• Title/Summary/Keyword: Roughness parameter

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Hybrid complementary circuits based on organic/inorganic flexible thin film transistors with PVP/Al2O3 gate dielectrics

  • Kim, D.I.;Seol, Y.G.;Lee, N.E.;Woo, C.H.;Ahn, C.H.;Ch, H.K.
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.02a
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    • pp.479-479
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    • 2011
  • Flexible inverters based on complementary thin-film transistor (CTFTs) are important because they have low power consumption and other advantages over single type TFT inverters. In addition, integrated CTFTs in flexible electronic circuits on low-cost, large area and mechanically flexible substrates have potentials in various applications such as radio-frequency identification tags (RFIDs), sensors, and backplanes for flexible displays. In this work, we introduce flexible complementary inverters using pentacene and amorphous indium gallium zinc oxide (IGZO) for the p-channel and n-channel, respectively. The CTFTs were fabricated on polyimide (PI) substrate. Firstly, a thin poly-4-vinyl phenol (PVP) layer was spin coated on PI substrate to make a smooth surface with rms surface roughness of 0.3 nm, which was required to grow high quality IGZO layers. Then, Ni gate electrode was deposited on the PVP layer by e-beam evaporator. 400-nm-thick PVP and 20-nm-thick ALD Al2O3 dielectric was deposited in sequence as a double gate dielectric layer for high flexibility and low leakage current. Then, IGZO and pentacene semiconductor layers were deposited by rf sputter and thermal evaporator, respectively, using shadow masks. Finally, Al and Au source/drain electrodes of 70 nm were respectively deposited on each semiconductor layer using shadow masks by thermal evaporator. Basic electrical characteristics of individual transistors and the whole CTFTs were measured by a semiconductor parameter analyzer (HP4145B, Agilent Technologies) at room temperature in the dark. Performance of those devices then was measured under static and dynamic mechanical deformation. Effects of cyclic bending were also examined. The voltage transfer characteristics (Vout- Vin) and voltage gain (-dVout/dVin) of flexible inverter circuit were analyzed and the effects of mechanical bending will be discussed in detail.

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Biological Applications of White Light Scanning Interferometry (백색광 주사간섭계의 생물학적 응용)

  • Kim, Ki-Woo
    • Applied Microscopy
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    • v.41 no.4
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    • pp.223-228
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    • 2011
  • White light scanning interferometry has been employed to analyze surface features of diverse specimens. Long established in the field of materials engineering, the technique provides quantitative three-dimensional data as well as qualitative morphological images. It uses white light that is split and reflected from a reference mirror and an object. Merged together, the light generates interference patterns representing topographical contours of the object surface. The amplitude of the z-axis data is differentiated by gray scale. The technique allows the rapid, noncontact, and wide-field measurements for morphometry of biological specimens including chondrocytes, tooth enamel, and plant leaves. Quantification of the dimension of surface structures such as width, length, and elevation angle could be achievable by white light scanning interferometry. The light reflection from plant leaves has been assumed to be sufficient for the technique. Without special specimen preparations like conductive metal coating, the technique can be increasingly used for quantitative three-dimensional surface measurements of biological specimens.

Thickness Dependence of Ultraviolet-excited Photoluminescence Efficiency of Lumogen Film Coated on Charge-coupled Device

  • Tao, Chunxian;Ruan, Jun;Shu, Shunpeng;Lu, Zhongrong;Hong, Ruijin;Zhang, Dawei;Han, Zhaoxia
    • Current Optics and Photonics
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    • v.1 no.4
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    • pp.284-288
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    • 2017
  • In order to investigate the ultraviolet-excited photoluminescence properties of phosphor coatings and their relationship to thickness, Lumogen coatings with different thicknesses were deposited on quartz substrates and charge-coupled device chips by thermal evaporation. The variation of the film thickness affected the crystallite size, surface roughness and fluorescence signal. It was found that the Lumogen coating with the thickness of 420 nm has the largest luminescent signal and conversion efficiency, and the corresponding coated charge-coupled devices had the maximum quantum efficiency in the ultraviolet. These results provided one key parameter for improving the sensitivity of Lumogen coated charge-coupled devices to ultraviolet light.

Analysis of Kinetic Parameter Effects on Printing Property in Micro-Contact Printing of Ag Ink (Ag 잉크의 미세접촉인쇄에 있어서 동역학적 파라미터가 인쇄특성에 미치는 영향 분석)

  • Park, Sung-Ryool;Song, Chung-Kun
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.47 no.2
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    • pp.7-14
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    • 2010
  • This paper describes the effects of kinetic parameters such as attaching speed, attaching time, and dettaching speed on printing property of electrodes which were fabricated by micro-contact printing with Ag ink. In inking process the attaching speed was preferable to be less than 1 mm/s, attaching time as short as possible, and detaching speed larger than 1000 mm/s in order to obtain the transfer ratio of ink larger than 98%. Meanwhile in printing process the parameters were totally opposite to the results of inking process; attaching speed larger than 100 mm/s, attaching time larger than 30 sec, and detaching speed less than 1 mm/s for the best results. With the parameters we could obtain the micro-contact printed electrodes with the minimum line width of $30\;{\mu}m$, thickness of 300~500 nm, roughness less than 50 nm, and resistivity of about $15{\sim}16{\mu\Omega\cdot}cm$.

The Properties of $Bi_2Mg_{2/3}Nb_{4/3}O_7$ Thin Films Deposited on Copper Clad Laminates For Embedded Capacitor (임베디드 커패시터의 응용을 위해 CCL 기판 위에 평가된 BMN 박막의 특성)

  • Kim, Hae-Won;Ahn, Jun-Ku;Ahn, Kyeong-Chan;Yoon, Soon-Gil
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.06a
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    • pp.45-45
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    • 2007
  • Capacitors among the embedded passive components are most widely studied because they are the major components in terms of size and number and hard to embed compared with resistors and inductors due to the more complicated structure. To fabricate a capacitor-embedded PCB for in-line process, it is essential to adopt a low temperature process (<$200^{\circ}C$). However, high dielectric materials such as ferroelectrics show a low permittivity and a high dielectric loss when they are processed at low temperatures. To solve these contradicting problems, we studied BMN materials as a candidate for dielectric capacitors. processed at PCB-compatible temperatures. The morphologies of BMN thin films were investigated by AFM and SEM equipment. The electric properties (C-F, I-V) of Pt/BMN/Cu/polymer were evaluated using an impedance analysis (HP 4194A) and semiconductor parameter analyzer (HP4156A). $Bi_2Mg_{2/3}Nb_{4/3}O_7$(BMN) thin films deposited on copper clad laminate substrates by sputtering system as a function of Ar/$O_2$ flow rate at room temperature showed smooth surface morphologies having root mean square roughness of approximately 5.0 nm. 200-nm-thick films deposited at RT exhibit a dielectric constant of 40, a capacitance density of approximately $150\;nF/cm^2$, and breakdown voltage above 6 V. The crystallinity of the BMN thin films was studied by TEM and XRD. BMN thin film capacitors are expected to be promising candidates as embedded capacitors for printed circuit board (PCB).

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Modeling of the Conditioning Process in Chemical Mechanical Polishing (컨디셔닝 공정의 수학적 모델링)

  • Chang, One-Moon;Park, Ki-Hyun;Lee, Hyun-Seop;Jung, Won-Duck;Park, Sung-Min;Park, Boum-Young;Seo, Heon-Deok;Kim, Hyoung-Jea;Jeong, Hae-Do
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2006.06a
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    • pp.569-570
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    • 2006
  • The conditioning process is very important process for the CMP (Chemical Mechaning Polishing). This process regenerates the roughness of the polishing pad during the CMP process, increases the MRR (Material Removal Rate) and gives us longer pad life so conditioning process is essential for the CMP, and conditioning process influences the polishing pad shape gradually. Conditining process is related to the Non-Uniformity. In This paper, Kinematic of the conditioning process and mathematic modeling of the pad wear is studied and result shows how the various parameters influence the pad shape and WIWNU[1]. Consequently through these parameter, optimal design of the conditioning process equipment is predicted.

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Impact of Energy Density and Bead Overlap Ratio of a SUS316L Specimen Fabricated using Selective Laser Melting on Mechanical Characteristics (선택적 레이저 용융 공정으로 제작된 시편의 SUS316L 에너지밀도 및 비드 중첩률에 따른 기계적 특성 변화 분석)

  • Lee, Dong Wook;Kim, Woo Sung;Sung, Ji Hyun;Kim, Cheol;Lee, Ho Jin
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.20 no.8
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    • pp.42-51
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    • 2021
  • Investigations of process parameters are essential when fabricating high-quality parts using additive manufacturing. This study investigates the change in the mechanical characteristics of a SUS316L specimen fabricated using selective laser melting based on the energy density and bead overlap ratio. The SUS316L powder particles were spherical and 35 ㎛ in size. Single-bead and hexahedral shape deposition experiments were performed sequentially. A single bead experiment was performed to obtain the bead overlap ratios for different laser parameters utilizing laser power and scan speed as experimental parameters. A hexahedral shape deposition experiment was also performed to observe the difference in mechanical properties, such as the internal porosity, surface roughness, and hardness, based on the energy density and bead overlap ratio of the three-dimensional printed part. Laser power, scan speed, overlap ratio, and layer thickness were chosen as parameters for the hexahedral shape deposition experiment. Accordingly, the energy density applied for three-dimensional printing, and the experimental parameters were calculated, and the energy density and bead overlap ratio for fabricating parts with good properties have been suggested.

A compensation method for the scaling effects in the simulation of a downburst-generated wind-wave field

  • Haiwei Xu;Tong Zheng;Yong Chen;Wenjuan Lou;Guohui Shen
    • Wind and Structures
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    • v.38 no.4
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    • pp.261-275
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    • 2024
  • Before performing an experimental study on the downburst-generated wave, it is necessary to examine the scale effects and corresponding corrections or compensations. Analysis of similarity is conducted to conclude the non-dimensional force ratios that account for the dynamic similarity in the interaction of downburst with wave between the prototype and the scale model, along with the corresponding scale factors. The fractional volume of fluid (VOF) method in association with the impinging jet model is employed to explore the characteristics of the downburst-generated wave numerically, and the validity of the proposed scaling method is verified. The study shows that the location of the maximum radial wind velocity in a downburst-wave field is a little higher than that identified in a downburst over the land, which might be attributed to the presence of the wave which changes the roughness of the underlying surface of the downburst. The impinging airflow would generate a concavity in the free surface of the water around the stagnation point of the downburst, with a diameter of about two times the jet diameter (Djet). The maximum wave height appears at the location of 1.5Djet from the stagnation point. Reynolds number has an insignificant influence on the scale effects, in accordance with the numerical investigation of the 30 scale models with the Reynolds number varying from 3.85 × 104 to 7.30 × 109. The ratio of the inertial force of air to the gravitational force of water, which is denoted by G, is found to be the most significant factor that would affect the interaction of downburst with wave. For the correction or compensation of the scale effects, fitting curves for the measures of the downburst-wave field (e.g., wind profile, significant wave height), along with the corresponding equations, are presented as a function of the parameter G.

A Study for Predicting Adfreeze Bond Strength from Shear Strength of Frozen Soil (동결토 전단강도를 활용한 동착강도 산정에 관한 연구)

  • Choi, Chang-Ho;Ko, Sung-Gyu
    • Journal of the Korean Geotechnical Society
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    • v.27 no.10
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    • pp.13-23
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    • 2011
  • Bearing capacity of pile foundations in cold region is dominated by adfreeze bond strength between surrounding soil and pile perimeter. It denotes that adfreeze bond strength is the most important design parameter for foundations in cold region. Adfreeze bond strength is affected by various factors like 'soil type', 'frozen temperature', 'normal stress acting on soil/pile interface', 'loading rate', 'roughness of pile surface', etc. Several methods have already been proposed to estimate adfreeze bond strength during past 50 years. However, most methods have not considered the effect of normal stress for adfreeze bond strength. In this study, both freezing temperature and normal stress have been controlled as primary factors affecting adfreeze bond strength. A direct shear box was used to measure adfreeze bond strength between sand and aluminum under different temperature conditions. Based on the test results, the relation between shear strength of frozen sand and adfreeze bond strength have been investigated. The test results showed that both of shear strength and adfreeze bond strength tend to increase with decreasing frozen temperature or increasing confining pressure. The ratio of shear strength and adfreeze bond strength, expressed as $r_s$, decreased initially frozen section but increased at much lower frozen temperature and there were uniform intervals under the different normal stress conditions. A method for predicting adfreeze bond strength using $r_s$ has finally been proposed in this study.

Parameter estimations to improve urban planning area runoff prediction accuracy using Stormwater Management Model (SWMM) (SWMM을 이용한 도시계획지역 유출량 예측 정확도 향상을 위한 매개변수 산정)

  • Koo, Young Min;Seo, Dongil
    • Journal of Korea Water Resources Association
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    • v.50 no.5
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    • pp.303-313
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    • 2017
  • In environmental impact assessments for large urban development projects, the Korean government requires analysis of stormwater runoff before, during and after the projects. Though hydrological models are widely used to analyze and prepare for surface runoff during storm events, accuracy of the predicted results have been in question due to limited amount of field data for model calibrations. Intensive field measurements have been made for storm events between July 2015 and July 2016 at a sub-basin of the Gwanpyung-cheon, Daejeon, Republic of Korea using an automatic monitoring system and also additional manual measurements. Continuous precipitation and surface runoff data used for utilization of SWMM model to predict surface runoff during storm events with improved accuracy. The optimal values for Manning's roughness coefficient and values for depression storage were estimated for pervious and impervious surfaces using three representative infiltration methods; the Curve Number Methods, the Horton's Method and the Green-Ampt Methods. The results of the research is expected to be used more efficiently for urban development projects in Korea.