• Title/Summary/Keyword: SEM scan

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Assessment of Wear Resistance in Tooth-Colored Materials for Primary Molar Crown Restoration in Pediatric Dentistry

  • Hyun Seok Kang;Yooseok Shin;Chung-Min Kang;Je Seon Song
    • Journal of the korean academy of Pediatric Dentistry
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    • v.51 no.1
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    • pp.22-31
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    • 2024
  • The objective of this study was to assess the wear resistance of tooth-colored materials used in crown restoration for primary molars with a chewing simulator. In this study, four groups-three experimental groups and one control group-were included. They consisted of three-dimensional (3D) printed resin crowns (NextDent and Graphy), milled nano-hybrid ceramic crowns (MAZIC Duro), and prefabricated zirconia crowns (NuSmile). Twelve mandibular second molar specimens were prepared from each group. In the wear experiment, 6.0 × 105 cycles were conducted with a force of 50 N, and a 6 mm-diameter steatite ball was used as an antagonist. The amount of wear was calculated by comparing the scan files before and after the chewing simulation using 3D metrology software, and the worn cross-section was confirmed by scanning electron microscopy (SEM). The resin and ceramic groups did not exhibit any statistically significant differences. However, compared to other crown groups, the zirconia crown group demonstrated notably reduced levels of wear (p < 0.05). In SEM images, layers and cracks were observed in the 3D-printed resin crown groups, which differed from those in the other groups.

AN ELECTROCHEMICAL STUDY ON SURFACE FINISH OF DENTAL AMALGAM (아말감의 표면연마에 관한 전기화학적 연구)

  • Suk, Chang-In;Um, Chung-Moon
    • Restorative Dentistry and Endodontics
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    • v.16 no.2
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    • pp.18-32
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    • 1991
  • The purpose of this study was to observe characteristic properties of amalgam through the polarization curves and SEM images from 4 type amalgams (Amalcap, Shofu spherical. Dispersalloy and Tytin) with 3 different surface finish procedures (polishing, burnishing and carving) by using the potentiostats (EG & GPARC) and SEM (Jeol JSM-35). After each amalgam alloy and Hg was triturated as the direction of the manufacturer by means of mechanical amalgamator (Samki), the triturated mass was inserted into the cylndrical metal mold which was 12 mm in diameter and 10 mm in height and was pressed with $100kg/cm^2$. 4 specimens of each type amalgam were burnished with egg burnisher and another 4 specimens of each type amalgam were carved with Hollenback carver. Above 8 specimens and remaining untreated 4 specimens were stored at room temperature for about 7 days. Untreated 4 specimens of each type amalgam were polished with abrasive papers (Deer) from #400 to #1200 and finally on the polishing cloth with $0.5{\mu}m$ and $0.06{\mu}m$ $Al_2O_3 $ powder suspended water. Anodic polarization measurements was employed to compare the corrosion behaviours of the amalgams in 0.9% saline solution at $37^{\circ}C$. The open circuit potential was determined after 30 minutes immersion of specimen in electrolyte. The scan rate was 1 mV/sec and the surface area of amalgam exposed to the solution was $0.64cm^2$ for each specimen. All the potentials reported are with respect to a saturated calomel electrode (SCE). SEM images of each specimen were taken after + 800 mV (SCE) polarization. The results were as follows: 1. The corrosion potential of high copper amalgam was more anodic than that of low copper amalgam. 2. The polished amalgam were more resistant to corrosion than any other burnished and carved amalgam. 3. In the case of polishing, current density of high copper amalgam was lower than that of low copper amalgam.

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Laser Marking Process for LCD Light Guide Panel (LCD 백라이트 도광판 제조용 레이저 마킹에 관한 연구)

  • 김경동;백창일;송철기;안성훈
    • Journal of the Korean Society for Precision Engineering
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    • v.20 no.1
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    • pp.79-84
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    • 2003
  • A light guide panel is an element of the LCD backlight module that is often used for the display of compact electronic devices. In this study, a laser marking system is proposed to fabricate light guide panel, which can replace other manufacturing methods such as silk printing, stamping, or v-cutting methods. The objective of this research is to evaluate the process parameters of the laser marking system. Light guide patterns were marked with a 50W $CO_2$ laser (CW) to understand the effects of average power and scanning speed on the geometry and quality of groove pattern. The width of the fabricated grooves increases with increasing laser power and decreasing scan speed. In order to analyze surface characteristics and optical properties (luminance, uniformity), SEM photography and BM7 (luminance measuring system) were used. As a result, the optimal conditions of the process parameters were determined.

Thermoelectric Properties of n-type 90%$Bi_{2}Te_{3}+10% Bi_{2}Se_{3}$ Materials Prepared by Rapid Solidification Process and Hot Pressing (급속응고기술에 의한 n-type 90%$Bi_{2}Te_{3}+10% Bi_{2}Se_{3}$ 열간압축제의 열전특성)

  • 김익수
    • Journal of Powder Materials
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    • v.3 no.4
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    • pp.253-259
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    • 1996
  • The efficiency of thermoelectric devices for different applications is known to depend on the thermoelectric effectiveness of the material which tends to grow with the increase of its chemical homogeneity. Thus an important goal for thermal devices is to obtain chemically homogeneous solid solutions. In this work, the new process with rapid solidification (melt spinning method) followed by hot pressing was investigated to produce homogeneous material. Characteristics of the material were examined with HRD, SEM, EPMA-line scan and bending test. Property variations of the materials were investigated as a function of variables, such as dopant ${CdCl}_{2}$ quantity and hot pressing temperature. Quenched ribbons are very brittle and consist of homogeneous $Bi_2Te_3$, ${Bi}_{2}{Se}_{3}$ solid solutions. When the process parameters were optimized, the maximum figure of merit was 2.038$\times$$10^{-3}K^{-4}. The bending strength of the material hot pressed at 50$0^{\circ}C$ was 8.2 kgf/${mm}^2$.

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Laser-induced etching of GaAs with CFC alternatives (CFC 대체물질을 이용한 GaAs의 레이저 유도 에칭)

  • Park, Se-Ki;Lee, Cheon;Kim, Moo-Sung
    • Electrical & Electronic Materials
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    • v.9 no.3
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    • pp.240-245
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    • 1996
  • Non-ozone layer destructive Chlorofluorocarbon(CFC) altematives(CHCIF$_{2}$ and $C_{2}$H$_{2}$F$_{4}$) have been initially used for laser-induced thenrmochemical etching of GaAs. High etching rate up to 188.mu.m/sec and an aspect ratio of 2.7 have been achieved by a single scan of laser beam, respectively. The etching rate at constant ambient gas pressure was found to saturate for beam power. The chemical compositions of the reaction products deposited on the etched groove were measured by Auger electron microscopy(AES). Etched profile, depth and width were observed by scanning electron microscope(SEM).

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On the electropolymerization of acrylonitrile as effected by cyclic voltammetry and chronoamperometry method

  • Seo, H.J.;Cho, M.S.;Nam, J.D.;Lee, Y.
    • Proceedings of the Polymer Society of Korea Conference
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    • 2006.10a
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    • pp.335-335
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    • 2006
  • Polyacrylonitrile (PAN) was deposited as an adherent film on Cu-substrate by the cathodic electropolymerization. This work is an attempt to compare the molecular weight and the fractured surface of PAN prepared by CV and chronoamperometry. The molecular weight and increase weight of PAN measured the according to AN-concentration, scan rate, and cycle number (or time) using CV and chronoamperometry. The morphology of PAN was characterized by SEM image. Mechanism and optimal conditions for electropolymerization of acrylonitrile on Cu-substrate were investigated and discussed.

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Preparation of Boron Doped Fullerene Film by a Thermal Evaporation Technique using Argon Plasma Treatment and Its Electrochemical Application

  • Arie, Arenst Andreas;Jeon, Bup-Ju;Lee, Joong-Kee
    • Carbon letters
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    • v.11 no.2
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    • pp.127-130
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    • 2010
  • Boron doped fullerene $C_{60}$ ($B:C_{60}$) films were prepared by the thermal evaporation of $C_{60}$ powder using argon plasma treatment. The morphology and structural characteristics of the thin films were investigated by scanning electron microscope (SEM), Fourier transform infra-red spectroscopy (FTIR) and x-ray photo electron spectroscopy (XPS). The electrochemical application of the boron doped fullerene film as a coating layer for silicon anodes in lithium ion batteries was also investigated. Cyclic voltammetry (CV) measurements were applied to the $B:C_{60}$ coated silicon electrodes at a scan rate of $0.05\;mVs^{-1}$. The CV results show that the $B:C_{60}$ coating layer act as a passivation layer with respect to the insertion and extraction of lithium ions into the silicon film electrode.

Preparation and Electrochemical Properties of Carbon Cryogel for Supercapacitor

  • Song, Min-Seob;Nahm, Sahn;Oh, Young-Jei
    • Journal of the Korean Ceramic Society
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    • v.45 no.11
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    • pp.662-666
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    • 2008
  • Electrochemical properties of carbon cryogel electrode for the application of composite electrode materials mixed with metal oxide in supercapacitor have been studied. Carbon cryogels were synthesized by sol-gel polycondensation of resorcinol with form aldehyde, followed by a freeze drying, and then pyrolysis in an inert atmosphere. Physical properties of carbon cryogel were characterized by BET, X-ray diffraction (XRD) and scanning electron microscopy (SEM). It is found that carbon cryogel is amorphous material. The electrochemical properties of carbon cryogel were measured by cyclic voltammetry as a function of concentration of liquid electrolyte, galvanostatic charge-discharge with different scan rates and electrochemical impedance measurements. The result of cyclic voltammetry indicated that the specific capacitance value of a carbon cryogel electrode was approximately 150.2 F/g (at 5 mV/s in 6M KOH electrolyte).

Laser dissect writing from copper(II) formate using Ar+ laser (아르곤 이온 레이저를 이용한 CU의 직접 쓰기 기술)

  • Lee, Hong-Kyu;Lee, Cheon
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2000.07a
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    • pp.663-666
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    • 2000
  • Laser direct writing of micro-patterned copper lines has been achieved by pyrolytic decomposition of copper formate films (Cu(HCOO)$_2$$.$4H$_2$O), as a precursor, using a focused Ar$\^$+/ laser beam ($\lambda$= 514 nm) on PCB boards and glass substrates. The linewidth and thickness of the lines were investigated as a function of laser power and scan speed. The profiles of the lines were measured by scanning electron microscope (SEM), surface profiler (${\alpha}$-step) and atomic force microscopy (AFM). The electrical resistivities of the patterned lines were also investigated as a function of laser parameter using probe station and semiconductor analyzer. we compared resistivities of the patterned lines with that of the Cu bulk, respectively.

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The singulation study of $\mu$-BGA(Ball Grid Array) board using a pulsed Nd:YAG laser (펄스 Nd:YAG 레이저를 이용한 $\mu$-BGA 기판의 개별칩 분리 연구)

  • Baek, Kwang-Yeol;Lee, Kyoung-Cheol;Lee, Choen
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2000.11a
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    • pp.524-527
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    • 2000
  • In this paper, we have studied minimization of the burr which occurred after $\mu$-BGA(ball grid array) singulation process, singulation of the multilayer with a pulsed Nd:YAG(266, 532 nm) laser is used to cut the metal layer which doesn't well absorb laser beam. Especially, the photoresist and $N_2$blowing is effective to minimize of the surface demage and burr. In this experiment, the $N_2$ blowing reduces a laser energy loss by debris and suppress a surface oxidation. The SEM(scanning electron microscopes) and non-contact 3D inspector are used to measure cutting line-width and surface demage. The $\mu$-BGA singulation threshold energy is 75.0 J/cm$^2$at 30 ${\mu}{\textrm}{m}$/s scan speed.

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