• Title/Summary/Keyword: SEM scan

Search Result 84, Processing Time 0.022 seconds

Scanning System Stability for Improving SEM Image (전자현미경의 이미지 향상을 위한 주사시스템의 안정성)

  • Kim, Seung-Jae;Kim, Dong-Hwan
    • Journal of the Korean Society of Manufacturing Technology Engineers
    • /
    • v.18 no.5
    • /
    • pp.455-461
    • /
    • 2009
  • In a scanning electron microscopy, image distortion is a critical issue and it is needed to be eliminated by some kinds of schemes. In this work, scanning frequency and scanning wave form are adjusted to have an improved image. The relationship between scan coil and its driver is investigated and appropriate frequency and wave form are suggested. It is proved that the selected frequency and wave form showed an enhanced image with less distortion, which were done by experiments. In addition, a noise elimination is addressed, providing improved image with a GROUND signal integration with the amplifier and the scan driver.

  • PDF

Realization for Each Element for capturing image in Scanning Electron Microscopy (주사 전자 현미경에서 영상 획득에 필요한 구성 요소 구현)

  • Lim, Sun-Jong;Lee, Chan-Hong
    • Laser Solutions
    • /
    • v.12 no.2
    • /
    • pp.26-30
    • /
    • 2009
  • Scanning Electron Microscopy (SEM) includes high voltage generator, electron gun, column, secondary electron detector, scan coil system and image grabber. Column includes electron lenses (condenser lens and objective lens). Condenser lens generates fringe field, makes focal length and control spot size. Focal length represents property of lens. Objective lens control focus. Most of the electrons emitted from the filament, are captured by the anode. The portion of the electron current that leaves the gun through the hole in the anode is called the beam current. Electron beam probe is called the focused beam on the specimen. Because of the lens and aperture, the probe current becomes smaller than the beam current. It generate various signals(backscattered electron, secondary electron) in an interaction with the specimen atoms. In this paper, we describe the result of research to develop the core elements for low-resolution SEM.

  • PDF

FE-SEM의 국산화 진행 현황 및 향후 기술 개발 전망

  • Gu, Jeong-Hoe
    • Proceedings of the Korean Vacuum Society Conference
    • /
    • 2014.02a
    • /
    • pp.107.2-107.2
    • /
    • 2014
  • 다양한 산업분야에서의 급격한 Packing Density 증가 추세로 인하여 영상분석기기 분야도 기술적으로 매우 진보되어왔다. 특히 전자현미경(SEM : Scanning Electron Microscope)은 반도체, 디스플레이 및 부품 소재의 고집적화와 더불어 기술의 발전 속도가 빠르게 이루어지고 있으며, 매우 고도화 되고 있다. 이에 따른 다양한 응용분야에서 전자현미경의 수요도 꾸준히 증가되고 있는 추세이다. 그러나 기초 과학기술을 기반으로 하는 전자현미경 산업분야는 높아진 국내 수요대비 자체 기술 발전이 미약한 실정이다. 이러한 현실속에서 국내 기술력으로 FE-SEM을 개발하였고 상용화를 눈앞에 두고 있다. 국산화된 FE-SEM은 Outer Lens방식으로 Schottky cathode와 60o conical Lens를 적용하여 고분해능을 구현함과 동시에 Scan generator, Auto-stepping및 Retarding 기능들도 추가 장착하여 제품경쟁력을 극대화 하고자 하였다. 본 발표는 개발된 FE-SEM의 기술적 특징과 개발 과정 및 결과를 소개하고자 하였다. 또한 해외 경쟁사들의 선행 기술동향 대비 현재 국내 기술 수준을 비교하여 향후 나아갈 방향을 고찰하고자 하였으며, 이를 기반으로 진행 중에 있는 초 저-가속전압 및 Semi In-Lens Optic구현을 위한 국내 기술개발 추진 현황도 간략하게 논하고자 한다. 이러한 고찰을 통하여 해외 선진 경쟁사 대비 후 발업체로써 낙후되어있는 국내기술의 격차를 빠르게 좁혀 나아가고 Global 경쟁력을 갖춘 제품을 구현하기 위하여 국내 전문가들과의 협력을 통한 선행 요소기술 및 차별화된 제품기술 확보 방법을 강구하고자 한다.

  • PDF

Unit-Rectangle Exposure Method for Advanced Through-put in Electron-Beam Direct Writing Lithography (전자선 직접묘사에서 Through-put이 향상된 단위 矩形묘사방법)

  • Park, Sun-Woo;Kim, Chul-Ju
    • Journal of the Korean Institute of Telematics and Electronics
    • /
    • v.26 no.2
    • /
    • pp.112-117
    • /
    • 1989
  • This paper describes to the unit rectangle EB direct writing lithography method using SEM. This method has the constant exposure time to any rectangle pattern. In order to change the EB current according to various rectangle size for the constant exposure time, the supply current of condenser lens in controlled by BITMAP-IV CAD system. By this method, the resizing procedure of density pattern area is not needed to pattern data conversion, and the through-put ofr exposure is increased about 172 times compared with the unit scan exposure method.

  • PDF

A Study on the Fabrication $Na_0.5$$K_0.5$$NbO_3$ Volatile Material Thin Film by Pulsed Laser Deposition and he Confirmation of C-axis Orientation by X-ray Diffraction (PLD 기법에 의한 $Na_0.5$$K_0.5$$NbO_3$ 휘발성 물질의 박막 제작 및 XRD에 의한 c축 배향성 확인에 관한 연구)

  • 최원석;김장용;장철순;문병무
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.14 no.4
    • /
    • pp.269-273
    • /
    • 2001
  • W fabricated thin film using Na$_{0.5}$K$_{0.5}$NbO$_3$ volatile material by pulsed laser deposition (PLD) and studied characterization from EM, XRD, P-E. The density and scale of droplet, which is the defect of PLD, was investigated by SEM but large droplet was not found. The degree of assemble oriented C-axis measured with X-ray diffraction suggests that this film oriented C-axis achieved by $\theta$-2$\theta$ scan and rocking curves shows good self-assemble phenomenon, finally $\phi$-scan does that all of the four directions of the lattice in film equals to those of substrate. P-E hysteresis loop shows residual remnant polarization or saturation polarization value, but it is applicable to memories.ies.

  • PDF

Seasonal Characterization of Particles in Busan Area (부산지역 먼지입자의 계절별 특성)

  • Kang Shin-Mook;Cho Jeong-Goo
    • Journal of environmental and Sanitary engineering
    • /
    • v.20 no.3 s.57
    • /
    • pp.17-26
    • /
    • 2005
  • Many researches were focused on the data which obtained from chemical bulk analysis. It is difficult to evaluate source contribution by wet type chemical bulk analysis. In this study, we have reviewed the characterization of individual particle for source identification. We analyzed by SEM/EDX methods. We have obtained average geometric particle diameter measured by optical diameter which were resulted from SEM/EDX image scan, representative physical diameter of individual particle was $3.38\;{\mu}m\;in\;A,\;3.67\;{\mu}m\;in\;B$. In the result of image analysis at each spots particles, both samples non-sphere shapes, C-rich particles. In consequence of chemical analysis of individual particle, each sampling sites some elements.

Development of Controller for Optimal Beam Scanning in E-Beam Manufacture System (전자빔 가공기에서 최적 빔 주사를 위한 제어기의 개발)

  • Lim S.J.;Lee C.H.;Kang J.H.
    • Proceedings of the Korean Society of Precision Engineering Conference
    • /
    • 2005.10a
    • /
    • pp.154-157
    • /
    • 2005
  • The use of electron-beam(E-Beam) manufacture systems provides a means to alleviate optic exposure equipment's problems. We designed an E-beam manufacture system with SEM function. Optimal beam scanning is one of the most important conditions in the performance of E-beam and SEM. The performance of E-beam manufacture system and images of SEM are a close affinity with each other. Developed E-beam manufacture system consist of the controllers of high voltage, scanning, optic and high voltage generator. In this paper, we analyze the condition of steady beam scanning and describe the development of controller fer optimal beam scanning.

  • PDF

Texture and surface analysis of NiO prepared on biaxially textured Ni substrates by MOCVD method (2축 정렬된 Ni 선재 위에 MOCVD법에 의한 NiO의 조직 및 표면 분석)

  • 선종원;김형섭;지봉기;박해웅;홍계원;박순동;정충환;전병혁;김찬중
    • Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
    • /
    • 2002.02a
    • /
    • pp.119-122
    • /
    • 2002
  • The NiO buffer layers for YBCO coated conductor were prepared on textured Ni substrates by MOCVD method and the degree of texturizing and the surface roughness were analyzed X-ray pole figure and AFM and SEM. Processing variables were oxygen partial pressure and substrate temperature. (200) textured NiO layer was formed at 450~$470^{\circ}C$ and oxygen partial pressure of 1.67 Torr. Out-of-plane($\omega$-scan) and in-plane($\Phi$-scan) texture were $10.34^{\circ}$ and $10.00^{\circ}$ respectively. The surface roughness estimated by atomic force microscopy was in the range of 3.1~4.6 nm.

  • PDF

초소형 전자컬럼에서 제어용 전압의 잡음 분석

  • No, Yeong-Seop;Kim, Heung-Tae;Kim, Jin-Bae;O, Tae-Sik;Kim, Dae-Uk;Kim, Ho-Seop
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2009.06a
    • /
    • pp.473-474
    • /
    • 2009
  • A miniaturized electrostatic column consists of a set of scan-deflector and lens components. Electrical noises of scan-deflectors have been classified by the applied voltage, and analyzed the noise effects of electron beam passing through the deflectors.

  • PDF