• The Transactions of The Korean Institute of Electrical Engineers
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• v.67 no.5
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• pp.635-643
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• 2018

This paper propose a method to identify the motor parameters and improve input voltage error which affect the low speed position error of the back-emf(back electromotive force) based sensorless algorithm and to secure the operation reliability and stability even in the case where the load fluctuation is severe and the start and low speed operation frequently occurs. In the model-based observer used in this paper, stator resistance, inductance, and input voltage are particularly influential factors on low speed performance. Stator resistance can cause resistance value fluctuation which may occur in mass production process, and fluctuation of resistance value due to heat generated during operation. The inductance is influenced by the fluctuation due to the manufacturing dispersion and at a low speed where the change of the current is severe. In order to find stator resistance and inductance which have different initial values and fluctuate during operation and have a large influence on sensorless performance at low speed, they are commonly measured through 2-point calculation method by 2-step align current injection. The effect of voltage error is minimized by offsetting the voltage error. In addition, when the command voltage is used, it is difficult to estimate the back-emf due to the relatively large distortion voltage due to the dead time and the voltage drop of the power device. In this paper, we propose a simple circuit and method to detect the voltage by measuring the PWM(Pulse Width Modulation) pulse width and compensate the voltage drop of the power device with the table, thereby minimizing the position error due to the exact estimation of the back-emf at low speed. The suitability of the proposed algorithm is verified through experiment.

• Korean Chemical Engineering Research
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• v.47 no.6
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• pp.715-719
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• 2009

The phase change electrode board for the bio-information detection through electrical property response of phase change material was developed in this study. We manufactured the electrode board using Aluminum first that is widely used in conventional semiconductor device process. Without further treatment, these aluminum electrodes tend to contain voids in PETEOS(plasma enhanced tetraethyoxysilane) material that are easily detected by cross-sectional SEM(Scanning Electron Microscope). The voids can be easily attacked and transformed into holes in between PETEOS and electrodes after etch back and washing process. In order to resolve this issue of Al electrode board, we developed a electrode board manufacturing method using low resistivity TiN, which has advantages in terms of the step-coverage of phase change($Ge_2Sb_2Te_5$, GST) thin film as well as thermodynamic stability, without etch back and washing process. This TiN material serves as the top and bottom electrode in PRAM(Phase-change Random Access Memory). The good connection between the TiN electrode and GST thin film was confirmed by observing the cross-section of TiN electrode board using SEM. The resistances of amorphous and crystalline GST thin film on TiN electrodes were also measured, and 1000 times difference between the amorphous and crystalline resistance of GST thin film was obtained, which is well enough for the signal detection.

• 제어로봇시스템학회:학술대회논문집
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• 2005.06a
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• pp.2430-2434
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• 2005

Automatic FPC punching instrument for the improvement of working condition and cost saving is introduced in this paper. FPC(flexible printed circuit) is used to detect the contact position of K/B and button like a cellular phone. Depending on the quality of the printed ink and position of reference punching point to the FPC, the resistance and current are varied to the malfunctioning values. The size of reference punching point is 2mm and the above. Because the punching operation is done manually, the accuracy of the punching degree is varied with operator's condition. Recently, The punching accuracy has deteriorated severely to the 2mm punching reference hall so that assembly of the K/B has hardly done. To improve this manual punching operation to the FPC, automatic FPC punching system is introduced. Precise mechanical parts like a 5-step stepping motor and ball screw mechanism are designed and tested and low cost PC camera is used for the sake of cost down instead of using high quality vision systems for the FA. 3D Mechanical design tool(Pro/E) is used to manage the exact tolerance circumstances and avoid design failures. Simulation is performed to make the complete vision based punching machine before assembly, and this procedure led to the manufacturing cost saving. As the image processing algorithms, dilation, erosion, and threshold calculation is applied to obtain an exact center position from the FPC print marks. These image processing algorithms made the original images having various noises have clean binary pixels which is easy to calculate the center position of print marks. Moment and Least square method are used to calculate the center position of objects. In this development circumstance, Moment method was superior to the Least square one at the calculation of speed and against noise. Main control panel is programmed by Visual C++ and graphical Active X for the whole management of vision based automatic punching machine. Operating modes like manual, calibration, and automatic mode are added to the main control panel for the compensation of bad FPC print conditions and mechanical tolerance occurring in the case of punch and die reassembly. Test algorithms and programs showed good results to the designed automatic punching system and led to the increase of productivity and huge cost down to law material like FPC by avoiding bad quality.

• Journal of the Korean Ceramic Society
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• v.42 no.3 s.274
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• pp.145-149
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• 2005

[ $Eu^{2+}$ ]-activated barium magnesium silicate phosphor, $(Ba,Ca)_{3}MgSi_{2}O_{8}:Eu_{x}$, has been known to emit blue-green light. In this study we report the manufacturing processes for producing either pure green or pure blue light-emitting phosphor from the same composition of $Ba_{2-x}Ca_{2}CaMgSi_{2}O_{8}:Eu_{x}$ (0 < x < 1) by controlling heat treatment conditions. Green light emitting phosphor of $Ba_{1.9}CaMgSi_{2}O_{8}:Eu_{0.1}$ can be produced under the sample preparation condition of highly reducing atmosphere of $23\%\;H_2/77\%\;N_2$, while blue or blue-green light emitting phosphor under reducing atmosphere of $5\~20\%\;H_2\;/\;95\~80\%$ N_2. The green light-emitting phosphors are prepared in two steps: firing at $800\~1000^{\circ}C$ for $2\~5$ h in air then at $1100\~1350^{\circ}C$ for 2-5 h under reducing atmo­sphere $23\%$ $H_2/77\%\;N_2$. The excitation spectrum of the green light-emitting phosphor shows a broadband of $300\~410$ nm. The emission spectrum has a maximum intensity at the wavelength of about 501 nm. The CIE value of green light emission is (0.162, 0.528). The pure blue light-emitting phosphors can be produced using the $Ba{2_x}CaMgSi_{2}O_{8}:Eu_{x}$ by introducing additional firing step at $1150\~1300^{\circ}C$ in air before the final reducing treatment. The XRD analysis shows that the green light-emitting phosphor mainly consisted of $Ba_{1.31}Ca_{0.69}SiO_{4}$ (JCPDS $\#$ 36-1449) and other minor phases i.e., $MgSiO_3$ (JCPDS $\#$ 22-0714) and $Ca_{2}BaMgSi_{2}O_{8}$ (JCPDS $\#$ 31-0128). The blue light-emitting phosphor mainly consisted of $Ca_{2}BaMgSi_{2}O_{8}$ phase.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.4-4
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• 2008

The progress in flat panel displays over the last two decades has been astonishing. In just 20 years, the LCD-TV grew up from a 2-inch curiosity, to an industry that will sell about 120 million flat panel TV's this year, with viewing area up to 4000 times larger. That success is based on continuous innovation, especially in manufacturing processes. For the next decade to bring another doubling of the business, progress will need to continue in four major areas: Human factors, ecological impact, visual quality, and of course continued drive towards affordability. This talk will detail the technology advances that can allow this industry to meet those challenges. Human factors. Today, we adapt our lifestyle to our technology. People organize their offices, and their homes, around displays. We pass around mobile phones to share images, rather than experiencing them as a group. Billions of newspapers continue to be sold daily. Advances in flexible displays can lead to large portable displays. "New era projection" includes the handheld Pico Projectors that are already on the market, and will ultimately appear integrated in mobile phones the same way cameras do today. "Eco" impact. Today TV's are one of the top energy consumers in a U.S. home, and the fastest growing. Watching a large flat panel TV can cost twice as much as running a large refrigerator. With today's concern about energy consumption, regulations are starting to emerge worldwide to limit TV electrical use. Fortunately, good solutions exist in using light management films to eliminate bulbs, saving power without increasing cost. Going forward, LED backlights will drive another step downward. OLED displays might be the ultimate solution. Visual quality. The color of an LCD-TV is still often considered inferior to a far less expensive CRT. And almost all displays suffer from representing a three-dimensional world on a two dimensional surface. The technology to improve color is available today, and will likely move from premium sets into the mainstream as costs come down. 3D is now arriving in movie theaters worldwide, and that will drive up the demand for similar realistic images in home theaters. And the technology is emerging today for 3D representation to move beyond specialized applications into everyday use, on screens large and small. Affordability. The world takes cost-down miracles for granted in consumer electronics. Each of these other advances will be balanced with a drive for affordability, especially as the market grows in emerging countries. The other three challenges must be met without increasing cost. Putting this all together, the next few years will emphasize "eco friendly" designs, and enhanced images such as 3D. By 2013 we will start to see serious penetration by emissive technologies (OLED, high efficiency plasma, or other), with the "ultimate display" likely not in the market for a decade. Lots of opportunities for innovation remain ahead of us.

• Design & Manufacturing
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• v.14 no.1
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• pp.8-14
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• 2020

In general, auto parts production assembly line is assembled and produced by automatic mounting by an automated robot. In such a production site, quality problems such as misalignment of parts (doors, trunks, roofs, etc.) to be assembled with the vehicle body or collision between assembly robots and components are often caused. In order to solve such a problem, the quality of parts is manually inspected by using mechanical jig devices outside the automated production line. Automotive inspection technology is the most commonly used field of vision, which includes surface inspection such as mounting hole spacing and defect detection, body panel dents and bends. It is used for guiding, providing location information to the robot controller to adjust the robot's path to improve process productivity and manufacturing flexibility. The most difficult weighing and measuring technology is to calibrate the surface analysis and position and characteristics between parts by storing images of the part to be measured that enters the camera's field of view mounted on the side or top of the part. The problem of the machine vision device applied to the automobile production line is that the lighting conditions inside the factory are severely changed due to various weather changes such as morning-evening, rainy days and sunny days through the exterior window of the assembly production plant. In addition, since the material of the vehicle body parts is a steel sheet, the reflection of light is very severe, which causes a problem in that the quality of the captured image is greatly changed even with a small light change. In this study, the distance between the car body and the door part and the door are acquired by the measuring device combining the laser slit light source and the LED pattern light source. The result is transferred to the joint robot for assembling parts at the optimum position between parts, and the assembly is done at the optimal position by changing the angle and step.

• Journal of the Korean Recycled Construction Resources Institute
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• v.2 no.1
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• pp.1-9
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• 2014

In this paper, $CO_2$ amount is evaluated considering repairing timing and unit $CO_2$ amount per repair method including various stage of material manufacturing, moving, and construction. Four mix proportions with mineral admixture are considered and repairing timing/numbers are simulated based on the results from Life 365 which can handle chloride penetration. Furthermore two repair methods (simple cover concrete replacement and replacement with electro-chemical method for removing chloride content) are considered and the related $CO_2$ emissions are evaluated. From the study, the case with high W/B (water to binder ratio) ratio shows smaller $CO_2$ emission in construction stage but it increases more rapidly with increasing number of repair. $CO_2$ emission considering electro-chemical method greatly increases with the increasing unit $CO_2$ for the repairing method. The numbers of jumping step (repairing number) are evaluated to be 9 for WB37-OPC, 18 for WB50-OPC, 4 for WB40-SG, and 7 for WB47-SG respectively. RC structures with the longer maintenance free period are evaluated to be advantageous for saving $CO_2$ emission.

• Journal of the Korean Society of Food Science and Nutrition
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• v.36 no.6
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• pp.807-812
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• 2007

In order to enhance the flavor and storage stability of meat sauce, the manufacturing process of fermented beef-rib sauce was developed in a two-step process. The fermented sauce base was manufactured with Zygosaccharomyces rouxii Y-80 yeast cultivation in raw sauce ingredients for 3 days at $25^{\circ}C$. The fermented beef-rib sauce (FBS) was produced by mixing fermented sauce base with side ingredients. Comparison of the physicochemical and sensory properties with non-fermented beef-rib sauce (NFBS) revealed that the content of ethanol and volatile flavor compounds were higher in FBS; also, the result of sensory evaluation showed that FBS obtained excellent scores for overall taste. To determine the storage stability, FBS and NFBS were incubated at $25^{\circ}C$ for 7 days. The extent of decrease of pH and increase of titratable acidity in NFBS were faster than FBS. After 7 days, ethanol concentrations in FBS and NFBS were 3.77% and 2.04%, respectively. Therefore, based on these results, it can be suggested that storage stability of FBS is superior.

• Composites Research
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• v.26 no.6
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• pp.363-372
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• 2013

Numerical simulation for Resin Transfer Molding manufacturing process is attempted by using the eXtended Finite Element Method (XFEM) combined with the level set method. XFEM allows to obtaining a good numerical precision of the pressure near the resin flow front, where its gradient is discontinuous. The enriched shape functions of XFEM are derived by using the level set values so as to correctly describe the interpolation with the resin flow front. In addition, the level set method is used to transport the resin flow front at each time step during the mold filling. The level set values are calculated by an implicit characteristic Galerkin FEM. The multi-frontal solver of IPSAP is adopted to solve the system. This work is validated by comparing the obtained results with analytic solutions. Moreover, a localization method of XFEM and level set method is proposed to increase the computing efficiency. The computation domain is reduced to the small region near the resin flow front. Therefore, the total computing time is strongly reduced by it. The efficiency test is made with a simple channel flow model. Several application examples are analyzed to demonstrate ability of this method.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.241-241
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• 2012

Semiconductor industry has been taking the advantage of improvements in process technology in order to maintain reduced device geometries and stringent performance specifications. This results in semiconductor manufacturing processes became hundreds in sequence, it is continuously expected to be increased. This may in turn reduce the yield. With a large amount of investment at stake, this motivates tighter process control and fault diagnosis. The continuous improvement in semiconductor industry demands advancements in process control and monitoring to the same degree. Any fault in the process must be detected and classified with a high degree of precision, and it is desired to be diagnosed if possible. The detected abnormality in the system is then classified to locate the source of the variation. The performance of a fault detection system is directly reflected in the yield. Therefore a highly capable fault detection system is always desirable. In this research, time series modeling of the data from an etch equipment has been investigated for the ultimate purpose of fault diagnosis. The tool data consisted of number of different parameters each being recorded at fixed time points. As the data had been collected for a number of runs, it was not synchronized due to variable delays and offsets in data acquisition system and networks. The data was then synchronized using a variant of Dynamic Time Warping (DTW) algorithm. The AutoRegressive Integrated Moving Average (ARIMA) model was then applied on the synchronized data. The ARIMA model combines both the Autoregressive model and the Moving Average model to relate the present value of the time series to its past values. As the new values of parameters are received from the equipment, the model uses them and the previous ones to provide predictions of one step ahead for each parameter. The statistical comparison of these predictions with the actual values, gives us the each parameter's probability of fault, at each time point and (once a run gets finished) for each run. This work will be extended by applying a suitable probability generating function and combining the probabilities of different parameters using Dempster-Shafer Theory (DST). DST provides a way to combine evidence that is available from different sources and gives a joint degree of belief in a hypothesis. This will give us a combined belief of fault in the process with a high precision.