• Journal of the Microelectronics and Packaging Society
• /
• v.20 no.2
• /
• pp.33-38
• /
• 2013

In this study, both a finite element analysis and an experimental analysis are executed to investigate the mechanical characteristics of dielectric material effects on warpage. Also, viscoelastic material properties are measured by DMA and are considered in warpage simulation. A finite element analysis is done by using both thermal elastic analysis and a thermo-viscoelastic analysis to predict the nonlinear effects. For experimental study, specimens warpage of non-symmetric structure with body size of $22.5{\times}22.5$ mm, $37.5{\times}37.5$ mm and $42.5{\times}42.5$ mm are measured under the reflow temperature condition. From the analysis results, experimental warpage is not similar to FEA results using thermal elastic analysis but similar to FEA results using thermo-viscoelastic analysis. Also, its effect on substrate warpage is increased as core thickness is decreased and body size is getting larger. These FEA and the experimental results show that the nonlinear characteristics of dielectric material play an important role on substrate warpage. Therefore, it is strongly recommended that non-linear behavior characteristics of a dielectric material should be considered to control warpage of FCBGA substrate under conditions of geometry, structure and manufacturing process and so on.

• Journal of the Institute of Electronics and Information Engineers
• /
• v.50 no.5
• /
• pp.39-49
• /
• 2013

The effect of the finite substrate size on the radiation characteristics of H-plane linear microstrip array antennas is investigated. The radiation characteristics versus scan angle are systematically analyzed for 5-element H-plane linear array antennas with various substrate sizes and element spacings for the substrates with different dielectric constants. The distance between the antenna center and the substrate edge on the E-plane for the enhancement of the radiation characteristics of the array antenna is presented.

• Journal of the Institute of Electronics Engineers of Korea TC
• /
• v.48 no.5
• /
• pp.46-53
• /
• 2011

The effect of a finite substrate on the radiation characteristics of a linear 7-element array antenna positioned along the E-plane is investigated. Active reflection coefficients and average active element patterns are simulated for various substrate sizes. The E-plane radiation pattern of a fully excited array for various scan angles is correlated with the active reflection coefficient and average acitive element pattern. The effect of E-plane substrate size on the radiation characteristics of a linear array along the E-plane is larger than that of H-plane substarte size.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2003.06a
• /
• pp.1889-1892
• /
• 2003

The fabrication of micro-size patterning on alumina substrate is generated by laser direct writing, which has high precision and selectivity of various laser beam energies. The depth and width of patterns is affected by laser parameter such as laser power, scan rate. Through the chemical and mechanical polishing Pd seeds was effectively got rid of alumina substrate for selectivity electroless Ni plating. Thermal treatment is good method for changing electrical property of conductor line, because the treatment can control of the grain size.

• Biotechnology and Bioprocess Engineering:BBE
• /
• v.7 no.1
• /
• pp.21-25
• /
• 2002

To maximize and sustain the productivity of Monascus pigments, various environmental and nutritional parameters, such as the initial moisture content, pH, inoculum size, sample size, and nutrient supplement, that influence pigment production were evaluated in solid-state cultures as follows: initial moisture content, $50\%;$ pH, 6.0; inoculum size $1\;\times\;10^4$ spore cells $(grams\;of\;dry\;solid\;substrate)^{-1};$ sample size, 300 g. All supplementary nutrients (carbon, nitrogen, and mineral sources) added has inhibitory effects on the cell growth and red pigment production. In open tray culture the maximum biomass yield and specific productivity of red pigments were 223 mg DCW $(grams\;of\;initial\;dry\;substrate)^{-1}$ and, $47.6\;OD_{500}\;(DCW\;grams)^{-1}h^h{-1}$ respectively.

• Journal of the Korean Vacuum Society
• /
• v.7 no.1
• /
• pp.29-34
• /
• 1998

The solid-phase crystallization (SPC) of plasma-enhanced chemical vapor depsoited (PECVD) amorphous silicon (a-Si) films ha s been investigated by x-ray diffraction (XRD). The a-Si films were prepared on Si (100) wafers using $SiH_4$ gas and without $H_2$ dilution at the substrate temperatures between $120^{\circ}C$ and $380^{\circ}C$, and than annealed at $600^{\circ}C$ for crystallization. The annealed samples exhibited (111), (220), and (311) XRD peaks with preferential orientation of (111). The XRD peak intensities increased as the substrate temperature decreased, and the $H_2$dilution suppressed the solid-phase crystallization. The average grain size estimated by XRD analysis for the (111) texture has increased from about 10 nm to about 30 nm, as the substrate temperature decreased. The deposition rate also increased with the decreasing substrate temperature and the grain size was closely dependent on the deposition rate of the films. The grain size enhancement was attributed to an increase of the structural disorder of the Si network.

• Proceedings of the Korea Inteligent Information System Society Conference
• /
• 2001.01a
• /
• pp.224-229
• /
• 2001

When a semiconductor package is assembled, various materials such as die attach adhesive, lead frame, EMC (Epoxy Molding Compound), and gold wire are used. For better preconditioning performance, the combination between the packaging materials by studying the compatibility of their properties as well as superior packaging material selection is important. But it is not an easy task to find proper packaging material sets, since a variety of factors like package design, substrate design, substrate size, substrate treatment, die size, die thickness, die passivation, and customer requirements should be considered. This research applies case-based reasoning(CBR) technique to solve this problem, utilizing prior cases that have been experienced. Our particular interests lie in building decision support model to aid the selection of proper die attach adhesive. The preliminary results show that this approach is promising.

• Journal of the Korean Graphic Arts Communication Society
• /
• v.28 no.2
• /
• pp.45-56
• /
• 2010

The computer simulation is presented of gravure ink transferring behavior and penetration to the paper when an gravure roller is used to transfer a printing ink onto a substrate. The three dimensional unsteady ink motion is simulated by Polyflow package software and experimented by IGT gravure printing test machine. The simulation is performed where the flow domain is bounded above by a stress free surface and bounded below by a moving substrate. Specific predictions are made for particular pattern of cells and substrates. Cell size and ink rheological properties are found to be the principal determination of transferring behavior. Simulation is currently restricted to the flow domain beneath the receding meniscus. Both Newtonian and shear thinning inks are considered.

• Transactions of the Korean Society of Machine Tool Engineers
• /
• v.16 no.6
• /
• pp.201-204
• /
• 2007

In this paper, fully embedded and miniaturized diplexer device has been developed and characterized for dual-band/mode CDMA handset applications. The size of the embedded diplexer is significantly reduced by embedding high Q circular spiral inductors and high DK MIM capacitors into a low cost organic package substrate. The fabricated diplexer has insertion losses and isolations of -0.5 and -23 dB at 824-894 MHz and -0.7 and -22 dB at 1850-1990 MHz, respectively. Its size is $3.9mm{\times}3.9mm{\times}0.77mm$. The fabricated diplexer is the smallest one which is fully embedded into a low cost organic package substrate.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2000.07a
• /
• pp.877-880
• /
• 2000

The length extensional vibration mode of a piezoelectric ceramic substrate is used in fabricating the ultra-small size resonators and filters. In general, the three side ratios of the substrate effect the resonant characteristics of the resonator using its length extensional vibration. In this paper, their relationships are studied. We know that changing the ratio of its length to its width makes possible to change the resonant frequency of the width vibration without degrading the length extensional vibration.