• 한국주조공학회지
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• 제11권4호
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• pp.303-313
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• 1991

The Purification mechanism of high purity aluminum was studied through the variation of stirring speed and coolant flow rate in the stirring method. In the stirring method the degree of purification was changed as the following factors;the variation of diffusion boundary layer thickness the variation of growth rate and the solute concentration of the residual melt. The concentration of Fe and Si was decreased as the stirring speed and the radial distance increased. In a high stirring speed of 2000rpm with unidirectional stirring mode, the uniformity of solutes was obtained. On the other hand, the purification of Si was done by the combinations of stirring method, fractional melting and acid leaching. In the case of Si purification, the centrifugal force developed in the melt acted as the significant purification factor. It was possible to obtain the purified 3N grade Si crystal after the complete elimination of residual aluminum by fractional melting and acid leaching.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.183-184
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• 2013

Two main MBE growth techniques have been used: plasma-assisted MBE (PA-MBE), which utilizes a rf plasma to supply active nitrogen, and ammonia MBE, in which nitrogen is supplied by pyrolysis of NH3 on the sample surface during growth. PA-MBE is typically performed under metal-rich growth conditions, which results in the formation of gallium droplets on the sample surface and a narrow range of conditions for optimal growth. In contrast, high-quality GaN films can be grown by ammonia MBE under an excess nitrogen flux, which in principle should result in improved device uniformity due to the elimination of droplets and wider range of stable growth conditions. A drawback of ammonia MBE, on the other hand, is a serious memory effect of NH3 condensed on the cryo-panels and the vicinity of heaters, which ruins the control of critical growth stages, i.e. the native oxide desorption and the surface reconstruction, and the accurate control of V/III ratio, especially in the initial stage of seed layer growth. In this paper, we demonstrate that the reliable and reproducible growth of GaN on Si (110) substrates is successfully achieved by combining two MBE growth technologies using rf plasma and ammonia and setting a proper growth protocol. Samples were grown in a MBE system equipped with both a nitrogen rf plasma source (SVT) and an ammonia source. The ammonia gas purity was ＞99.9999% and further purified by using a getter filter. The custom-made injector designed to focus the ammonia flux onto the substrate was used for the gas delivery, while aluminum and gallium were provided via conventional effusion cells. The growth sequence to minimize the residual ammonia and subsequent memory effects is the following: (1) Native oxides are desorbed at $750^{\circ}C$ (Fig. (a) for [$1^-10$] and [001] azimuth) (2) 40 nm thick AlN is first grown using nitrogen rf plasma source at $900^{\circ}C$ nder the optimized condition to maintain the layer by layer growth of AlN buffer layer and slightly Al-rich condition. (Fig. (b)) (3) After switching to ammonia source, GaN growth is initiated with different V/III ratio and temperature conditions. A streaky RHEED pattern with an appearance of a weak ($2{\times}2$) reconstruction characteristic of Ga-polarity is observed all along the growth of subsequent GaN layer under optimized conditions. (Fig. (c)) The structural properties as well as dislocation densities as a function of growth conditions have been investigated using symmetrical and asymmetrical x-ray rocking curves. The electrical characteristics as a function of buffer and GaN layer growth conditions as well as the growth sequence will be also discussed. Figure: (a) RHEED pattern after oxide desorption (b) after 40 nm thick AlN growth using nitrogen rf plasma source and (c) after 600 nm thick GaN growth using ammonia source for (upper) [110] and (lower) [001] azimuth.

• 비파괴검사학회지
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• 제24권6호
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• pp.573-580
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• 2004

본 연구는 cMUT 제작을 위한 미세공정기술을 개발하기 위하여 수행되었다. 이를 위하여 외국의 관련 제조공정 연구결과들을 분석하였다. cMUT 제작의 주요 공정인 미소 진동 박막 형성, 희생층 형성, 식각 공정에 대한 실험을 수행하여 적절한 공정조건을 찾고자 하였다. 각 제작 공정조건들을 변화시켜 가면서 증착된 실리콘 질화막의 두께, 균일도, 잔류응력을 측정하였다. 희생층으로서 실리콘 산화막의 공정조건을 변화시켜 가면서 산화막의 성장률을 분석하였다. 마지막으로 희생층 식각을 위한 최적 식각공정을 얻기 위한 실험을 수행하였다. 본 연구에서 얻어진 주요 미세공정 조건은 추후 cMUT 제작에 적용될 예정이다.

• 공업화학
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• 제33권5호
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• pp.459-465
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• 2022

천연 흑연의 전기화학적 특성 향상을 목적으로 피치 코팅을 실시하였다. 최적 코팅용 피치의 합성조건을 알아보기 위해 다양한 온도에서 합성된 피치를 코팅하여 음극 특성을 알아보았다. 합성온도가 증가할수록 연화점, 잔탄율이 증가하며 열적 안정성이 높아졌으나, 430 ℃에서는 과한 축합반응으로 NI (NMP Insoluble)가 다량 합성되었다. 높은 열적 안정성으로 표면의 균일도와 코팅 두께가 증가함에 따라 제조된 음극재의 향상된 초기쿨롱효율과 출력특성의 결과를 얻을 수 있었다. 하지만 과한 NI가 함유된 피치로 코팅한 음극재는 코팅이 실시되지 않은 흑연보다 저하된 전기화학 특성을 나타냈다. NI는 분산성이 낮고 열처리 후 구체 형성의 영향으로 불균일한 SEI층 형성에 기인한다는 결과를 얻을 수 있었다. 피치 합성온도를 제어하여 균일한 표면과 적절한 코팅층 형성이 이루어지는 최적 조건을 도출하였다.