• Title/Summary/Keyword: Sample pre-treatment

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Optimization of Lipid Extraction from Scenedesmus sp. Using Taguchi Approach (Scenedesmus sp.로부터 Taguchi 법을 이용한 지방추출의 최적화)

  • Kim, Na-Young;Oh, Sung-Ho;Choi, Woon-Yong;Lee, Hyeon-Yong;Lee, Shin-Young
    • KSBB Journal
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    • v.25 no.4
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    • pp.371-378
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    • 2010
  • For the biodiesel fuel production from microalgae, the lipid from wet and dry samples of green algae Scenedesmus sp. was extracted by using various solvents and pre-treatment methods. Extraction yield of the lyophilized sample was better than that of dry sample. Chloroform/methanol (2:1, v/v) and ultrasonication or homogenization method were also selected as the most effective solvent and pre-treatment methods for lipid extraction, respectively. Under these constraint conditions, optimization experiment of lipid extraction was investigated by Taguchi approach using orthogonal matrix $L_9$ ($3^4$) method. The optimum extraction conditions of lipid extraction was obtained at pre-treatment of homogenization, extraction time of 5 hour, temperature of $35^{\circ}C$, and solvent ratio of 1:20 (w/v). Yield of extraction at optimized condition was 20.55% and it was 96% of total lipid content (21.38%) of Scenedesmus sp.

Effect of Pre-Rolling on the Mechanical Properties of AI-Mg-Mn Alloy (Al-Mg-Mn합금의 기계적(機械的) 성질(性質)에 미친 여비압재(予備圧在)의 영향(影響))

  • Ye, Gil-Chon;Maeng, Sun-Chae
    • Applied Microscopy
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    • v.4 no.1
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    • pp.5-10
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    • 1974
  • In this work the effect of pre-rolling on the homogenization and on the mechanical properties of 4.6% Mg-0.5% Mn-0.18% Cr-Al alloy has been studied. At room temperature tensile strength and elongation have been found to increase in the pre- rolled homogenized sample compared to those of the as cast sample. At $400^{\circ}C$ this pre-rolled homogenized sample has shown a little lower tensile strength and a remarkably higher elongation than the samples as casted or homogenized without pre-rolling. Metallurgical microstructure of the pre-rolled homogenized sample has shown conspicuously less secondary phase such as ${\beta}$-phase at the grain boundaries than the other samples. The difference of magnesium content between grain boundaries and within the grains has been also checked by EPMA. The test results show enhanced homogenizing effect by the pre-rolling before homogenizing heat treatment.

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A Study on Si-wafer direct bonding for high pre-bonding strength (큰 초기접합력을 갖는 Si기판 직접접합에 관한 연구)

  • 정연식;김재민;류지구;정귀상
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.07a
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    • pp.447-450
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    • 2001
  • Abstract-Si direct bonding(SDB) technology is very attractive for both Si-on-insulator(SOI) electric devices and MEMS applications because of its stress free structure and stability. This paper presents on pre-bonding according to HF pre-treatment conditions in Si wafer direct bonding. The characteristics of bonded sample were measured under different bonding conditions of HF concentration, and applied pressure. The bonding strength was evaluated by tensile strength method. The bonded interface and the void were analyzed by using SEM and IR camera, respectively. Components existed in the interlayer were analysed by using FT-lR. The bond strength depends on the HF pre-treatment condition before pre-bonding (Min : 2.4kgf/cm$^2$∼Max : 14.9kgf/cm$^2$).

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Direct Bonding of 3C-SiC Wafer for MEMS in Hash Environments (극한 환경 MEMS용 3C-SiC기판의 직접접합)

  • Chung, Yun-Sik;Lee, Jong-Chun;Chung, Gwiy-Sang
    • Proceedings of the KIEE Conference
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    • 2002.07c
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    • pp.2020-2022
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    • 2002
  • SiC direct bonding technology is very attractive for both SiCOI(SiC-on-insulator) electric devices and SiC-MEMS fileds because of its application possibility in harsh environements. This paper presents on pre-bonding according to HF pre-treatment conditions in SiC wafer direct bonding using PECVD oxide. The PECVD oxide was characterized by XPS and AFM, respectively. The characteristics of bonded sample were measured under different bonding conditions of HF concentration and applied pressure, respectively. The bonding strength was evaluated by tensile strength method. Components existed in the interlayer were analyzed by using FT-IR. The bond strength depends on the HF pre-treatment condition before pre-bonding (Min : 5.3 kgf/$cm^2{\sim}$ Max : 15.5 kgf/$cm^2$).

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Development of Vanadium Recovery Process Using Reduction Pre-treatment from Vanadium Titanium-Magnetite (VTM) Ore (VTM광으로부터 환원 전처리를 이용한 바나듐 회수 공정 개발)

  • Go, Byunghun;Jeong, Dohyun;Han, Yosep;Kim, Seongmin;Chu, Yeoni;Kim, Byung-su;Jeon, Ho-Seok
    • Resources Recycling
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    • v.31 no.2
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    • pp.12-19
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    • 2022
  • The study was conducted to develop a vanadium recovery process using reduction pre-treatment in the Vanadium TitanoMagnetite (VTM) The sample for the research was provided by the Gwan-in Mine in Pocheon, Gyeonggi-do. The vanadium content of the sample is 0.54 V2O5% and vanadium is concentrated mainly in magnetite and ilmenite. Magnetic separation of the sample can increase vanadium content up to 1.10 V2O5%. To increase the vanadium content further, reduction pre-treatment was performed, which is a process of concentrating vanadium present in the iron by reducing iron in magnetite using carbon(C). Based on this reduction pre-treatment, the magnetic separation process was developed, which achieved a vanadium grade of 1.31V2O5% and 79.68% recovery. In addition, XRD analysis of the vanadium concentrate before and after reduction and the final vanadium concentrate was performed to confirm the behavior of vanadium by reduction pre-treatment.

A Study on Direct Bonding of 3C-SiC Wafers Using PECVD Oxide (CVD 절연막을 이용한 3C-SiC기판의 직접접합에 관한 연구)

  • 정연식;류지구;정귀상
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.07a
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    • pp.164-167
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    • 2002
  • SiC direct bonding technology is very attractive for both SiCOI(SiC-on-insulator) electric devices and SiC-MEMS applications because of its application possibility in harsh environments. This paper presents on pre-bonding according to HF pre-treatment conditions in SiC wafer direct bonding using PECVD oxide. The characteristics of bonded sample were measured under different bonding conditions of HF concentration, and applied pressure. The 3C-SiC epitaxial films grown on Si(100) were characterized by AFM and XPS, respectively. The bonding strength was evaluated by tensile strength method. Components existed in the interlayer were analyzed by using FT-IR. The bond strength depends on the HF pre-treatment condition before pre-bonding (Min : 5.3 kgf/$\textrm{cm}^2$∼Max : 15.5 kgf/$\textrm{cm}^2$).

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Study on the Pre-treatment for Quantitative Analysis of Mercury in Paper Packaging Materials (지류포장재에서의 수은 정량분석을 위한 전처리 방법 연구)

  • Ko, Seung-Tae;Lee, Tai-Ju;Park, Ji-Hyun;Kim, Hyoung-Jin
    • Journal of Korea Technical Association of The Pulp and Paper Industry
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    • v.42 no.5
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    • pp.67-73
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    • 2010
  • Paper packaging materials are essential in protection and transportation of commercial or industrial products. Raw materials for packaging paper production are mainly obtained from various grades of waste paper. For this reason, the recycled fibers from waste paper would probably have possibility of containing heavy metals. This study was focused on the development of optimum pre-treatment method for the quantitative analysis of mercury. The optimum pre-treatment for open digestion system were obtained at the treatment conditions of acid combination with $HNO_3/HCl/H_2O_2$ or $HNO_3/H_2SO_4$ at $80^{\circ}C$. The optimum pre-treatment conditions in closed digestion system were determinated by the acid combination with $HNO_3/HCl/H_2O_2/HF$ in microwave at 320 W for 20 min. The recovery rate in open digestion system was 85~94% and in closed digestion system was indicated as about 100%. Therefore, the closed system is superior than the open system in pre-treatment method for the quantitative analysis of mercury, and the detected mercury contents in the sample of KOCC, AOCC and kraft sack paper were measured below 1 ppm.

Effects of Heat Pre-Treatment and Reactor Configurations on the Anaerobic Treatment of Volatile Solids (열전처리와 반응조 형태가 고형 유기물의 혐기성 처리에 미치는 영향)

  • Hong, Young-Soek;Bae, Jae-Ho
    • Journal of Korean Society of Water and Wastewater
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    • v.10 no.2
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    • pp.104-116
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    • 1996
  • Anaerobic digestion is generally used for the treatment of volatile organic solids such as manure and sludge from waste water treatment plants. However, the reaction rate of anaerobic process is slow, and thus it requires a large reactor volume. To minimize such a disadvantage, physical and chemical pre-treatment is generally considered. Another method to reduce the reactor size is to adopt different reactor system other than CSTR. In this paper, the effects of heat pre-treatment and reactor configurations on the anaerobic treatability of volatile solids was studied. Carrot, kale, primary sludge, and waste activated sludge was chosen as the test materials, and the BMP method was used to evaluate the maximum methane production and first order rate constants from each sample. After the heat treatment at $130^{\circ}C$ for 30min., the measured increase in SCOD per gram VS was up to 394 mg/L for the waste activated sludge. However, the methane production potential per gram VS was increased for only primary and waste activated sludge by 17-23%, remaining the same for carrot and kale. The overall methane production process for the tested solids can be described by first order reactions. The increased in reaction constant after heat pre-treatment was also more significant for the primary and waste activated sludge than that for carrot and kale. therefore, the heat pre-treatment appeared to be effective for the solids with high protein contents rather than for the solids with high carbohydrate contents. Among the four reactor systems studied, CSTR, PFR, CSTR followed by PFR, and PFR with recycle, CSTR followed by PFR appeared to be the best choice considering methane conversion rate and the operational stability.

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A study on pre-bonding of Si wafer direct bonding at HF pre-treatment (HF 전처리시 Si기판 직접접합의 초기접합에 관한 연구)

  • Chung, Gwiy-Sang;Kang, Kyung-Doo
    • Journal of Sensor Science and Technology
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    • v.9 no.2
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    • pp.134-140
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    • 2000
  • Si wafer direct bonding(SDB) technology is very attractive for both Si-on-insulator(SOI) electronic devices and MEMS applications. This paper presents on pre-bonding according to HF pre-treatment conditions in Si wafer direct bonding. The characteristics of bonded sample were measured under different bonding conditions of HF concentration and applied pressure. The bonding strength was evaluated by tensile strength method. A bond characteristic on the interface was analyzed by using FT-IR, and surface roughness according to HF concentration was analyzed by AFM. Si-F bonds on Si surface after HF pre-treatment are replaced by Si-OH during a DI water rinse. Consequently, hydrophobic wafer was bonded by hydrogen bonding of Si-OH$\cdots$(HOH$\cdots$HOH$\cdots$HOH)$\cdots$OH-Si. The pre-bonding strength depends on the HF pre-treatment condition before pre-bonding. (Min : $2.4kgf/cm^2{\sim}$Max : $14.9kgf/cm^2$)

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A Study on Pre-bonding of 3C-SiC Wafers using CVD Oxide (CVD 절연막을 이용한 3C-SiC 기판의 초기직접접합에 관한 연구)

  • ;;Shigehiro Nishino
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.15 no.10
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    • pp.883-888
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    • 2002
  • SiC direct bonding technology is very attractive for both SiCOI(SiC-on-insulator) electric devices and SiC-MEMS(micro electro mechanical system) fields because of its application possibility in harsh environments. This paper presents pre-bonding techniques with variation of HF pre-treatment conditions for SiC wafer direct bonding using PECVD(plasma enhanced chemical vapor deposition) oxide. The PECYD oxide was characterized by XPS(X-ray photoelectron spectrometer) and AFM(atomic force microscopy). The characteristics of the bonded sample were measured under different bonding conditions of HF concentration and an applied pressure. The bonding strength was evaluated by the tensile strength method. The bonded interface was analyzed by using SEM(scanning electron microscope). Components existed in the interlayer were analyzed by using FT-IR(fourier transform infrared spectroscopy). The bonding strength was varied with HF pre-treatment conditions before the pre-bonding in the range of 5.3 kgf/cm$^2$to 15.5 kgf/cm$^2$.