3 kgf/cm$^2$to 15.5 kgf/cm$^2$.