• 한국공작기계학회논문집
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• 제11권4호
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• pp.75-81
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• 2002

In this study, experiments were carried out to investigate the characteristics of grinding and wear process of diamond wheel during grinding ceramic materials. Normal component of grinding resistance was decreasing while increase of spindle speed. The resistance of vitrified bond wheel was less then that of resinoid bond wheel because of imbedded large holes on the surface of cutting edge. Surface roughness was decreasing while increase of spindle speed. The surface roughness using vitrified bond wheel was less than that of resinoid bond wheel because of small elastic deformation. After continuous finding of ceramics, cutting edge ratio of resinoid bond wheel decreased. For the case of vitrified bond wheel, cutting edge ratio did not change.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2001년도 추계학술대회(한국공작기계학회)
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• pp.344-348
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• 2001

In this study, experiments were carried out to investigate the characteristics of grinding and wear process of diamond wheel grinding ceramic materials. Normal component of grinding resistance was decreasing while increase of spindle speed. The resistance of vitrified bond wheel was less then that of resinoid bond wheel because of imbedded large holes on the surface of cutting edge. Surface roughness was decreasing while increase of spindle speed. The surface roughness after using vitrified bond wheel was less than that of resinoid bond wheel because of small elastic deformation. After continuous grinding of ceramics, cutting edge ratio of resinoid bond wheel decreases. For the case of vitrified bond wheel, cutting edge ratio does not change.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1997년도 추계학술대회 논문집
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• pp.870-874
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• 1997

Super-abrasives such as diamond and CBN have used to maintain accuracy and form deviation for superalloy etc. This study contains the dry cylindrical grinding of metals with resinoid-bond CBN wheel. For various conditions of grinding speed, workpiece speed, grinding depth and feed speed of table, the grinding resistance and the surface roughness are measured and discussed. The results are as follows.

• 대한기계학회논문집
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• 제12권2호
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• pp.241-251
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• 1988

본 연구에서는 숫돌입자, 결합자 및 기공으로 조성된 연삭숫돌의 구조를 다공질 포성체로 보고, WA계 비트리파이드(vitrified) 및 레지노이드(resinoid) 결합자의 연삭숫돌시험편에 대하여 AE 계측방법을 이용한 인장, 압축, 굽힘 및 압렬시험을 실시하여 Babel과 Sines의 2축응력장해소이론과 연삭숫돌의 파괴조건을 관련시켜 평가함과 동시에, 이 때 검출되는 AE 신호 처리 파라미터(Parameter) 로부터 연삭숫돌의 자인자가 파괴강도 및 AE특성에 미치는 영향을 구명하여 파괴의 예지및 연삭숫돌수명의 예측가능성등의 파괴강도특성을 평가고찰하였다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2001년도 춘계학술대회 논문집
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• pp.925-929
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• 2001

Ultra-abrasives such as diamond and CBN have used to maintain accuracy and form deviation for superalloy etc. This study contains the dry cylindrical grinding of metals with Vitrified-bond CBN wheel and Resinoid-bond CBN wheel. For various conditions of grinding speed, workpiece speed, grinding depth and feed speed of table, the grinding resistance, the surface roughness, and the material removal are measured and discussed.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2001년도 춘계학술대회 논문집(한국공작기계학회)
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• pp.315-320
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• 2001

Ultra-abrasives such as diamond and CBN have used to maintain accuracy and form deviation for superalloy etc. This study contains the dry cylindrical grinding of metals with Vitrified-bond CBN wheel and Resinoid-bond CBN wheel. For various condition of grinding speed, workpiece speed, grinding depth and feed speed of table, the grinding resistance, the surface roughness, and material removal are measured and discussed.

• 한국정밀공학회지
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• 제12권9호
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• pp.74-85
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• 1995

The purpose of this paper is to evaluate the grade of WA vitrified and resinoid bond grinding wheels by the sue of AE measuring system. When the manufactured 48 kinds of specimens were scratched by the method of OKOSHI'S grade test, the relationship between the amount of bit scratch depth of grinding wheel specimens and the character- istics of AE signals, and the relationship of AE counts and grade were considered as fololws; (1) The higher the grades are AE cumlulative event counts N and AE event count rate n, the smaller the values tend to be. But A $E_{rms}$is in reverse. (2) In the case of same grade, the smaller the grain size is, the higher the value of AE cumulative event counts N and A $E_{rms}$is results of comparison and observation. The grinding wheel with lower elasticity and with higher percentage of pore detected higher value of AE cumula- tive event counts N than with higher elasticity and lower percentage of pore. But A $E_{rms}$ is in reverse. (3) AE cumulative event counts N and bit scratch depth h have normally one to one correspondence. (4) It can be expected that quantitative evaluations of grade by using AE have been carried out by the wave observation of AE signal in line with the relationship between load speed of bit and AE cumulative event counts N & AE event count rate n.' AE event count rate n.ate n.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1995년도 춘계학술대회 논문집
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• pp.124-130
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• 1995

연삭작업에 있어서 요구되는 가공능률과 가공정밀도를 얻기 위해서는 적절한 결합도를 갖는 연삭숫돌을 선택하 는 것이 중요한 요건이 된다. 본 연구에서는 결합도를 평가하기 위한 일정한 기준을 설정할 목적으로 AE계측 시스템을 이용하여 대월식결합도시험방법에 따라 연삭숫돌표면의 일부를 파괴시켰을 때 발생되는 AE신호를 검출 하고 연삭숫돌의 파괴량과 AE 신호특성과의 관계 및 AE를 이용한 결합도평가의 가능성을 검토하였다.

• 한국정밀공학회지
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• 제12권4호
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• pp.100-110
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• 1995

This paper aims at reviewing the possibility of application over normal or abnormal, detection used by AE, and the characteristics of grinding processes. In this study, when WA-vitri-fied ' resinoid bond grinding wheels:36 kinds of grinding wheel and grinding depth were tuned at the surface grinding, the zone of AE signal generation is theoretically modelled and reviewed by grinding processes. The variation of grinding resistance( F$n^{9}$ $F_{t}$) and AE signal is detected in-process by the use of AE measuring system. The tests are carried out in accordance with grain size and grade of grinding wheels, and work-pieces-STD11 and STD61. According to the experiment's results, the following can be expected;as grinding time passes by, the relation of grinding depth and quantity of AE signal, observing on AE signal and grinding burn suggest the characteristics of grinding processes and evalution on the possibility of control of grinding machine, and monitoring abnormal conditions.e, and monitoring abnormal conditions.