• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.9
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• pp.4138-4146
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• 2011

In surface mount technology, with cellular phones and flat panel displays shrinking in size, the electric goods for making these things are getting smaller as well. Therefore, the technology of mounting components such as 0402 and 0603 Chip is on the rise. The chip mount manufacturing companies have studied the mount technology to prevent the missing insertions or improper insertion. This study suggests arranging the mechanical structure by using fiber sensors to eliminate missing insertions or improper insertions and developing the technology for upgrading system algorithms.

• International Journal of Highway Engineering
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• v.13 no.4
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• pp.231-238
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• 2011

Variable message signs(VMS) in use are being displaying with the LED device as the luminous source, and it is a recent trend to be changed from the Lamp type to the Surface-Mount Devices(SMD) type. The LED device leads to get VMS display brightly and clearly, leading to have visibility and legibility better than the existing VMS. However, the lights which display off the road, the unnecessary energy, might have negative effect on ecosystem. This study developed the way of getting the lights be displayed only to drivers without the unnecessary energy and estimated the energy efficiency of the development by the optical testing. As a result, this study showed that the energy consumption of the developed display device appeared to decrease by about 36.1% compared to the existing device. Also the upward and downward angle of the lights changed from an angle of $24^{\circ}C$ to $0^{\circ}C$and from an angle of $-24^{\circ}C$ to $-11^{\circ}C$, respectively. Therefore, it anticipates that the developed device would benefit highway safety due to an improvement in visibility and legibility compared to the existing VMS and the energy consumption would be less lower than the existing VMS.

• Journal of the Korean Institute of Telematics and Electronics S
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• v.34S no.7
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• pp.102-111
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• 1997

In this paper, a patern recognition method of surface mount device(SMD) IC using wavelet transform and neural network is proposed. We chose the feature parameter according to the characteristics of coefficient matrix which is obtained from four level discrete wavelet transform (DWT). These feature parameters are normalized and then used for the input vector of neural network which is capable of adapting the surroundings such as variation of illumination, arrangement of objects and translation. Experimental results show that when the same form of feature pattern, as is used for learning, is put into neural network and gained 100% rate ofrecognition irrespective of SMD IC kinds, location and variation of illumination. In the case of unused feature pattern for learning, the recognition rate is 85.9% under the similar surroundings, where as an average recognition rate is 96.87% for the case of reregulated value of illumination. Proosed method is relatively simple compared with the traditional space domain method in extracting the feature parameter and is also well suited for recognizing the pattern's class, position and existence. It can also shorten the processing tiem better than method extracting feature parameter with the use of discrete cosine transform(DCT) and adapt the surroundings such as variation of illumination, the arrangement and the translation of SMD IC.

• Journal of Institute of Control, Robotics and Systems
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• v.8 no.7
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• pp.573-577
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• 2002

A tape feeder of a SMD(Surface Mount Device) mounter is a device that sequentially feeds electronic components on a tape reel to the pick-up system of the mounter. As components are getting much smaller, feeding accuracy of a feeder becomes one of the most important factors for successful component pick-up. Therefore, it is critical to keep the feeding accuracy to a specified level in the assembly and production of tape feeders. This paper describes a tape feeder inspection system that was developed to automatically measure and inspect feeding accuracy using machine vision. It consists of a feeder base, an image acquisition system, and a personal computer. The image acquisition system is composed of CCD cameras with lens, LED illumination systems, and a frame grabber inside the PC. This system loads up to six feeders at a time and inspects them automatically and sequentially. The inspection software was implemented using Visual C++on Windows NT with easily usable GUI. Using this system, we can automatically measure and inspect the quality of all feeders in production process by analyzing the measurement results statistically.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2016.05a
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• pp.367-370
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• 2016

QFN(Quad Flat No-leads package) is one of the SMD(Surface Mount Device). Since there is no lead in QFN, there are many defects on solder. Therefore, we propose an efficient mechanism for QFN solder defect detection at this paper. For this, we employ Convolutional Neural Network(CNN) of the Machine Learning algorithm. QFN solder's color multi-layer images are used to train CNN. Since these images are 3-channel color images, they have a problem with applying to CNN. To solve this problem, we used each 1-channel grayscale image(Red, Blue, Green) that was separated from 3-channel color images. We were able to detect QFN solder defects by using this CNN. Later, further research is needed to detect other QFN.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.22 no.3
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• pp.481-492
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• 1997

This paper presents an algorithm for recognizing surface mount device(SMD) IC pattern based on the error back propoagation(EBP) neural network and discrete cosine transform(DCT). In this approach, we chose such parameters as frequency, angle, translation and amplitude for the shape informantion of SMD IC, which are calculated from the coefficient matrix of DCT. These feature parameters are normalized and then used for the input vector of neural network which is capable of adapting the surroundings such as variation of illumination, arrangement of objects and translation. Learning of EBP neural network is carried out until maximum error of the output layer is less then 0.020 and consequently, after the learning of forty thousand times, the maximum error have got to this value. Experimental results show that the rate of recognition is 100% in case of the random pattern taken at a similar circumstance as well as normalized training pattern. It also show that proposed method is not only relatively relatively simple compare with the traditional space domain method in extracting the feature parameter but also able to re recognize the pattern's class, position, and existence.

• 제어로봇시스템학회:학술대회논문집
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• 2001.10a
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• pp.98.4-98
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• 2001

A tape feeder of a SMD(Surface Mount Device) mounter is a device that sequentially feeds electronic components on a tape reel to the pick-up system of the mounter. As components are getting much smaller, feeding accuracy of a feeder becomes one of the most important factors for successful component pick-up. Therefore, it is critical to keep the feeding accuracy to a specified level in the assembly and production of tape feeders. This paper describes a tape feeder inspection system that was developed to automatically measure and inspect feeding accuracy using machine vision. It consists of a feeder base, an image acquisition system, and a personal computer. The image acquisition system is composed of CCD cameras with lens ...

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.12
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• pp.8306-8313
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• 2015

Open-type current sensors have been commonly used for DC motor controller, AC variable controller and Uninterruptible Power Supply. Recently they have begun to be used more widely, as the growth of renewable energy and smart-grid in power system. Considering most of the open-type current sensors are imported, developing the core technology needed to produce open-type current sensors is required. This paper describes the development and test results of open-type current sensors. Design of C type magnetic core, selection and test of a Hall sensor, design of current source circuit and signal conditioning circuit are described. 100A class DIP(Dual In-line Package) type and SMD(Surface Mount Devide) type open-type current sensors was made and tested. Test results show that the developed open-type current sensor satisfies the accuracy requirement of 2% and linearity requirement of 2% at 100 A of DC and AC current of 60Hz. Temperature compensation was carried out by using a temperature compensation circuit with NTC(Negative Temperature Coefficient) thermistor and the effect of the temperature compensation are described.

• Journal of the Semiconductor & Display Technology
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• v.15 no.3
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• pp.18-23
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• 2016

QFN (Quad Flat No-leads Package) is one of the SMD (Surface Mount Device). Since there is no lead in QFN, there are many defects on solder. Therefore, we propose an efficient mechanism for QFN solder defect detection at this paper. For this, we employ Convolutional Neural Network (CNN) of the Machine Learning algorithm. QFN solder's color multi-layer images are used to train CNN. Since these images are 3-channel color images, they have a problem with applying to CNN. To solve this problem, we used each 1-channel grayscale image (Red, Green, Blue) that was separated from 3-channel color images. We were able to detect QFN solder defects by using this CNN. In this paper, it is shown that the CNN is superior to the conventional multi-layer neural networks in detecting QFN solder defects. Later, further research is needed to detect other QFN.

• Agribusiness and Information Management
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• v.6 no.1
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• pp.37-44
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• 2014

This study was conducted to evaluate light intensity and uniformity of two SMD (surface-mount device) type LEDs for protected crop production. A low-power (0.1 W) and a high-power (1 W) LEDs were selected and the intensity and uniformity was evaluated at different vertical (height) and horizontal (distance) intervals. When the horizontal interval of the LED bar was fixed, the light intensity increased and the uniformity decreased as the height decreased. At the 30~40 cm heights, 20~30% of the area showed $200{\pm}20{\mu}molm^{-2}s^{-1}$. As the horizontal distance of the LED bars increased, while the uniformity increased as well, the light intensity decreased. At the distances of 6~10 cm, 17~23% of the area showed $200{\pm}20{\mu}molm^{-2}s^{-1}$. When the LED bars were added to the sides, the light intensity and uniformity were generally improved. Results showed that the light intensity and uniformity depended on the height and interval of the LED bulbs; therefore, optimum arrangement for the crops interested should be determined through experiments.