• Journal of Korean Electronics
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• v.11 no.9
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• pp.98-100
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• 1991

• Journal of the Korean Institute of Telematics and Electronics B
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• v.29B no.1
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• pp.76-84
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• 1992

The vision system is essential for SMT(Surface Mounting Technology) automation. The system plays the role of matching the positions betweem SMD and PCB, and inspecting SMD in the final stage of mounting. Real-time processing and high-precision are indispensable for practical purpose. In this paper, a new algorithm for position matching and inspection of SMD is proposed, and which is implemented on the DSP board using DSP board using DSP5600. Experimental results show mean matching error within 0.1 mm in the direction of x,y and execution time within 300msec. Therefore, we could attain high-speed and high-precision of the vision system for SMT automation.

• KIPS Transactions on Software and Data Engineering
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• v.6 no.3
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• pp.135-140
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• 2017

SMT is an equipment that picks up electronic components and does precise placing onto PCBs. In order to do this, it stops in front of a camera installed in the middle to go over vision inspection. And after that it is move for placing. In this paper, We compared to the method of the placing after inspect to the stoped component and the moving component in front of the camera. As a result, This paper shows that the time efficiency of the fly-motion was increased by 9 percent than the stop-motion.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.11
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• pp.6863-6869
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• 2014

A SMT machine is used to place electronic components on a PCB precisely. To place it precisely, after a component inspection, it finds an offset value using a vision camera, and places the precise position on the PCB. In general, to inspect the components with a vision camera, the components stop in front of the camera for inspection, then move to the placement position. On the other hand, if they do not stop in front of a camera, the inspection time will be shortened and the productivity would be increased. In this thesis, when inspecting without stopping in front of a camera, the fastest way among various routes is described. For the gantry passing over a vision camera, both the distance and speed of a gantry moving trajectory were studied, and there was approximately 5% speed increment when using the method suggested in this thesis.

• The Optical Journal
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• s.139
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• pp.56-57
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• 2012

인쇄회로기판과 표면실장기술, LED, 인쇄전자, 기능성 필름, 광학 및 레이저기기 등 전자 제조산업 전반에 걸친 기술들을 총집결한 국내 최대 산업전문전시회인 'Electronics Manufacturing Korea 2012(이하 EMK2012)'가 지난 4월 11일부터 13일까지 코엑스 Hall C, D에서 펼쳐졌다. EMK2012는 SMT/PCB & NEPCON KOREA, LED Packaging EXPO, Film Technology Show와 함께 올해부터 Printed Electronics & Electronic Materials Show과 Photonics Seoul(포토닉스 서울)이 추가돼 총 5개의 전시회가 동시에 열렸다. 약 25개국 300업체가 1000부스 규모로 참가한 이번 전시회는 기존의 SMT, PCB, 전자부품, FPD 생산기자재와 더불어 LED 생산기자재, 광학기기, 레이저 산업 등 전자산업 관련 각종 생산기자재와 제품 등을 선보이며 최신 기술을 교류하는 기회였다.

• Journal of the Korea Convergence Society
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• v.10 no.9
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• pp.17-22
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• 2019

Gentry, an SMT equipment, is a device that absorbs electronic components from the feeder and mounts them correctly on the PCB. At this time, the gantry stops in front of the camera to check whether the parts are correctly adsorbed. In this paper, we propose a method to shorten the moving time by moving the gantry without stopping in front of the camera. This method shows that the moving time is shorter than that of the conventional method by finding a path that can be moved in the fastest time among the various moving paths. The proposed method (moving-motion) reduces the gantry travel time by 20% compared to the conventional method (stop-motion).

• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.9
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• pp.4138-4146
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• 2011

In surface mount technology, with cellular phones and flat panel displays shrinking in size, the electric goods for making these things are getting smaller as well. Therefore, the technology of mounting components such as 0402 and 0603 Chip is on the rise. The chip mount manufacturing companies have studied the mount technology to prevent the missing insertions or improper insertion. This study suggests arranging the mechanical structure by using fiber sensors to eliminate missing insertions or improper insertions and developing the technology for upgrading system algorithms.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2005.09a
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• pp.157-172
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• 2005

기존 단말기에 Fine Pitch (0.3mm) WLCSP를 개발/적용해 봄으로써 SMT 조립 한계로 인식되고 있는 Pitch인 0.4mm이하의 접속 기술을 검증함. Set Maker 입장에서 Fine Pitch를 가진 Customized Package를 적용할 경우, Design 단계에서부터 부품, 기판, 조립공법, Infrastructure등을 동시에 검토해야 함. 이동단말의 소형화/박형화 경쟁이 가속화 되는 가운데 Package Pitch만을 고려해 볼 때, 2006년에는 0.4mm Pitch를 가진 BGA의 적용이 확대 될 것으로 예상되며 일부 제품에서 0.3mm Pitch Package의 적용도 예상됨.

• KIPS Transactions on Software and Data Engineering
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• v.6 no.5
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• pp.223-228
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• 2017

SMT is an device that picks up electronic components and does precise placing onto PCBs. In order to do this, it stops in front of a camera installed in the middle to go over vision inspection. And after that it is move for placing. There are 16 different types of routes in this process. This paper compared to the moving time of three methods in the (sLa-Camera-pLa)type. The first method is stopping in front of the camera for vision inspection and placing components onto PCBs(stop-motion). The second method is moving in front of the camera for vision inspection without stopping(fly1-motion). The third method is inspecting the components when the speed of the X axis, the Y axis is the best and is placing components onto PCBs(fly2-motion). This paper shows the moving time of three methods is same. Therefore we proved that the stop-motion method can be placing in the fastest time without changing structure of the device in the (sLa-Camera-pLa)type.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1993.04b
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• pp.66-70
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• 1993

미세드릴가공은 드릴 직경의 소경화로 발생하는 공구강성저하, 지동 발생, 칩배출 곤란 등으로 인해 수많은 기계가공 중에서도 가장 어려운 가공 중의 하나이며 이로인해 설계의 단계에서 가능한 피하고있는 실정이다. 그러나 근래 각종 제품의 소형 경량화 추세가 일어나면서 미세구멍가공 기술에 대한 중요성이 높아지고 있으며, 특히 시계부품, 소형 정밀 부품, 연료분사용 노즐, 광파이버 관련품, 우주항공기 부품 등에 수요가 급증하고 있다. 또한 최근 전기.전자 공업의 발달과 함께 등장한 표면실장기술(SMT)은 프린터 배선기판의 고밀도화를 더욱 진전시켰으며 이는 구멍밀도, 구멍지름의 미소화 등 미세구멍가공 관점에서 보완해야 할 기술적인 과제를 남겨 놓았다. 본 연구는 미세드릴가공의 메카니즘을 규명하고 그 문제점을 해결하여 미소경 드릴링 머신을 개발하는 데 주력함과 동시에그 절삭현상의 기초적인 연구를 수행하였다