• Journal of Veterinary Clinics
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• v.29 no.4
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• pp.319-322
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• 2012

This case presents application of bioadhesive for inguinal hernia repair of Jeju native pigs. An inguinal hernia was diagnosed in Jeju native pigs, respectively, 3 days of age and 30 days of age, by physical and radiographic examination. Inguinal herniorrhaphy was performed under sedation with azaperone. After excision of scrotal sac, gently separated testis and intestinal loops. Herniated testis was isolated from scrotal sac and intestinal loops were replaced in the abdominal cavity. The external inguinal ring surface and skin closed using the technique of tissue adhesive. The patients were recovered without post-operative complications. This result considered that bioadhesive application could be a simple method to reduction of scrotal hernia without post-treatment like removal of sutures.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.175-175
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• 1999

Circumventing problems lying in the conventional lithographic techniques, we devised a new method for the fabrication of nanometer scale metal wires inspired by the unique characteristics of carbon nanotubes (CNTs). Since carbon nanotubes could act as masks when CNT-coated thin Au/Ti layer on a SiO2 surface was physically etched by low energy argon ion bombardment 9ion milling), Au/Ti nano-wires were successfully formed just below the CNTs exactly duplicating their lateral shapes. Cross-sectional analysis by transmission electron microscopy revealed that the edge of the metal wire was very sharply developed indicating the great difference in the milling rates between the CNTs and the metal layer as well as the good directionality of the ion milling. We could easily find a few nanometer-wide Au/Ti wires among the wires of various width. After the formation of nano-wires, the CNTs could be pushed away from the metal nano-wire by atomic force microscopy, The lateral force for the removal of the CNTs are dependent upon the width and shape of the wires. Resistance of the metal nano-wires without the CNTs was also measured through the micro-contacts definted by electron beam lithography. since this CNT-based lithographic technique is, in principle, applicable to any kinds of materials, it can be very useful in exploring the fields of nano-science and technology, especially when it is combines with the CNT manipulation techniques.

• Fire Science and Engineering
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• v.26 no.2
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• pp.97-104
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• 2012

Forest fires were easy to be larger in Korea. So the utilization of aircrafts, especially helicopters, for forest fire attack would be increased gradually. In the forest fire attack process, the improvement of the helicopter aerial fire attack technique and safety were the chief element for efficient forest fire attack. In this study, we surveyed the recognition of pilots who worked in Forest Aviation Office which was responsible for aerial forest fire attack in Korea. Using these survey results, we suggested more efficient and safer method for aerial fire fighting based on actual experience of air attack at the scene of forest fire burning.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.103-105
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• 2003

COG (Chip on Glass) technology using solder bump reflow has been investigated to attach IC chip directly on glass substrate of LCD panel. As It chip and LCD panel have to be heated to reflow temperature of the so]der bumps for COG bonding, it is necessary to use low-temperature solders to prevent the damage of liquid crystals of LCD panel. In this study, using the Sn-52In solder bumps of $40{\mu}m$ pitch size, solder joints between Si chip and glass substrate were made at temperature below $150^{\circ}C$. The contact resistance of the solder joint was $8.58m\Omega$, which was much lower than that of the joint made using the conventional ACF bonding technique. The Sn-52In solder joints with underfill showed excellent reliability at a hot humid environment.

• Proceedings of the Korea Electromagnetic Engineering Society Conference
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• 2003.11a
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• pp.155-159
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• 2003

This paper presents fully integrated 5 GHz band low phase noise LC tank VCO. The implemented VCO is tuned by integrated PN diode and tuning rage is $5.01{\sim}5.30$ GHz under $0{\sim}3 V$ control voltage. For good phase noise performance, LC filtering technique, common in Si CMOS process, is used, and to prevent degradation of phase noise performance by collector shot-noise and to reduce power dissipation the HBT is biased at low collector current density bias point. The measured phase noise is -87.8 dBc/Hz at 100 kHz offset frequency and -111.4 dBc/Hz at 1 MHz offset frequency which is good performance. Moreover phase noise is improved by roughly 5 dEc by LC filter. It is the first experimental result in InGaP/GaAs HBT process. The figure of merit of the fabricated VCO with LC filter is -172.1 dBc/Hz. It is the best result among 5 GHz InGaP HBT VCOs. Moreover this work shows lower DC power consumption, higher output power and more fixed output power compared with previous 4, 5 GHz band InGaP HBT VCOs.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.30 no.2 s.245
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• pp.157-163
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• 2006

Our research dealt with micro fabrication using micro forming process. The goal of the research was to establish the limit of forming process concerning the size of forming material and formed shape. Flat-rolled ultra thin metallic foils of pure copper(3.0 and $1.0{\mu}m$ in thickness)and stainless steel($2.5{\mu}m$ in thickness) were used for forming material. We obtained the various shapes of micro channels as using designed forming process. $12-14{\mu}m$ wide and $9{\mu}m$ deep channels were made on $3.0{\mu}m$ thick foil and $6{\mu}m$ wide and $3{\mu}m$deep channels were made on $1.0{\mu}m$ thick foil. Si wafer die for forming was fabricated by using etching technique. And the relation of etching time and die dimension was investigated for fabricating precisely die groove. For the forming, die and metal foil were vacuum packed and the forming was conducted with a cold isostatic press. The formed channels were examined in terms of their dimension, surface qualities and potential for defects. Base on the examinations, formability of ultra thin metallic foil was also discussed. Finally, we compared the forming result with simulation. The result of research showed that metal forming technology is promising to produce micro parts.

• Journal of Distribution Science
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• v.16 no.7
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• pp.47-56
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• 2018

Purpose - This study aims to not only investigate spatial pattern of immigrants' residence and crime occurrences in South Korea, but shed light on how geographic distribution of immigrants and immigrant segregation affect crime rates. Research design, data, and methodology - Th unit of analysis is Si-Gun-Gu municipal level entities of South Korea. The crime data was obtained by Korea National Police Agency and two major types(violence and property) of crime were measured. Most demographic, social, and economic variables were derived from Korean Census Data in 2015. In order to examine spatial patterns of immigrants' distribution and crime rates in South Korea, the present study utilized GIS mapping technique and Exploratory Spatial Data Analysis(ESDA) tools. The causal linkage was investigated by a series of regression models using STATA. Results - Spatial inequality between urban metropolitan vs rural areas was visualized by mapping. Assuming large Moran's I value, spatial autocorrelation appeared to be quite strong. Several neighborhood characteristics such as residential stability and economic prosperity were found to be important factors leading to crime rate change. Residential distribution and segregation for immigrants were negatively significant in the regression models. Conclusions - Unlike the traditional arguments of social disorganization theory, immigrant segregation appeared to reduce violent crime rate and the high proportion of immigrants also turned out to be a crime prevention factor.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.9 no.5
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• pp.986-994
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• 2005

This Paper proposes the likelihood-based nonlinear dimension reduction method of the speech feature parameters in order to construct the voice activity detecter adaptable in noisy environment. The proposed method uses the nonlinear values of the Gaussian probability density function with the new parameters for the speec/nonspeech class. We adapted Likelihood Ratio Test to find speech part and compared its performance with that of Linear Discriminant Analysis technique. In experiments we found that the proposed method has the similar results to that of Gaussian Mixture Models.

• Journal of Navigation and Port Research
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• v.26 no.1
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• pp.78-84
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• 2002

In this thesis a shipping broker agent system, which can be executed by a CORBA-based environment using the distributed object technique, CORBA is designed and implemented Nowadays, while the EC system is extensive on the web, legacy host systems have limitations and its capacity-upgrade os required. In order to solve these problems the method that distributes programs into several computer systems can reduce their loads, set low system capacity and minimize network bottleneck. In this thesis using Agent Communication Language(ACL), we propose an agent based prototype and implement an intelligent agent prototype for ships search using CORBA, which can exchange and shiare data between different systems.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.223-223
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• 2010

InSb 물질은 다른 III-V족 물질들과 비교해서 bandgap이 낮고 전자 이동도가 높아, 소자 구현 시 낮은 전압으로도 고속 동작 특성을 제어할 수 있다는 장점이 있다. 그러나 Si, GaAs 또는 InP 등 쉽게 구할 수 있는 기판과 격자 부정합이 커서 상기 기판에 성장시 많은 defect가 존재하는 단점이 있다. 그러므로 이를 상기 기판에 성장하는데 meta-morphic이라 불리는 성장 기술이 요구되는 어려움이 있다. 본 발표에서 Semi-insulating GaAs 기판위에 고품질의 InSb 박막을 성장하기 위해 grading buffer technique을 도입하며 이에 대한 여러 가지 비교실험과 함께 최적의 성장 방법과 기술에 대해 논의 한다. GaAs와 InSb 물질사이의 bandgap과 격자 부정합을 고려하여 AlSb 물질을 먼저 성장하면서 동시에 InxAl1-xSb로 변화를 주어 InSb 박막이 성장되도록 하였다. ($x=0{\rightarrow}1$). 성장 온도 변화 및 In과 Al의 조성비에 변화를 주어 grading 기법으로 성장하였고 상기 grading buffer위에 InSb 박막을 0.65um 성장하였다. $10um{\times}10um$ AFM 측정결과 2.2nm 정도의 표면 거칠기를 가지며 상온에서의 전자 이동도는 약 46, 300 cm2/Vs 이고 sheet electron density는 9.47(e11) /cm2의 결과를 확인하였다. 실험결과 InSb 박막을 올리는데 있어 가장 고려할 사항인 GaAs 기판과 InSb 박막 사이에 존재하는 격자 부정합을 어떻게 해결하는가에 대해서, 기존의 여러가지 방법과 비교해서 grading buffer 기술이 유효하다는 것을 증명하였다.