• Journal of the Korean Society of Industry Convergence
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• v.26 no.6_2
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• pp.1019-1024
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• 2023

Ceramic materials have excellent material properties such as stability at high temperatures, chemical stability, corrosion resistance, and wear resistance, so they are applicable even in extreme environments of high temperature and pressure. In particular, silicon carbide can be applied in the field of structural ceramics due to its characteristics of high strength, hardness, corrosion resistance, and heat resistance even at high temperatures. In this study, considering the application of silicon carbide materials to next-generation turbines, silicon carbide materials were manufactured using a liquid phase sintering method. When manufacturing liquid phase sintered silicon carbide, sintering additives were added to lower the sintering temperature and densify the material. In Al₂O₃-SiO₂, it was confirmed that the secondary product of the sintering additive was observed as a slightly dark area and was evenly distributed overall, and the fracture surface of Al₂O₃-SiO₂ was in the form of transgranular fracture in which cracks progressed along the crystal plane, and the flexural strength for Al₂O₃-SiO₂ was about 445.6 MPa.

• Journal of Welding and Joining
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• v.33 no.3
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• pp.19-24
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• 2015

Joint properties of electric control unit (ECU) module using Sn-Cu-(X)Al(Si) lead-free solder alloy were investigated for automotive electronics module. In this study, Sn-0.5Cu-0.01Al(Si) and Sn-0.5Cu-0.03Al(Si) (wt.%) lead-free alloys were fabricated as bar type by doped various weight percentages (0.01 and 0.03 wt.%) of Al(Si) alloy to Sn-0.5Cu. After fabrications of lead-free alloys, the ball-type solder alloys with a diameter of 450 um were made by rolling and punching. The melting temperatures of 0.01Al(Si) and 0.03Al(Si) were 230.2 and $230.8^{\circ}C$, respectively. To evaluation of properties of solder joint, test printed circuit board (PCB) finished with organic solderability perseveration (OSP) on Cu pad. The ball-type solders were attached to test PCB with flux and reflowed for formation of solder joint. The maximum temperature of reflow was $260^{\circ}C$ for 50s above melting temperature. And then, we measured spreadability and shear strength of two Al(Si) solder materials compared to Sn-0.7Cu solder material used in industry. And also, microstructures in solder and intermetallic compounds (IMCs) were observed. Moreover, thickness and grain size of $Cu_6Sn_5$ IMC were measured and then compared with Sn-0.7Cu. With increasing the amounts of Al(Si), the $Cu_6Sn_5$ thickness was decreased. These results show the addition of Al(Si) could suppress IMC growth and improve the reliability of solder joint.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.5
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• pp.2002-2008
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• 2012

In recent years, while the importance of thermal management has been emphasized due to smaller electronic products, various materials have been used as heat sink. In this study, porous ceramic heat sink was developed with SiC, successfully separated from the slurry of SiC occurring in solar energy materials industry and the thermal performance of porous SiC heat sink has been compared with those of aluminum heat sink and pure SiC heat sink through experiment. From the experimental results, it was verified that porous recycled SiC heat sink has better thermal performance than aluminum heat sink since its micropores increase the heat transfer area. In addition, the effect of the micropores on thermal performance has been quantified by increasing convective heat transfer coefficient with numerical analysis.

• Journal of the Korean Society of Industry Convergence
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• v.18 no.2
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• pp.110-118
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• 2015

In this study, it is designed and used the test engine bed which is installed with turbocharger, and in addition to equipped using by oxygen adder. It has been controlled the oxygen volumetric fraction of intake air chrge, and supercharged flow rate into the cylinder of SI 4-stroke engine, and then, has been analyzed engine performance, combustion characteristics, and exhaust emission as analysis parameters. The tested parameters were the oxygen fraction and the variation of engine speed and air-fuel ratio.

• Journal of Ocean Engineering and Technology
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• v.22 no.6
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• pp.35-40
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• 2008

The effect of counterpart roughness on abrasive wear characteristics of side plate materials of FRP ship, which were composed of glass fiber and unsaturated polyester resin composites, were investigated at ambient temperature by pin-an-disc friction test. The friction coefficient, wear rate and cumulative wear volume of these materials against SiC abrasive paper were determined experimentally. The wear rate of these materials decreased rapidly with sliding distance and then maintained a constant value. It was increased as counterpart roughness was rougher in a wear test. The cumulative wear volume tended to increase nonlinearly with sliding distance and depended on applied load and sliding speed for these composites. It could be verified by SEM photograph of fracture surface that major failure mechanisms were overlapping layers, microcutting, deformation of resin, delamination, and cracking.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.65-65
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• 2010

Extreme ultraviolet lithography (EUVL) is expected to be applied for making patterns below 32 nm in device industry. An ultrathin EUV photoresist (PR) of a few nm in thickness is required to reduce minimum feature size further. Here, we show that pentacene molecular layers can be employed as a new EUV resist for the first time. Dots and lines in nm scale are successfully realized using the new molecular resist. We clearly provide the mechanism for forming the nanopatterns with scanning photoemission microscope (SPEM), EUV interference lithography (EUV-IL), atomic force microscope (AFM), photoemission spectroscopy (PES), etc. The molecular PR has several advantages over traditional polymer EUV PRs; for example, high thermal/chemical stability, negligible outgassing, ability to control the height and width on the nanometer scale, leaving fewer residuals, no need for a chemical development process and thus reduction of chemical waste to make the nanopatterns. Besides, it could be applied to any substrate to which pentacene bonds chemically, such as $SiO_2$, SiN, and SiON, which is of importance in the device industry.

• Journal of the Korean Society of Industry Convergence
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• v.27 no.4_2
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• pp.935-942
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• 2024

This study analyzes the effects of the parasitic capacitance of the SiC MOSFET used in the Dual Active Bridge ( DAB) converter and proposes a method for calculating the leakage inductance of the transformer. The DAB converter employs high-frequency switching to achieve high efficiency, high power density, and reliability. MOSFETs possess parasitic capacitance, which induces resonance with the leakage inductance of the transformer during switching operations, resulting in a voltage change delay. This paper discusses the effect of the delay of voltage changes on the DAB converter output and proposes a method to calculate the delay time. This method aims to equalize the delay time to minimize this effect and enhance the accuracy of the leakage inductance calculation of the transformer. The proposed method is validated through experiments and simulations.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2009.10a
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• pp.307-310
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• 2009

Nowadays, the usage of high strength steel has been growing in automobile industry mainly as structural parts since for its lightweight and high strength properties the oil crisis happened. Owing to poor formability, complex-shaped high-strength steel components are invariably produced through hot press forming. The high-strength steel sheets are in so me instances used with an Al-Si-coating with a view to prevent scaling of components during hot press forming. How ever, friction and fracture characteristics of Al-Si-coated high-strength steel during hot press forming process have not yet been investigated. In this paper, the formed parts which were formed in hot bending process were investigated by using EDS. SEM and nano indenter in order to analysis the coating layer behavior.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1998.10a
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• pp.248-253
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• 1998

Recently, the uses of Ceramic/metal bonded joints, resin/metal joints, adhesive joints, composite materials which are composed of dissimiliar materials have increased in various industry fields. Since the ceramic/metal bonded joints material is made at a high temperature, residual stress distributions due to differences in material properties were investigated by varying material parameters. The two dimensional finite element analysis was performed to study residual stress distribution in Si3N4/SM45C bonded joint with a copper interlayer between the silicon nitride(Si3N4) and the structural carbon steel(SM45C) and 4-point bending tests were carried out under room temperature. Fracture surface and crack propagation path were observed using scanning electron microscope and characteristics of its fracture was discussed.

• Wind and Structures
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• v.24 no.1
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• pp.43-57
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• 2017

The use of nanotechnology materials and applications in the construction industry should be considered for enhancing material properties. However, the nonlinear buckling of an embedded straight concrete columns reinforced with silicon dioxide ($SiO_2$) nanoparticles is investigated in the present study. The column is simulated mathematically with Euler-Bernoulli and Timoshenko beam models. Agglomeration effects and the characteristics of the equivalent composite are determined using Mori-Tanaka approach. The foundation around the column is simulated with spring and shear layer. The governing equations are derived using energy method and Hamilton's principal. Differential quadrature method (DQM) is used in order to obtain the buckling load of structure. The influences of volume percent of $SiO_2$ nanoparticles, geometrical parameters and agglomeration on the buckling of column are investigated. Numerical results indicate that considering agglomeration effects leads to decrease in buckling load of structure.