• Title/Summary/Keyword: Run-to-run (R2R) controller

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Design of fuzzy logic Run-by-Run controller for rapid thermal precessing system (고속 열처리공정 시스템의 퍼지 Run-by-Run 제어기 설계)

  • Lee, Seok-Joo;Woo, Kwang-Bang
    • Journal of Institute of Control, Robotics and Systems
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    • v.6 no.1
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    • pp.104-111
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    • 2000
  • A fuzzy logic Run-by-Run(RbR) controller and an in -line wafer characteristics prediction scheme for the rapid thermal processing system have been developed for the study of process repeatability. The fuzzy logic RbR controller provides a framework for controlling a process which is subject to disturbances such as shifts and drifts as a normal part of its operation. The fuzzy logic RbR controller combines the advantages of both fuzzy logic and feedback control. It has two components : fuzzy logic diagnostic system and model modification system. At first, a neural network model is constructed with the I/O data collected during the designed experiments. The wafer state after each run is assessed by the fuzzy logic diagnostic system with featuring step. The model modification system updates the existing neural network process model in case of process shift or drift, and then select a new recipe based on the updated model using genetic algorithm. After this procedure, wafer characteristics are predicted from the in-line wafer characteristics prediction model with principal component analysis. The fuzzy logic RbR controller has been applied to the control of Titanium SALICIDE process. After completing all of the above, it follows that: 1) the fuzzy logic RbR controller can compensate the process draft, and 2) the in-line wafer characteristics prediction scheme can reduce the measurement cost and time.

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Recursive Least Squares Run-to-Run Control with Time-Varying Metrology Delays

  • Fan, Shu-Kai;Chang, Yuan-Jung
    • Industrial Engineering and Management Systems
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    • v.9 no.3
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    • pp.262-274
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    • 2010
  • This article investigates how to adaptively predict the time-varying metrology delay that could realistically occur in the semiconductor manufacturing practice. Metrology delays pose a great challenge for the existing run-to-run (R2R) controllers, driving the process output significantly away from target if not adequately predicted. First, the expected asymptotic double exponentially weighted moving average (DEWMA) control output, by using the EWMA and recursive least squares (RLS) prediction methods, is derived. It has been found that the relationships between the expected control output and target in both estimation methods are parallel, and six cases are addressed. Within the context of time-varying metrology delay, this paper presents a modified recursive least squares-linear trend (RLS-LT) controller, in combination with runs test. Simulated single input-single output (SISO) R2R processes subject to various time-varying metrology delay scenarios are used as a testbed to evaluate the proposed algorithms. The simulation results indicate that the modified RLS-LT controller can yield the process output more accurately on target with smaller mean squared error (MSE) than the original RLSLT controller that only deals with constant metrology delays.

Advanced Process Control of the Critical Dimension in Photolithography

  • Wu, Chien-Feng;Hung, Chih-Ming;Chen, Juhn-Horng;Lee, An-Chen
    • International Journal of Precision Engineering and Manufacturing
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    • v.9 no.1
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    • pp.12-18
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    • 2008
  • This paper describes two run-to-run controllers, a nonlinear multiple exponential-weight moving-average (NMEWMA) controller and a dynamic model-tuning minimum-variance (DMTMV) controller, for photolithography processes. The relationships between the input recipes (exposure dose and focus) and output variables (critical dimensions) were formed using an experimental design method, and the photolithography process model was built using a multiple regression analysis. Both the NMEWMA and DMTMV controllers could update the process model and obtain the optimal recipes for the next run. Quantified improvements were obtained from simulations and real photolithography processes.

An Evaluation of Multiple-input Dual-output Run-to-Run Control Scheme for Semiconductor Manufacturing

  • Fan, Shu-Kai-S.;Lin, Yen
    • Industrial Engineering and Management Systems
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    • v.4 no.1
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    • pp.54-67
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    • 2005
  • This paper provides an evaluation of an optimization-based, multiple-input double-output (MIDO) run-to-run (R2R) control scheme for general semiconductor manufacturing processes. The controller in this research, termed adaptive dual response optimizing controller (ADROC), can serve as a process optimizer as well as a recipe regulator between consecutive runs of wafer fabrication. In evaluation, it is assumed that the equipment model could be appropriately described by a pair of second-order polynomial functions in terms of a set of controllable variables. Of practical relevance is to consider a drifting effect in the equipment model since in common semiconductor practice the process tends to drift due to machine aging and tool wearing. We select a typical application of R2R control to chemical mechanical planarization (CMP) in semiconductor manufacturing in this evaluation, and there are five different CMP process scenarios demonstrated, including mean shift, variance increase, and IMA disturbances. For the controller, ADROC, an on-line estimation technique is implemented in a self-tuning (ST) control manner for the adaptation purpose. Subsequently, an ad hoc global optimization algorithm based on the dual response approach, arising from the response surface methodology (RSM) literature, is used to seek the optimum recipe within the acceptability region for the execution of next run. The main components of ADROC are described and its control performance is assessed. It reveals from the evaluation that ADROC can provide excellent control actions for the MIDO R2R situations even though the process exhibits complicated, nonlinear interaction effects between control variables, and the drifting disturbances.

A Simulation study of EWMA control using dynamic control parameter (동적 모수를 사용한 EWMA 제어의 시뮬레이션 연구)

  • Kang, Seok-Chan;Hwang, Ji-Bin;Kim, Sung-Shick;Kim, Ji-Hyun
    • Journal of the Korea Society for Simulation
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    • v.16 no.2
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    • pp.37-44
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    • 2007
  • EWMA is one of the most popular controller method used in Run-to-Run control system for semiconductor manufacturing. The value of the control parameter in EWMA has major effect on the result. Therefore, it is important to use control parameter value fitting for the process state. When the process is unstable, it is more efficient to change EWMA control parameter dynamically to compensate for the changing process state than using fixed control parameter. In this paper, we review previous studies using dynamic EWMA control parameter and propose a new algorithm complementing the weaknesses of the previous studies. The performance of the proposed algorithm is validated using simulation.

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